JPS5914337U - 電力用半導体装置 - Google Patents

電力用半導体装置

Info

Publication number
JPS5914337U
JPS5914337U JP10965182U JP10965182U JPS5914337U JP S5914337 U JPS5914337 U JP S5914337U JP 10965182 U JP10965182 U JP 10965182U JP 10965182 U JP10965182 U JP 10965182U JP S5914337 U JPS5914337 U JP S5914337U
Authority
JP
Japan
Prior art keywords
semiconductor pellet
temperature compensating
compensating plate
semiconductor
power semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10965182U
Other languages
English (en)
Inventor
敏夫 小川
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP10965182U priority Critical patent/JPS5914337U/ja
Publication of JPS5914337U publication Critical patent/JPS5914337U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体装置の構成を示す断面図、第２図
はこの考案に係る半導体装置の一実施例の□断面図、第
３図および第４図はそれぞれこの考案の他の実施例の断
面図である。 １０・・・半導体ペレット、１２．４０．５０゜６０・
・・温度補償板、１４・・・カソード用電極、１６゜１
Ｂ、　　４２．　４４・・・傾斜端面、２０・・・ゲー
トリード、４６．４８・・・絶縁被覆層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 少なくともアノード、ゲートおよびカソードを有する半
    導体素子から成る半導体ペレットと、この半導体ペレッ
    トのアノードと電気的に接続されると共にこの半導体ペ
    レットを載置固着した導電性の温度補償板と、この温度
    補償板が接続された面とは反対側の前記半導体ペレット
    面に離間して設けたゲート電極用リードおよびカソード
    電極とを具え、前記温度補償板の端面部に傾斜面を形成
    し、前記半導体ペレット面の周縁部から前記温度補償板
    の端面部まで電気絶縁層で被覆したことを特徴とする電
    力用半導体装置。
JP10965182U 1982-07-20 1982-07-20 電力用半導体装置 Pending JPS5914337U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10965182U JPS5914337U (ja) 1982-07-20 1982-07-20 電力用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10965182U JPS5914337U (ja) 1982-07-20 1982-07-20 電力用半導体装置

Publications (1)

Publication Number Publication Date
JPS5914337U true JPS5914337U (ja) 1984-01-28

Family

ID=30255338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10965182U Pending JPS5914337U (ja) 1982-07-20 1982-07-20 電力用半導体装置

Country Status (1)

Country Link
JP (1) JPS5914337U (ja)

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