JPS59150458A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS59150458A
JPS59150458A JP58016387A JP1638783A JPS59150458A JP S59150458 A JPS59150458 A JP S59150458A JP 58016387 A JP58016387 A JP 58016387A JP 1638783 A JP1638783 A JP 1638783A JP S59150458 A JPS59150458 A JP S59150458A
Authority
JP
Japan
Prior art keywords
mold
resin
lead frame
lead
bur
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58016387A
Other languages
Japanese (ja)
Inventor
Masamichi Shindo
進藤　政道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58016387A priority Critical patent/JPS59150458A/en
Publication of JPS59150458A publication Critical patent/JPS59150458A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To remarkably reduce the rate of generation of bur and thus contrive to simplify the number of manufacturing processes and to improve the yield by a method wherein projections contacting the wall of bur checking piece of a metal mold is provided in the neighborhood of a resin sealed type package of the outer lead. CONSTITUTION:The broken line 15 represents the part coated with mold resin, and the lead frame 41 is punched and formed to the form having the projections 42 in the neighborhood of the outer leads outside the broken line 15. The leads 41b are fitted to grooves 32 between the bur checking piece 31 provided on the metal mold. Since the projections 42 provided on the leads 41b block the grooves 32, the outflow of the mold resin from a cavity 30 can be prevented, and accordingly burs do not generate.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は樹脂モールド制止型半導体装置に使用される
リードフレームに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a lead frame used in a resin-molded semiconductor device.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

樹脂モールド型のパッケージは多くの半導体装置に広く
使用されている。これらの樹脂モールド型の・！ッケー
ジの形式過程の桓略は次のようなものである。すなわち
第１図に示すように、金属板を打ち抜いて形成されたリ
ードフレーム１ノの素子基台部（ベッド）１１ａ−ヒに
所定の半導体素子１０を載閉しビンディングワイヤ１２
を用いてワイヤボンディングを行なった後、キャビティ
（中空）を有する千−ルド金型の下金型１３ａ上にこの
リードフレーム旦を設置スる。そして、この下金型１３
ａ上に上金型１３ｂを重ね、内部のキャビティにモール
ド樹脂１４を注入した後、この樹脂１４を硬化させ金型
から増り出して適宜仕上げを行ない形成する。Resin molded packages are widely used for many semiconductor devices. These resin mold types! The formal process of packaging is as follows. That is, as shown in FIG. 1, a predetermined semiconductor element 10 is placed and closed on an element base part (bed) 11a-1 of a lead frame 1 formed by punching out a metal plate, and a binding wire 12 is placed.
After wire bonding is performed using a lead frame, the lead frame is placed on the lower mold 13a of a milled mold having a cavity (hollow). And this lower mold 13
The upper mold 13b is placed on top of the upper mold 13b, and a molding resin 14 is injected into the internal cavity.The resin 14 is then hardened and extruded from the mold to perform appropriate finishing and forming.

このような樹脂モールド装置では、リードフレーム１１
とこのリードフレーム１１を挟む上下の金型１３ｇ＋１
３ｂとの間に存在する寸法公差に起因するすき間からキ
ャビティ中に注入した樹脂が漏れる現象が起き、リード
フレームが引き出される伺近で樹脂ノＲッケージ面に硬
化した樹脂漏れ部いわゆるパリが形成される。このため
、モールド樹脂が硬化し、樹脂封止ノぞツケージが形成
された後に、液体ホーニング、ドライホーニング、砥石
研削などの各種手法により樹脂パリのパリ取り工程が施
される。しかし、このようなパリ取り工程によっても不
要な樹脂パリを完全に除去することは困難であり、また
、過度のパリ取り工程は樹脂・ぐッケージから露出し７
たアウターリードいわゆる足を不都合に曲げたり装置表
面を荒らしたりする不具合を引き起こし、歩留りの悪化
を招いていた。In such a resin molding device, the lead frame 11
Upper and lower molds 13g+1 that sandwich this lead frame 11
A phenomenon occurs in which the resin injected into the cavity leaks from the gap caused by the dimensional tolerance that exists between the lead frame and the lead frame, and a hardened resin leakage part, so-called "burr", is formed on the R-package surface near where the lead frame is pulled out. Ru. For this reason, after the molding resin has hardened and the resin-sealed groove cage has been formed, a process of removing the resin fringes is performed by various methods such as liquid honing, dry honing, and grindstone grinding. However, it is difficult to completely remove unnecessary resin particles even through such a deburring process, and an excessive deburring process may cause the resin/package to become exposed and 7
This causes problems such as bending the outer leads, so-called legs, and roughening the surface of the device, resulting in a deterioration of yield.

このような不要なパリの発生を防止するため、従来にお
いてリードフレームのタイバーを利用したパリ防止対策
が提案されている。これは第２図に示すリードフレーム
旦において、複数のリードＩｌｂを連結するタイバー１
１ｃを樹脂流れ防止に利用するもので、このタイバー１
１ｃを上金型と下金型との嵌合ライン付近に設けて樹脂
漏れをこのタイバー１１ｃによって阻止するようにした
ものである。なお、第２図において破線１５にモールド
樹脂被四部を示す〇このようなダイパー１１ｃを利用し
た樹脂流れ防ＩＬ法では、タイバー１１ｃを樹脂刊■ト
、パッケージの極く近傍に設けることができればパリの
形成を防ぐ効果は太きい。しかｉ〜、実際は（ηｊ脂封
止・やッケージを形成後このタイバー１１ｃを切り落と
しリード１１ｂをそ力、それ独立させなければｌｃらず
、樹脂制止パッケージの極〈近傍にタイバー１１０を設
けることはタイバー１１ｃの切り落とし作業を困難にす
るため、好ましくない６通常、このタイバー１１ｃ（ｄ
、パッケージの本来の外表面より約１ｓｉ程度外側にな
るように設けられるがこのようにパッケージの外表面か
ら１叫程度も離れた位置にタイバー１１ａを設けたもの
でに［パリ発生を充分に抑えることができず、モールド
樹脂の硬化後に何らかの方法でパリを除去する必要があ
る。In order to prevent the occurrence of such unnecessary flash, a countermeasure for preventing flash using lead frame tie bars has been proposed in the past. This is the tie bar 1 that connects the plurality of leads Ilb in the lead frame shown in FIG.
1c is used to prevent resin from flowing, and this tie bar 1
The tie bar 11c is provided near the fitting line between the upper mold and the lower mold to prevent resin leakage. In addition, in Fig. 2, the broken line 15 indicates the four parts covered with the molded resin. In the resin flow prevention IL method using such a dieper 11c, if the tie bar 11c can be installed very close to the resin plate and package, it will be possible to prevent the molding from occurring. It is highly effective in preventing the formation of However, in reality, after forming the resin seal/package, this tie bar 11c must be cut off and the lead 11b must be made independent, and it is not possible to provide the tie bar 110 near the pole of the resin-sealed package. This is undesirable because it makes it difficult to cut off the tie bar 11c (d
The tie bar 11a is provided at a position about 1 si outside the original outer surface of the package, but in this way, the tie bar 11a is provided at a position about 1 si away from the outer surface of the package. Therefore, it is necessary to remove the paris by some method after the mold resin has hardened.

このようなタイバー１１ｃを用いたパリ防１ト策の他に
、上下のモールド金型のかみ合う部分に、樹脂）やッケ
ーノの外に引き出されるアウターリードが丁度はブリ込
むような彫り込みを設け、樹脂が流れ出にくくするいわ
ゆるパリ止めコマ方式の対策がなさ力、でいる。第３図
はこのようなパリ止めコマ方式の改善がなされたモール
ド金型の一部を示す図で、３ｏがリードフレームに取９
着けられた素子の封止されるキャビティで３１がハリ止
めコマであり、このパリ止めコマ３１間の溝部３２にリ
ードフレームのアウターリード部がはめられる。In addition to this anti-splash measure using the tie bar 11c, a carving is provided in the interlocking part of the upper and lower molds so that the outer lead pulled out from the resin) and the resin will just bleed through. There is no countermeasure such as the so-called stopper method that prevents water from flowing out. Figure 3 shows a part of a mold with this improved flash stopper system, where 3o is attached to the lead frame.
In the cavity in which the attached element is sealed, 31 is a tension stopper, and the outer lead portion of the lead frame is fitted into the groove 32 between the tension stoppers 31.

しかしながらこのようなパリ止めコマ方式も金型とリー
ドフレームの寸法公差、熱膨張係数差”Ｊ　（７Ｊ）　
Ａ　カラ金型とリードフレームのアウターリード部との
間には片側ｏ（）６〜ｃ月咽程度の間１免が生じること
が避けられず、この間隙から樹脂が外部力向に流れる場
合があり、バリ発生を完全には防止できなかった。However, even with this flash stopper method, there are dimensional tolerances and thermal expansion coefficient differences between the mold and lead frame (7J).
A: It is unavoidable that a gap between the empty mold and the outer lead part of the lead frame will occur on one side, and the resin may flow from this gap in the direction of the external force. However, the occurrence of burrs could not be completely prevented.

〔発明の目的〕[Purpose of the invention]

この発明は上記のような点に３．みてなされたもので、
パリの発生率を著しく低減することのできるリードフレ
ーム、を提供し、製布工数の簡、　素化と歩留りの向上
に寄カせしめようとすみものである。This invention has the above-mentioned points 3. It was done by looking at
We are endeavoring to provide a lead frame that can significantly reduce the incidence of paris, thereby simplifying the manufacturing process, simplifying fabric production, and improving yield.

〔発明の概要〕[Summary of the invention]

すなわちこの発明に係るリードフレームでは、リードフ
レームにおけるアウターリードの樹脂封止型／ｌッケー
ジの近傍に樹脂封止型・やッケージの金型のパリ止めコ
マの壁に接する突起を設けるようにしたものである。That is, in the lead frame according to the present invention, a protrusion is provided in the vicinity of the resin-sealed mold/package of the outer lead in the lead frame so as to contact the wall of the stopper piece of the mold of the resin-sealed mold/package. It is.

〔発明の実施例〕[Embodiments of the invention]

以下図面を参照してこの発明の一実施例につき説明する
。第４図はこの発明によるリードフレームの形状を示す
図で、４１がリード７１７−ム４１ａは素子基台部（ベ
ッド）、４１ｂはリード、４１ｃはタイバーであり、破
線１５がモールド樹脂により被覆される部位である。そ
してリード４１ｂのうち、この破線１５内の部位がイン
ナーリードでありこの破線１５より外の部位がアウター
リードとなる。An embodiment of the present invention will be described below with reference to the drawings. FIG. 4 is a diagram showing the shape of the lead frame according to the present invention, where 41 is a lead 717, 41a is an element base (bed), 41b is a lead, 41c is a tie bar, and broken lines 15 are covered with mold resin. This is the part where Of the leads 41b, the portion within this broken line 15 is an inner lead, and the portion outside this broken line 15 is an outer lead.

ここでこの図に示すようにリードフレームａをアウター
リード上の破線１５の近傍に突起部４２を有する形状に
打ち抜き形成する。Here, as shown in this figure, the lead frame a is punched into a shape having a protrusion 42 near the broken line 15 on the outer lead.

このようなリードフレームＬＬを第３図で示したような
パリ止めコマを有する金型にはめ込ｆＰ。The lead frame LL is fitted into a mold having a stopper piece as shown in FIG. 3 fP.

第５図にば金型にはめ込オわた状態のリードフレーム４
ノを拡大しで示す。ここに示すように上記リード４１ｂ
は金型に設けられたパリ止り〕コマ３１間の溝、？２に
はめ込オれるが、リード４１ｂに設けられた突起部４２
が上記溝部３２を塞ぐため、モールド樹脂がキャビティ
３０から溝部３２を通じて外部に漏れない。ここでこの
場合、上記突起部４２は、突起部４２が完全に金型の壁
と接するように、金型との寸法公差や熱膨張係数差等を
見込んだ長さに設定する。Figure 5 shows the lead frame 4 fitted into the mold in an open state.
The figure is shown enlarged. As shown here, the lead 41b
? is the groove between pieces 31 [stop-stop] provided in the mold? 2, but the protrusion 42 provided on the lead 41b
Since the mold resin closes the groove 32, the mold resin does not leak out from the cavity 30 through the groove 32. In this case, the protrusion 42 is set to a length that takes into account dimensional tolerances, thermal expansion coefficient differences, etc. with the mold so that the protrusion 42 completely contacts the wall of the mold.

また、金型へこのリードフレーム４ノｌｄめ込むには１
ず、下金型上の所定の位置にリードフレーム具を載置し
、上から上金型を降ろして、リードフレーム４ノの突起
部４２が上金型の圧力で下金型の溝部３２に完全に接し
てはまシ込むようにする。すなわち突起部４２の先端は
パリ止めコマ３１に接するかもしくは極くわずかにつぶ
れ、溝部３２の間隙を塞ぐ。Also, to insert this lead frame into the mold with 4 knots, 1
First, place the lead frame tool at a predetermined position on the lower mold, lower the upper mold from above, and press the protrusion 42 of the lead frame 4 into the groove 32 of the lower mold under the pressure of the upper mold. Make sure they touch completely and fit together. That is, the tip of the protrusion 42 touches the stopper piece 31 or is crushed very slightly, closing the gap between the grooves 32.

また、突起部４２は、第４図および第５図に示すような
ものに限らず、三角形状あるいは半円状等、他の形状の
ものでも良い。Further, the protrusion 42 is not limited to the one shown in FIGS. 4 and 5, but may have other shapes such as a triangular shape or a semicircular shape.

なお、突起部４２の形状は金型との接触面が広すぎる場
合や突起部４２の長さが長すぎる場合には、金型の溝部
３２にリードがは壕りにくくなり金型を閉じる際にリー
ドの変形を引き起こす恐わがある。Note that if the shape of the protrusion 42 is such that the contact surface with the mold is too wide or the length of the protrusion 42 is too long, the lead will be difficult to fit into the groove 32 of the mold, making it difficult to close the mold. may cause lead deformation.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によればリードフレームにおける
アウターリード部のノ９ッケージ近傍に突起部を設け、
突起部の設けられたリード部の幅が金型に設けられたパ
リ止めコマ間の幅と略同寸あるいはパリ止めコマ間の幅
よシも極ぐわずかに広くなるようにすることにより、金
型のキャビテｒからのモールド樹脂の流出を防ぐことが
でき、樹脂封止型パッケージにおけるパリが発生せず、
製造工程の簡素化と歩ｐｂのＩＴｉＪ上に寄与できるリ
ードフレームを提供できる。As described above, according to the present invention, the protrusion is provided near the cage of the outer lead portion of the lead frame,
By making the width of the lead part provided with the protrusion approximately the same as the width between the padding pieces provided on the mold, or by making the width between the padding pieces very slightly wider, It is possible to prevent mold resin from flowing out from the mold cavity, and prevents the occurrence of debris in resin-sealed packages.
It is possible to provide a lead frame that can contribute to simplifying the manufacturing process and improving ITiJ of PB.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は樹脂モールド型ノ９ッケージを説明する断面図
、第２図は従来のリードフレームを示す平面図、第３図
は金型を示す斜ネ見図、第４図をＭＳ？、明する平面図
である。 ３０・・・ギヤピティー、１．？　ｌ・・・パリ止めコ
マ、３２・・・溝部、４１・・・リードフレーム、４１
ａ・・・素子基台部、４１ｂ・・・リード、４１ｃ・・
・タイバー、４２・・・突起部。 出願人代理人　　弁理士　鈴　江　武　な第１図 第２図 第３図Fig. 1 is a sectional view illustrating a resin mold mold package, Fig. 2 is a plan view showing a conventional lead frame, Fig. 3 is a perspective view showing the mold, and Fig. 4 is an MS? FIG. 30...Gearpity, 1. ? l...Flash stopper, 32...Groove, 41...Lead frame, 41
a...Element base part, 41b...Lead, 41c...
- Tie bar, 42... protrusion. Applicant's representative Patent attorney Takeshi Suzue Figure 1 Figure 2 Figure 3

Claims (1)

【特許請求の範囲】[Claims] 樹脂封止型半導体装置の樹脂封止部内に収納されるべき
インナーリード部と上記樹脂封止部内部の外側に露出す
るアウターリード部とから成るリードフレームにおいて
、上記インナーリード部とアウターリード部との境界線
近傍のアウターリード部側面にモールド金型とリードと
の間隙を閉塞するための突起部が設けられでいることを
特徴とするリードフレーム。In a lead frame consisting of an inner lead part to be housed in a resin sealing part of a resin sealing type semiconductor device and an outer lead part exposed to the outside inside the resin sealing part, the inner lead part and the outer lead part are A lead frame characterized in that a protrusion for closing a gap between the mold and the lead is provided on a side surface of the outer lead near the boundary line of the lead frame.
JP58016387A 1983-02-03 1983-02-03 Lead frame Pending JPS59150458A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58016387A JPS59150458A (en) 1983-02-03 1983-02-03 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58016387A JPS59150458A (en) 1983-02-03 1983-02-03 Lead frame

Publications (1)

Publication Number Publication Date
JPS59150458A true JPS59150458A (en) 1984-08-28

Family

ID=11914847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58016387A Pending JPS59150458A (en) 1983-02-03 1983-02-03 Lead frame

Country Status (1)

Country Link
JP (1) JPS59150458A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5093709A (en) * 1989-11-28 1992-03-03 Hyundai Electronics Industries Co., Ltd. Lead frame having a diagonally terminating side rail end
US5137479A (en) * 1990-03-15 1992-08-11 Nippon Steel Corporation Lead structure for packaging semiconductor chip
US5271148A (en) * 1988-11-17 1993-12-21 National Semiconductor Corporation Method of producing a leadframe
JP2009012650A (en) * 2007-07-05 2009-01-22 Toyota Motor Corp Shoulder anchor rail structure
EP2549531A1 (en) * 2011-07-21 2013-01-23 Nxp B.V. Lead frame for semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5271148A (en) * 1988-11-17 1993-12-21 National Semiconductor Corporation Method of producing a leadframe
US5093709A (en) * 1989-11-28 1992-03-03 Hyundai Electronics Industries Co., Ltd. Lead frame having a diagonally terminating side rail end
US5137479A (en) * 1990-03-15 1992-08-11 Nippon Steel Corporation Lead structure for packaging semiconductor chip
JP2009012650A (en) * 2007-07-05 2009-01-22 Toyota Motor Corp Shoulder anchor rail structure
EP2549531A1 (en) * 2011-07-21 2013-01-23 Nxp B.V. Lead frame for semiconductor device

Similar Documents

Publication Publication Date Title
US5422314A (en) Lead frame and production method for producing semiconductor device using the lead frame
JPS59150458A (en) Lead frame
US4490902A (en) Lead frame for molded integrated circuit package
JPH09115936A (en) Mold for resin molding of semiconductor device
JP2001047473A (en) Deviated end mold for plastic package of integrated semiconductor device
JPS60180126A (en) Manufacture of semiconductor device
JP2580740B2 (en) Lead frame
JPH01201945A (en) Lead frame
JPS59150459A (en) Lead frame
JPS62156844A (en) Lead frame
JP2866816B2 (en) Lead frame
JP2838948B2 (en) Lead frame
JPS6232622A (en) Resin-sealed metal mold for semiconductor device
JPH06216178A (en) Molding die for resin-sealed semiconductor device
JPH0621127A (en) Sealing metal mold for resin molded ic
JPH06254909A (en) Semiconductor device and resin molding die for manufacturing semiconductor device
JPS6223094Y2 (en)
JPS61289637A (en) Metal mold unit for sealing
JP4442210B2 (en) Manufacturing method of semiconductor package
JP2560194B2 (en) Method of manufacturing packaged semiconductor device
JPH06188279A (en) Molding apparatus
JPH01318257A (en) Lead frame for resin-molded electronic component
JPH07221246A (en) Lead frame for plastic molded semiconductor device and manufacture of plastic molded semiconductor device using the same
JPH07147366A (en) Lead frame and semiconductor device using it
JPH01187842A (en) Manufacture of semiconductor device