JPS5915488B2 - 半導体装置の製法 - Google Patents

半導体装置の製法

Info

Publication number
JPS5915488B2
JPS5915488B2 JP50036196A JP3619675A JPS5915488B2 JP S5915488 B2 JPS5915488 B2 JP S5915488B2 JP 50036196 A JP50036196 A JP 50036196A JP 3619675 A JP3619675 A JP 3619675A JP S5915488 B2 JPS5915488 B2 JP S5915488B2
Authority
JP
Japan
Prior art keywords
semiconductor
support plate
semiconductor wafer
pellets
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP50036196A
Other languages
English (en)
Japanese (ja)
Other versions
JPS51110970A (en
Inventor
将昭 貞森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50036196A priority Critical patent/JPS5915488B2/ja
Publication of JPS51110970A publication Critical patent/JPS51110970A/ja
Publication of JPS5915488B2 publication Critical patent/JPS5915488B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Bipolar Transistors (AREA)
  • Die Bonding (AREA)
JP50036196A 1975-03-25 1975-03-25 半導体装置の製法 Expired JPS5915488B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50036196A JPS5915488B2 (ja) 1975-03-25 1975-03-25 半導体装置の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50036196A JPS5915488B2 (ja) 1975-03-25 1975-03-25 半導体装置の製法

Publications (2)

Publication Number Publication Date
JPS51110970A JPS51110970A (en) 1976-09-30
JPS5915488B2 true JPS5915488B2 (ja) 1984-04-10

Family

ID=12462963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50036196A Expired JPS5915488B2 (ja) 1975-03-25 1975-03-25 半導体装置の製法

Country Status (1)

Country Link
JP (1) JPS5915488B2 (enExample)

Also Published As

Publication number Publication date
JPS51110970A (en) 1976-09-30

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