JPS59132176A - Photocoupler - Google Patents
PhotocouplerInfo
- Publication number
- JPS59132176A JPS59132176A JP58005346A JP534683A JPS59132176A JP S59132176 A JPS59132176 A JP S59132176A JP 58005346 A JP58005346 A JP 58005346A JP 534683 A JP534683 A JP 534683A JP S59132176 A JPS59132176 A JP S59132176A
- Authority
- JP
- Japan
- Prior art keywords
- light
- photocoupler
- elements
- light receiving
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 230000000644 propagated effect Effects 0.000 abstract 1
- 239000008393 encapsulating agent Substances 0.000 description 8
- 230000000903 blocking effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発゛明は、フォトカプラ（光結合装置）に関し、さ
らに詳しくは同一パッケージ内に複数対の受発光素子が
封入されて複数回路が構成されているフォトかプ才に関
するものである。[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to a photocoupler (optical coupling device), and more specifically, a photocoupler in which a plurality of pairs of light receiving and emitting elements are enclosed in the same package to form a plurality of circuits. It's all about photography and talent.
従来のフォトカプラは、一対の受発光素子をエンキャッ
プ剤といわれる透明樹脂で光学的に連結し、これを樹脂
モールドにより１パツケージ内に組み込んで構成された
１回路−１パツケージ構造が基本になっている。このよ
うな１回路−１パツケージ構造のフォトカプラを用いて
複数回路を形成するには複数個のフォトカプラを必要と
し、経済的ではなくなるとともに回路の形成も煩雑であ
り、今後は複数回路が１パツケージ内に組み込まれた構
成のものが利用されるようになるものと考えられている
。Conventional photocouplers are based on a one-circuit-one-package structure in which a pair of light-receiving and emitting elements are optically connected using a transparent resin called an encapsulant, and these are assembled into a single package using a resin mold. ing. Forming multiple circuits using a photocoupler with such a one-circuit-one-package structure requires multiple photocouplers, making it uneconomical and complicated to form the circuits. It is thought that devices with a configuration built into the package will come to be used.
そのような複数回路−１パツケージ構成のフォトカプラ
構造として、１パツケージ内に複数対の受発光素子を電
気的に独立した構造のものとして組み込むことはできる
が、それでは１パツケージになっているものの１、パッ
ケージの外形が大きく複数回路−１パツケージの利点は
十分に発揮できない。従って必然的に複数回路の共通ラ
イン化をした構造にすることが考えられ、例えば第１図
横断面図と第２図縦断面図に示すＸうに発光素子２ａ、
２ｂ、２ｃ・・・に対向する受光素子３ａ、３ｂ、３ｃ
・・・側のリードフレーム５について、受光素子をマウ
ントする素子取付部６のラインを共通化した構造にする
ことによって、フォトカブラの外形寸法を小さくし複数
回路の形成を容易にすることができる。As such a photocoupler structure with multiple circuits in one package, it is possible to incorporate multiple pairs of light receiving and emitting elements in one package as electrically independent structures, but in this case, only one However, the package has a large external size, and the advantages of the multiple-circuit-one package cannot be fully utilized. Therefore, it is considered necessary to have a structure in which a plurality of circuits are connected to a common line.
Light receiving elements 3a, 3b, 3c facing 2b, 2c...
By making the lead frame 5 on the side have a structure in which the lines of the element mounting part 6 for mounting the light receiving element are shared, the external dimensions of the photocoupler can be reduced and it is possible to easily form multiple circuits. .
しかしながら、受光素子３ａ、６ｂ、３ｃ・・・をリー
ドフレーム５の共通化された素子取付部６にマウントす
る構造においてゆ素子取付座６ ａ 、 ６ｂ 、６Ｃ
−４−間の間隔が狭いので、各受光素子のエンキャップ
剤−７はリードフレームを伝わって流れ、隣接する受光
素子間ぞエンキャップ剤７ａ、７ｂ、７ｃ・・・かつな
がってし１うという問題点が生ずる。このように複数回
路のエンキャップ剤７がつながると、装置の実使の
用時動作してはならない回路に隣接動作回路力・らへ光
が、つながったエンキャップ剤７ａ、７ｂ、７ｃを通っ
て流れ込み悪影響を及ぼすことになる。However, in the structure in which the light receiving elements 3a, 6b, 3c... are mounted on the common element mounting portion 6 of the lead frame 5, the element mounting seats 6a, 6b, 6C...
-4- Since the spacing between the light receiving elements is narrow, the encapsulant 7 of each light receiving element flows through the lead frame and connects between the adjacent light receiving elements 7a, 7b, 7c, etc. This problem arises. When multiple circuits of the encapsulants 7 are connected in this way, the power from the adjacent operating circuits and the light from the circuits that must not operate during actual use of the device pass through the connected encapsules 7a, 7b, and 7c. This will cause a negative impact.
この発明の目的は、同一パッケージ内に共通化した受光
素子マウントラインを有する複数回路を組み込んだフォ
トカブララにおいて、隣接回路相互間の電気的分離を向
上させたノオトカプラを提供することにある。An object of the present invention is to provide a photocoupler that improves electrical isolation between adjacent circuits in a photocoupler incorporating a plurality of circuits having a common light-receiving element mounting line in the same package.
この発明のフォトカブラは、同一パッケージ内に複数個
の発光素子とその各と対になった受光素子とか対向し、
各対の受発光素子が光を導く透明樹脂でエンキャップさ
れて対向配置されるとともに、その少なくとも２個以上
の受光素子が同一リードフレームの互に共通化された素
子取付部に装着された構造のフォトカブラであって、互
に隣り合う該素子取付部の取付座間に光しゃ断部を設け
たことを特徴とするものである。この光しゃ断部は、こ
の発明の一好適実施例においてはリードフレームの素子
取付座間に打ち抜かれた穴、溝もしくは切欠き等であり
、また他の好適実施例においては各受光素子間に突設さ
れた衝立伏しゃ元板である。この発明の光しゃ断部を設
けたリードフレームにマウントされた受光素子は、エン
キャップ剤が相互につながることがないので対になった
回路以外の回路とは、電気的に完全に分離された状態で
動作し、目的とするフォトカブラが提供される。The photocoupler of the present invention has a plurality of light emitting elements and light receiving elements paired with each of them facing each other in the same package,
A structure in which each pair of light-receiving and emitting elements are encapsulated with a transparent resin that guides light and placed facing each other, and at least two or more of the light-receiving elements are mounted on a common element mounting part of the same lead frame. This photocoupler is characterized in that a light-blocking portion is provided between the mounting seats of the element mounting portions that are adjacent to each other. In one preferred embodiment of the present invention, this light-blocking portion is a hole, groove, or notch punched between the element mounting seats of the lead frame, and in another preferred embodiment, the light-blocking portion is a hole, groove, or notch punched between each light-receiving element. This is the original board of the screen. The light-receiving element mounted on the lead frame provided with the light-blocking part of this invention is completely electrically isolated from circuits other than the paired circuits because the encapsulants do not connect with each other. A photocabra that operates and is intended for this purpose is provided.
以下に添付図面を参照して本発明の実施例について説明
する。Embodiments of the present invention will be described below with reference to the accompanying drawings.
第６図は本発明第一実施例におけるリードフレーム平面
図であり第４図は第一実施例フォトカブラの縦断面図で
ある。両図に示したフォトカブラは、樹脂モールドから
なる１個のパッケージ１内１ に複数個の発光素子２
ａ 、 ２ｂ 、 ２’ｃ・・・と、発光素子に対向し
て配置されている受光素子３ａ、３ｂ、３ｃ・・・とが
収容されている。発光素子２ａ、２ｂ、２ｃ・・・は第
一のリードフレーム４の独立した素子取付部４ａ、４ｂ
。FIG. 6 is a plan view of a lead frame in the first embodiment of the present invention, and FIG. 4 is a longitudinal sectional view of the photocoupler of the first embodiment. The photocoupler shown in both figures includes a plurality of light emitting elements 2 in one package 1 made of resin mold.
a, 2b, 2'c... and light receiving elements 3a, 3b, 3c... disposed facing the light emitting element are accommodated. The light emitting elements 2a, 2b, 2c, . . . are attached to independent element mounting portions 4a, 4b of the first lead frame 4.
.
４Ｃ・・・にマウントされているが、受光素子６ａ 、
６ｂ 。Although mounted on 4C..., the light receiving element 6a,
6b.
６ｃ・・・は第二のリードフレーム５の共通化された素
子取付部６の取付座にマウントされている。発光素子２
ａ、２ｂ、２ｃ・・・の必要な他の電極は第一のリード
フレーム４のリード４ｄに接続され、また受光素子３ａ
、３ｂ、、５ｃ・・・の必要な他の電極は第二のり一ド
７Ｌ／−ム５の他のリード５ａ、５ａ’ 、５ｂ、５ｂ
’、５ｃ。6c... are mounted on mounting seats of the common element mounting portion 6 of the second lead frame 5. Light emitting element 2
Other necessary electrodes a, 2b, 2c... are connected to the lead 4d of the first lead frame 4, and the light receiving element 3a
, 3b, 5c... are the other leads 5a, 5a', 5b, 5b of the second board 7L/-m 5.
', 5c.
５ｃ’・・・に接続されている。5c'... is connected.
受光素子３ａ 、 ６ｂ、 ３ｃ・・・が取り付けられ
ている共通化素子取伺部乙には、各素子の取付座間に穴
６１゜６ｍ 、 ６ｎ・・・が打ち抜かれており、この
穴６１ 、６ｍ 。Holes 61°6m, 6n, etc. are punched out between the mounting seats of each element in the common element receiving part B, to which the light receiving elements 3a, 6b, 3c... are attached. 6m.
６ｎ・・・を隔てて各受光素子が一線上に整列している
。この穴６１．６ｍ、６ｎ・・・は各受光素子に対して
隣りの発光素子からの光の侵入をしゃ断するための光し
ゃ断部となっており、各受発光素子対を被覆している透
明樹脂のエンキャップ剤７がこの穴６１゜６ｍ、６ｎ・
・・によって各受発光素子対毎に分断され、その結果エ
ンキャップ剤Ｚ中を伝路する光が＠りの受発光素子対の
エンキャップ剤中に侵入するのが防止される。The light-receiving elements are aligned on a line with 6n... separated therefrom. These holes 61.6m, 6n, etc. serve as light blocking parts for each light receiving element to block light from entering from the adjacent light emitting element, and are transparent parts that cover each light receiving and emitting element pair. The resin encapsulant 7 fills this hole 61°6m, 6n.
... is divided into each pair of light receiving/emitting elements, and as a result, the light traveling through the encapsulant Z is prevented from penetrating into the encapsulant of the other pair of light receiving/emitting elements.
光しゃ断部を第６図及び第４図の実施例のような打抜き
穴とする代りに、溝や切欠きとしてもエンキャップ剤が
分断できる。さらに第５図の第二実施例のように衝立伏
しゃ元板８として構成してもよい。この第二実施例では
受光素子間に爪立てを行って衝立伏しゃ元板８を形成す
ると同時に第一実施例と同様に穴６ｐを形成したもので
ある。Instead of the light blocking portion being a punched hole as in the embodiments of FIGS. 6 and 4, the encapsulant may be separated by a groove or notch. Furthermore, it may be constructed as a screen base plate 8 as in the second embodiment shown in FIG. In this second embodiment, a claw is provided between the light receiving elements to form a screen-blocking base plate 8, and at the same time, a hole 6p is formed in the same manner as in the first embodiment.
以上の実施例から明らかなように、この発明によるフォ
トカプラでは、互に隣り合う受発光素子対からの光の侵
入が防止されているので、本発明によれば同一パッケー
ジ内に複数回路が電気的に分離された状態で収容された
フォトカプラが比較的安価に提供される。As is clear from the above embodiments, the photocoupler according to the present invention prevents light from entering from adjacent pairs of light receiving and emitting elements. A photocoupler housed in a state of being separated from each other can be provided at a relatively low cost.
なお、光しゃ断部としては図示実施例以外にも種々のも
のが可能であるがそれらのうち本発明と等価のものは本
発明の範囲に包含されるのは明らかである。１だ本発明
においては受光素子の素子取付部間に光しゃ断部を設け
たものであるが、装置によっては発光素子の素子取付部
間に光しゃ断部を設けて有効な場合もあろう。It should be noted that various types of light-blocking parts other than those shown in the illustrated embodiments are possible, but it is clear that those equivalent to the present invention are included within the scope of the present invention. 1. In the present invention, a light-blocking part is provided between the mounting parts of the light-receiving element, but depending on the device, it may be effective to provide a light-blocking part between the mounting parts of the light-emitting element.
第１図は業パ、ケージー複数回路構造の問題点を説明す
るためのフォ）〜カプラ横断面図、第２図は第１図と同
じ目的のフォトカプラ縦断面図、第６図は本発明の゛第
一実施例に使用されるリードフレーム平面図、第４図は
第−実施例の一縦断面図、第５図は第二実施例の縦断面
図である。
１・・・パ、 ／７−−ジ、２ａ 、 ２ｂ 、 ２ｃ
ｍ発光素子、３ａ。
３ｂ、３．ｃ・・・受素子、４，５・・・リードフレー
ム、４ａ。
４ｂ、４ｃ・・・発光素子取付部、６・・・共通化受光
素子取付部、６１．６ｍ、６ｎ・・・穴、７・・・エン
キャップ剤、８・・・衝立伏しゃ元板。
第１図 第２図
一−ｊＩ
□□−−−４
□□□−□Ｉ敦・
−３［
第・４ 図
第５図Figure 1 is a cross-sectional view of a photocoupler for explaining the problems of the multi-circuit structure, Figure 2 is a vertical cross-sectional view of a photocoupler for the same purpose as Figure 1, and Figure 6 is a cross-sectional view of the photocoupler according to the present invention. FIG. 4 is a plan view of a lead frame used in the first embodiment, FIG. 4 is a longitudinal sectional view of the second embodiment, and FIG. 5 is a longitudinal sectional view of the second embodiment. 1...Pa, /7--di, 2a, 2b, 2c
m light emitting element, 3a. 3b, 3. c...Receiving element, 4, 5...Lead frame, 4a. 4b, 4c...Light emitting element attachment part, 6...Common light receiving element attachment part, 61.6m, 6n...Hole, 7...Encapping agent, 8...Screen cover plate. Fig. 1 Fig. 2 1-jI □□--4 □□□-□I Atsushi -3[ Fig. 4 Fig. 5
Claims (1)
対が複数対収容され、各対毎に発光素子と受光素子とが
光を導く透明樹脂でエンキャップされて対向配置されて
おり、そして該受光素子の少なくとも２個以上が同−Ｉ
Ｊ−ドフレームの互に共通化された素子取付部に装置さ
れた構造のフォトカプラであって、互ｊ に隣り合
う該素子取付部間に各受光素子と対をなす発光素子以外
の発光素子からの光をしゃ断する光しゃ断部が設けられ
ているフォトカプラ。1 A plurality of pairs consisting of a light emitting element and a light receiving element are housed in the same package, and for each pair, the light emitting element and the light receiving element are capped with a transparent resin that guides light and are disposed facing each other. At least two or more of the elements are the same -I
A photocoupler having a structure that is installed in a mutually common element mounting part of a J-frame, and a light-emitting element other than a light-emitting element forming a pair with each light-receiving element between the adjacent element mounting parts. A photocoupler that is equipped with a light cutoff section that blocks light from the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58005346A JPS59132176A (en) | 1983-01-18 | 1983-01-18 | Photocoupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58005346A JPS59132176A (en) | 1983-01-18 | 1983-01-18 | Photocoupler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59132176A true JPS59132176A (en) | 1984-07-30 |
Family
ID=11608641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58005346A Pending JPS59132176A (en) | 1983-01-18 | 1983-01-18 | Photocoupler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59132176A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5245198A (en) * | 1990-10-12 | 1993-09-14 | Sharp Kabushiki Kaisha | Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold |
-
1983
- 1983-01-18 JP JP58005346A patent/JPS59132176A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5245198A (en) * | 1990-10-12 | 1993-09-14 | Sharp Kabushiki Kaisha | Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold |
| US5285076A (en) * | 1990-10-12 | 1994-02-08 | Sharp Kabushiki Kaisha | Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold |
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