JPS59151428A - 反応性イオンビ−ムエツチング装置 - Google Patents
反応性イオンビ−ムエツチング装置Info
- Publication number
- JPS59151428A JPS59151428A JP2473583A JP2473583A JPS59151428A JP S59151428 A JPS59151428 A JP S59151428A JP 2473583 A JP2473583 A JP 2473583A JP 2473583 A JP2473583 A JP 2473583A JP S59151428 A JPS59151428 A JP S59151428A
- Authority
- JP
- Japan
- Prior art keywords
- ion
- electrode
- processing chamber
- sample processing
- ion beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 28
- 238000010884 ion-beam technique Methods 0.000 title claims abstract description 28
- 230000004907 flux Effects 0.000 claims abstract description 22
- 238000000605 extraction Methods 0.000 claims description 23
- 230000001629 suppression Effects 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000001020 plasma etching Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 description 42
- 230000007935 neutral effect Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2473583A JPS59151428A (ja) | 1983-02-18 | 1983-02-18 | 反応性イオンビ−ムエツチング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2473583A JPS59151428A (ja) | 1983-02-18 | 1983-02-18 | 反応性イオンビ−ムエツチング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59151428A true JPS59151428A (ja) | 1984-08-29 |
JPH0310224B2 JPH0310224B2 (enrdf_load_html_response) | 1991-02-13 |
Family
ID=12146402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2473583A Granted JPS59151428A (ja) | 1983-02-18 | 1983-02-18 | 反応性イオンビ−ムエツチング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59151428A (enrdf_load_html_response) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59184529A (ja) * | 1983-04-04 | 1984-10-19 | Mitsubishi Electric Corp | 反応性イオンビ−ムエツチング装置 |
JPH01127668A (ja) * | 1987-11-09 | 1989-05-19 | Nec Corp | 集束荷電ビーム装置 |
JP2007027097A (ja) * | 2005-07-13 | 2007-02-01 | Samsung Electronics Co Ltd | プラズマを分離加速させる中性ビームエッチング装置 |
JP2007042609A (ja) * | 2005-07-29 | 2007-02-15 | Samsung Electronics Co Ltd | プラズマ加速装置及び該装置を備えるプラズマ処理システム |
-
1983
- 1983-02-18 JP JP2473583A patent/JPS59151428A/ja active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59184529A (ja) * | 1983-04-04 | 1984-10-19 | Mitsubishi Electric Corp | 反応性イオンビ−ムエツチング装置 |
JPH01127668A (ja) * | 1987-11-09 | 1989-05-19 | Nec Corp | 集束荷電ビーム装置 |
JP2007027097A (ja) * | 2005-07-13 | 2007-02-01 | Samsung Electronics Co Ltd | プラズマを分離加速させる中性ビームエッチング装置 |
US7789992B2 (en) | 2005-07-13 | 2010-09-07 | Samsung Electronics Co., Ltd. | Neutral beam etching device for separating and accelerating plasma |
JP2007042609A (ja) * | 2005-07-29 | 2007-02-15 | Samsung Electronics Co Ltd | プラズマ加速装置及び該装置を備えるプラズマ処理システム |
US7609002B2 (en) | 2005-07-29 | 2009-10-27 | Samsung Electronics Co., Ltd. | Plasma accelerating apparatus and plasma processing system having the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0310224B2 (enrdf_load_html_response) | 1991-02-13 |
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