JPS59153587A - 回路基板上における部品支持金具の溶断装置 - Google Patents

回路基板上における部品支持金具の溶断装置

Info

Publication number
JPS59153587A
JPS59153587A JP2646683A JP2646683A JPS59153587A JP S59153587 A JPS59153587 A JP S59153587A JP 2646683 A JP2646683 A JP 2646683A JP 2646683 A JP2646683 A JP 2646683A JP S59153587 A JPS59153587 A JP S59153587A
Authority
JP
Japan
Prior art keywords
circuit board
connecting piece
electrode means
support fitting
fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2646683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6311113B2 (enExample
Inventor
Noboru Takahashi
昇 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu General Ltd
Aerojet Rocketdyne Holdings Inc
Original Assignee
Fujitsu General Ltd
Gencorp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu General Ltd, Gencorp Inc filed Critical Fujitsu General Ltd
Priority to JP2646683A priority Critical patent/JPS59153587A/ja
Publication of JPS59153587A publication Critical patent/JPS59153587A/ja
Publication of JPS6311113B2 publication Critical patent/JPS6311113B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/22—Severing by resistance heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2646683A 1983-02-19 1983-02-19 回路基板上における部品支持金具の溶断装置 Granted JPS59153587A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2646683A JPS59153587A (ja) 1983-02-19 1983-02-19 回路基板上における部品支持金具の溶断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2646683A JPS59153587A (ja) 1983-02-19 1983-02-19 回路基板上における部品支持金具の溶断装置

Publications (2)

Publication Number Publication Date
JPS59153587A true JPS59153587A (ja) 1984-09-01
JPS6311113B2 JPS6311113B2 (enExample) 1988-03-11

Family

ID=12194289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2646683A Granted JPS59153587A (ja) 1983-02-19 1983-02-19 回路基板上における部品支持金具の溶断装置

Country Status (1)

Country Link
JP (1) JPS59153587A (enExample)

Also Published As

Publication number Publication date
JPS6311113B2 (enExample) 1988-03-11

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