JPS59134509U - 半導体装置用モールド金型 - Google Patents

半導体装置用モールド金型

Info

Publication number
JPS59134509U
JPS59134509U JP2763683U JP2763683U JPS59134509U JP S59134509 U JPS59134509 U JP S59134509U JP 2763683 U JP2763683 U JP 2763683U JP 2763683 U JP2763683 U JP 2763683U JP S59134509 U JPS59134509 U JP S59134509U
Authority
JP
Japan
Prior art keywords
mold
semiconductor devices
recorded
electronic filing
before electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2763683U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0136582Y2 (enExample
Inventor
昌彦 津守
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP2763683U priority Critical patent/JPS59134509U/ja
Publication of JPS59134509U publication Critical patent/JPS59134509U/ja
Application granted granted Critical
Publication of JPH0136582Y2 publication Critical patent/JPH0136582Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2763683U 1983-02-25 1983-02-25 半導体装置用モールド金型 Granted JPS59134509U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2763683U JPS59134509U (ja) 1983-02-25 1983-02-25 半導体装置用モールド金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2763683U JPS59134509U (ja) 1983-02-25 1983-02-25 半導体装置用モールド金型

Publications (2)

Publication Number Publication Date
JPS59134509U true JPS59134509U (ja) 1984-09-08
JPH0136582Y2 JPH0136582Y2 (enExample) 1989-11-07

Family

ID=30158512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2763683U Granted JPS59134509U (ja) 1983-02-25 1983-02-25 半導体装置用モールド金型

Country Status (1)

Country Link
JP (1) JPS59134509U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62269327A (ja) * 1986-05-17 1987-11-21 Michio Osada 多品種少量生産に適した半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431064U (enExample) * 1977-08-03 1979-03-01
JPS59129512U (ja) * 1983-02-19 1984-08-31 ロ−ム株式会社 モ−ルド金型

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431064U (enExample) * 1977-08-03 1979-03-01
JPS59129512U (ja) * 1983-02-19 1984-08-31 ロ−ム株式会社 モ−ルド金型

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62269327A (ja) * 1986-05-17 1987-11-21 Michio Osada 多品種少量生産に適した半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0136582Y2 (enExample) 1989-11-07

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