JPS59153587A - 回路基板上における部品支持金具の溶断装置 - Google Patents
回路基板上における部品支持金具の溶断装置Info
- Publication number
- JPS59153587A JPS59153587A JP2646683A JP2646683A JPS59153587A JP S59153587 A JPS59153587 A JP S59153587A JP 2646683 A JP2646683 A JP 2646683A JP 2646683 A JP2646683 A JP 2646683A JP S59153587 A JPS59153587 A JP S59153587A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- connecting piece
- electrode means
- support fitting
- fitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004927 fusion Effects 0.000 title abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000523 sample Substances 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000013078 crystal Substances 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 239000002023 wood Substances 0.000 claims 1
- 239000011093 chipboard Substances 0.000 abstract description 5
- 241001365789 Oenanthe crocata Species 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 20
- 230000002265 prevention Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000034888 Needle issue Diseases 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/22—Severing by resistance heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2646683A JPS59153587A (ja) | 1983-02-19 | 1983-02-19 | 回路基板上における部品支持金具の溶断装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2646683A JPS59153587A (ja) | 1983-02-19 | 1983-02-19 | 回路基板上における部品支持金具の溶断装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59153587A true JPS59153587A (ja) | 1984-09-01 |
| JPS6311113B2 JPS6311113B2 (enrdf_load_stackoverflow) | 1988-03-11 |
Family
ID=12194289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2646683A Granted JPS59153587A (ja) | 1983-02-19 | 1983-02-19 | 回路基板上における部品支持金具の溶断装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59153587A (enrdf_load_stackoverflow) |
-
1983
- 1983-02-19 JP JP2646683A patent/JPS59153587A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6311113B2 (enrdf_load_stackoverflow) | 1988-03-11 |
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