JPS6068678A - Photocoupling semiconductor device - Google Patents
Photocoupling semiconductor deviceInfo
- Publication number
- JPS6068678A JPS6068678A JP58176339A JP17633983A JPS6068678A JP S6068678 A JPS6068678 A JP S6068678A JP 58176339 A JP58176339 A JP 58176339A JP 17633983 A JP17633983 A JP 17633983A JP S6068678 A JPS6068678 A JP S6068678A
- Authority
- JP
- Japan
- Prior art keywords
- light
- frame
- emitting element
- elements
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 108091008695 photoreceptors Proteins 0.000 abstract 3
- 238000010586 diagram Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は光結合半導体装置に関し、詳しくは包囲容器よ
）突出する外部リードの容器内端部に受光及び発光素子
を搭載し、これらを所定間隔をもって正対して配置して
成る光結合半導体装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an optically coupled semiconductor device, and more specifically, a light-receiving and light-emitting element is mounted on the inner end of the container of an external lead protruding from a surrounding container, and these elements are arranged facing each other at a predetermined interval. The present invention relates to an optically coupled semiconductor device comprising:
（従来技術）
光結合半導体装置は、発光素子と受光素子とを組合せて
１つのデバイスとしたもので、一般にホトカプラ又はオ
プティカリ・カップルド・アイソレータ（ｐｈｏｔｏｃ
ｏｕｐｌｅｒ又はｏｐｔｔｃａｌｌｙ ｃｏｕｐｌｅｄ
ｉｓｏｌａｔｅｒ）と呼ばれそれは、発光素子に電気信
号を入力して該発光素子を発光させ、この光を媒体にし
、これを正対した受光素子で受け、電気信号に変換する
ものであシ、第１図にこの種装置の等何回路を示す。図
に示すように発光素子１はＬＥＤと呼称されるフォト・
ダイオードであシ、アノード電極２及びカソード電極３
を有する。−力受光素子４は、受光領域としてベース領
域を有するフォト・トランジスタで、エミッタ電極５及
びコレクタ電極６をもち、外部リードとして計４端子の
リードが最低必要である。したがってマルチ・チャンネ
ル構成、例えば２チヤンネルを形成する場合、８端子の
リードが必要となシ、４チヤンネルを形成する場合、１
６端子のリードが必要となる。次に、従来の４チヤンネ
ルのホトカプラ・デバイスを第２図に示す。(Prior Art) A photocoupled semiconductor device is a device that combines a light emitting element and a light receiving element, and is generally made of a photocoupler or an optically coupled isolator (photocoupler).
oupler or opttcally coupled
It is a device that inputs an electrical signal to a light-emitting element to cause the light-emitting element to emit light, uses this light as a medium, receives it with a directly facing light-receiving element, and converts it into an electrical signal. Figure 1 shows the circuit of this type of device. As shown in the figure, the light emitting element 1 is a photo-diode called an LED.
Diode, anode electrode 2 and cathode electrode 3
has. - The photodetector 4 is a phototransistor having a base region as a light receiving region, and has an emitter electrode 5 and a collector electrode 6, and requires at least four terminals in total as external leads. Therefore, when forming a multi-channel configuration, for example, 2 channels, 8 terminal leads are required, and when forming 4 channels, 1 lead is required.
Six terminal leads are required. Next, a conventional 4-channel photocoupler device is shown in FIG.
第２図において、１ａ乃至１ｄは発光素子、 ４ａ乃至
４ｄは受光素子、２ａ乃至２ｄはアノード電極、３ａ乃
至３ｄはカソード電極、５ａ乃至５ｄはエミ、り電極、
６ａ乃至６ｄはコレクタ電極、７はパッケージ、８はリ
ードフレームをそれぞれ示す。In FIG. 2, 1a to 1d are light emitting elements, 4a to 4d are light receiving elements, 2a to 2d are anode electrodes, 3a to 3d are cathode electrodes, 5a to 5d are emitter electrodes,
6a to 6d are collector electrodes, 7 is a package, and 8 is a lead frame.
周知の様にホト・カプラ・デバイスは、受発光素子４及
び１を正対配置するため、これら素子１゜４をそれぞれ
第３図に示すリードフレーム８ａの外部リード９ａの端
部に発光素子１を搭載すると共に隣接する外部リード９
ｂに所要の電極配線を行う。同様に、受光素子４もリー
ドフレーム８ｂの外部リードｌＯａの端部に搭載され、
同様に隣接する外部リード１０ｂに所要の電極配線が施
された後、これら受発光素子４及びｌを正対させて合成
樹脂等の包囲容器で密封されるものである。As is well known, in a photocoupler device, in order to arrange the light emitting and receiving elements 4 and 1 directly facing each other, these elements 1.4 are respectively attached to the ends of the external leads 9a of the lead frame 8a shown in FIG. and the adjacent external lead 9
Perform the required electrode wiring in b. Similarly, the light receiving element 4 is also mounted on the end of the external lead lOa of the lead frame 8b,
Similarly, after the required electrode wiring is applied to the adjacent external leads 10b, the light receiving and emitting elements 4 and 1 are placed directly facing each other and sealed in a surrounding container made of synthetic resin or the like.
ところで第３図に示されたリードフレーム８ａ及び８ｂ
を、第４図に示すような回路構成とする場合、即ち発光
素子１ａ乃至１ｄのアノードが共通で且つ受光素子４ａ
乃至４ｄのコレクタが共通の場合、第２図の破線で示す
様に外部で配線をする必要が生じる。By the way, the lead frames 8a and 8b shown in FIG.
When the circuit configuration is as shown in FIG. 4, the anodes of the light emitting elements 1a to 1d are common and the light receiving element 4a
If the collectors of 4d to 4d are common, it will be necessary to perform external wiring as shown by the broken line in FIG.
しかし、第４図の回路構成では、必要なｌ）−ド端子は
共通アノード１本、共通コレクタ１本、エミッタ４本及
びカソード４本の計１０端子あれば電気的な機構を満す
ことができる。ところが、従来の方法では第２図に示す
ように計１６端子の外部に取り出せるパッケージサイズ
が必要となる。この為、６端子分だけパッケージサイズ
が大きくなる欠点があった。その上発光素子１のアノー
ド端子、受光素子４のコレクタ端子を／ｅ ７ケ一ゾ外
部で共通結線する場合、ノクソケージを搭載するプリン
ト基板等に予め布線を施しておけば大きな問題とはなら
ないがパッケージサイズが大きくなることはフ０リント
基板上の集積度が悪くなることとパッケージの伺利費の
価格高の要因となり、大きな問題となった。However, in the circuit configuration shown in Figure 4, the electrical structure can be satisfied with a total of 10 terminals (1 common anode, 1 common collector, 4 emitters, and 4 cathodes) required. can. However, as shown in FIG. 2, the conventional method requires a package size that allows a total of 16 terminals to be taken out. Therefore, there was a drawback that the package size was increased by 6 terminals. Furthermore, when connecting the anode terminal of the light-emitting element 1 and the collector terminal of the light-receiving element 4 in common outside the /e 7 case, it will not be a big problem if the wiring is done in advance on the printed circuit board etc. on which the Noxo cage is mounted. However, as the package size increases, the degree of integration on the printed circuit board deteriorates and the cost of purchasing the package increases, which has become a major problem.
（発明の目的）
本発明は、このような従来の欠点を除去するもので、マ
ルチチャンネルのホトカプラーを最小リード数で実現す
ることを目的とする。(Object of the Invention) The present invention aims to eliminate such conventional drawbacks and to realize a multi-channel photocoupler with a minimum number of leads.
（発明の構成）
本発明は受発光素子のそれぞれの一方の電極を・母、ケ
ージ内部で電気的に接続し、外部リードとして共通端子
をそれぞれ１本づつ導出するようにしたものである。(Structure of the Invention) In the present invention, one electrode of each of the receiving and emitting elements is electrically connected inside the cage, and one common terminal is led out from each as an external lead.
（実施例） 以丁本発明の一実施例を図面により詳細に説明する。(Example) An embodiment of the present invention will now be described in detail with reference to the drawings.
鼾５図は本発明光結合半導体装置の一実施例を示フー４
チャンネルホトカプラーの回路構成・端子接続図である
。図に示すようにこの回路構成は第２図の回路構成と同
じであるが、発光素子１（１ａ。Figure 5 shows an embodiment of the optically coupled semiconductor device of the present invention.
It is a circuit configuration and terminal connection diagram of a channel photocoupler. As shown in the figure, this circuit configuration is the same as the circuit configuration in FIG. 2, except that the light emitting element 1 (1a).
ｌｂ、Ｉｃ、ｌｄ）のアノード端子及び受光素子４（４
ａ 、４ｂ 、４ｃ 、４ｄ）のコレクタ端子をフレー
ムにて各々共通結線することにより１０端子で実現でき
るようにしたものである。なお、発光素子１側の端子を
Ｔ□〜Ｔ５で記述する。その中、Ｔ１． Ｔ２． Ｔ４
． Ｔ５はカソード取出し端子、Ｔ３はその共通アノー
ド取り出し端子である。−力受光素子４側の端子をＴ６
〜Ｔ１ｏで記述し、その中、Ｔ６゜Ｔ７ ＋ Ｔ９ ＋
ＴＩ Ｏはエミッタ取り出し端子、Ｔ８はその共通コ
レクタ取り出し端子である。lb, Ic, ld) and the light receiving element 4 (4
The collector terminals (a, 4b, 4c, 4d) are commonly connected to each other using a frame, so that ten terminals can be used. Note that the terminals on the light emitting element 1 side are described as T□ to T5. Among them, T1. T2. T4
．． T5 is a cathode extraction terminal, and T3 is its common anode extraction terminal. - Connect the terminal on the force photodetector 4 side to T6.
〜T1o, among which T6゜T7 + T9 +
TIO is an emitter take-out terminal, and T8 is its common collector take-out terminal.
次に、第６図は第５図の回路構成によるリードフレーム
の斜視図である。図においで９は発光素子１の４素子が
アノード端子を同一フレームにて共通結線できるリード
フレーム、１０は同じく受光素子４の４素子がコレクタ
端子を同一 フレームにて共通結線できるリードフレー
ムである。なお各フレーム９，１０を補強するための連
結金属片９ａ、１０ａのみ記述し、リードフレームの外
枠等は省略する。Next, FIG. 6 is a perspective view of a lead frame having the circuit configuration shown in FIG. 5. In the figure, numeral 9 denotes a lead frame to which the anode terminals of the four elements of the light-emitting element 1 can be commonly connected in the same frame, and numeral 10 denotes a lead frame to which the collector terminals of the four elements of the light-receiving element 4 can be commonly connected in the same frame. Note that only the connecting metal pieces 9a and 10a for reinforcing each frame 9 and 10 will be described, and the outer frame of the lead frame and the like will be omitted.
このリードフレーム９は端子Ｔ３に対応するフレーム９
３にて発光素子１の４素子を搭載することにより発光素
子１のアノード電極をフレーム９３に′「―気接続でき
、更に発光素子１のカソード電極を端子Ｔ、 、 Ｔ２
． Ｔ、 、 Ｔ５に対応するフレーム９５，９□。This lead frame 9 is a frame 9 corresponding to the terminal T3.
By mounting four elements of the light emitting element 1 at 3, the anode electrode of the light emitting element 1 can be connected to the frame 93, and the cathode electrode of the light emitting element 1 can be connected to the terminals T, , T2.
．． Frame 95, 9□ corresponding to T, , T5.
９４ ＋ ”５にそれぞれワイヤ接続することにより所
要 ′の電気接続ができるように各フレーム９．〜９５
を平行に突出せしめているがこれらはそれぞれに接触し
ないところで切断するものである。またフレーム９３の
みリードフレーム９のほぼ中心より発光素子１が充分搭
載できる幅を治しており、かつフレームの方向とは直角
方向に他のフレームの端面にほぼ達する丑で張り出させ
たものである。Connect each frame 9. to 95 so that the required electrical connections can be made by connecting wires to each frame 9. to 94 + 5.
are made to protrude in parallel, but these are to be cut where they do not touch each other. In addition, only the frame 93 has a width sufficient to mount the light emitting element 1 from approximately the center of the lead frame 9, and extends in a direction perpendicular to the direction of the frame, almost reaching the end face of the other frame. .
一方、リードフレーム１０もリードフレーム９と同様端
子Ｔ８に対応するフレーム１０３にて受光素子４の４素
子を搭載でき、かつ受光素子４のコレクタ電極をフレー
ム１０３に電気接続でき、更に受光素子４のエミ、り電
極を端子Ｔ６ ＋ Ｔ７ ＋ Ｔ９ ｊｌ Ｏに対応す
るフレーム１０□、１０□、 Ｚ ０４．１０．にワイ
ヤ接続して所要の電気接続ができるように構成される。On the other hand, like the lead frame 9, the lead frame 10 can also mount four elements of the light receiving element 4 on the frame 103 corresponding to the terminal T8, and the collector electrode of the light receiving element 4 can be electrically connected to the frame 103. Connect the emitter electrodes to the terminals T6 + T7 + T9 jl O corresponding to frames 10□, 10□, Z 04.10. is configured to allow wire connections to be made to make the necessary electrical connections.
ソシて覚光素子用リードフレーム９のフレーム９３に相
対する各々の受光素子４に対向するように配慮して所要
の位置に発光素子１を４素子ダイスボンドで搭載して、
発光素子１のアノード電極側を共通接続し、しかる後発
光素子１表面のカソード電極とフレーム９□、９□＋
９４ ＋ ９５とをワイヤ接続にて電気接続する。The light emitting element 1 is mounted at a required position using a four-element die bond so that it faces each of the light receiving elements 4 facing the frame 93 of the lead frame 9 for the light sensing element.
The anode electrode sides of the light emitting element 1 are commonly connected, and then the cathode electrode on the surface of the light emitting element 1 and the frames 9□, 9□+
94 + 95 are electrically connected by wire connection.
次に、別途受光素子用リードフレームｉｏの７レーム１
０３に相当する各々の発光素子１に対向するように配慮
した所望の位置に受光素子４を４亮子ダイスボンドで搭
載して受光素子４のコレクター電極側を共通接続し、し
かる後受光素子４表面のエミッタ電極とフレーム１０．
．２０２，１０４，７０５とをワイヤ接続にて電気接続
する。Next, 7 frames 1 of the lead frame io for the light-receiving element are prepared separately.
The light-receiving elements 4 are mounted at a desired position facing each light-emitting element 1 corresponding to 03 using a four-layer die bond, the collector electrode sides of the light-receiving elements 4 are commonly connected, and then the surface of the light-receiving elements 4 is Emitter electrode and frame 10.
．． 202, 104, and 705 are electrically connected by wire connection.
以上説明して搭載方法はダイスボンド時に素子裏面の電
極とフレームとを電気的に導通恥ぜる例で説明したが、
素子電極がすべて表面にある場合は、フレームに素子搭
載の後ワイヤ接続にてフレームと電気接続させることも
できる。The mounting method has been explained above using an example in which the electrode on the back of the element and the frame are electrically connected during die bonding.
If all the element electrodes are on the surface, the element can be electrically connected to the frame by wire connection after mounting the element on the frame.
この様に各々４素子に所要の電気接続を施した各フレー
ム上の受発光素子４．ｉが正対する様に対向させ、各発
光素子１と各受光素子４との間に光結合効率を向上させ
るため、透明シリコン樹脂等を挿入し、トランスファモ
ールド等で４ｆＬｊ Ｉ＋＝ 成形し、各フレームを補
強している連結金属片９ａ。In this way, the four elements each have the required electrical connections. In order to improve the optical coupling efficiency between each light emitting element 1 and each light receiving element 4, the light emitting elements 1 and each light receiving element 4 are placed so that they face each other so that they face each other, and a transparent silicone resin or the like is inserted between them, and the 4fLj I+= molding is performed using a transfer mold or the like, and each frame is The connecting metal piece 9a reinforcing the.
１０ａを除去すれば、１０端子にて４チヤンネルのホト
カプラーが完成する。If 10a is removed, a 4-channel photocoupler with 10 terminals is completed.
以上の説明では共通結線する為のフレーム９３゜１０３
は、外部取り出し端子の中央部に配設したが、素子搭載
時に問題が発生しない範囲で他の位置に設置してもよい
。又本発明は発光素子側又は受光素子側のみ共、１ｌｊ
）結線する為のフレームを有するホトカプラーにも適用
されることは勿論のことである。In the above explanation, the frame 93°103 is used for common wiring.
is disposed at the center of the external take-out terminal, but it may be disposed at any other position as long as no problem occurs when mounting the element. In addition, the present invention applies only to the light-emitting element side or the light-receiving element side.
) Of course, it is also applicable to photocouplers that have a frame for connecting wires.
（発明の効果）
以上評細に説明したように本発明によれば共通結線を有
するマルチチャンネルのホトカプラーを最小ψ１′品子
数で形成することができるようになり従来よシも小型で
、かつ低価格化が可能となる効果がある。(Effects of the Invention) As described in detail above, according to the present invention, a multi-channel photocoupler having a common connection can be formed with a minimum number of ψ1' components, and is smaller than the conventional one. This has the effect of making it possible to lower prices.
第１図は１チヤ／ネルにおけるホトカプラーの回路構成
図、框２図は従来の４チヤンネルにおけるポトカフ０ラ
ーの端子接続図、第３図は同じくそのリードフレームの
斜視図、第４図は本発明の４チヤンネルホトカゾラーの
回路構成図、第５図は同じくその回路構成・端子接続図
、第６図は同じくそのリードフレームの斜視図である。
１（１ａ、ｉｂ、ｚｃ、 １ｄ）−・発光素子、４（４
ａ 、 ４ｂ 、 ４ｃ 、 ４ｄ ）−受光素子、９
・発行素子側のリードフレーム、ｌｏ・・受光素子側の
リードフレーム、９ａ、１０ａ ・連結金属片、ＴＩ”
’ＴＩＱ・・・端子。
第１図
第２図
第３図
第 ４ 図
第５図
第６図
／ＤｒFigure 1 is a circuit configuration diagram of a photocoupler for 1 channel/channel, Figure 2 is a terminal connection diagram of a conventional 4-channel potcoupler, Figure 3 is a perspective view of the lead frame, and Figure 4 is the invention of the present invention. FIG. 5 is a diagram of the circuit configuration and terminal connections of the four-channel photocoupler, and FIG. 6 is a perspective view of the lead frame. 1 (1a, ib, zc, 1d)--Light emitting element, 4 (4
a, 4b, 4c, 4d)-light receiving element, 9
・Lead frame on the emitting element side, lo...Lead frame on the light receiving element side, 9a, 10a ・Connection metal piece, TI"
'TIQ... terminal. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6/Dr.
Claims (1)
前記リードの容器内端部に、受光及び発光素子が搭載さ
れ、この両者を所定間隔をもって正対して配置して成る
光結合半導体装置に於て、前記受発光素子搭載リードは
、受光及び発光素子をそれぞれ共通表面に複数個搭載で
きるスペースを有し、このスペースに搭載された複数の
前記受光素子の一方の電極の各々及び同じく複数の前記
発光素子の一方の電極の各々は、前記容器内で該搭載リ
ードと共通接続された事を特徴とする光結In an optically coupled semiconductor device, a light-receiving and a light-emitting element are mounted on the inner end of a selected external lead from among a plurality of external leads protruding from a surrounding container, and these elements are arranged facing each other with a predetermined interval. The light receiving/emitting element mounting lead has a space in which a plurality of light receiving and light emitting elements can be mounted on a common surface, and each of one electrode of the plurality of light receiving elements mounted in this space and one electrode of the plurality of light receiving elements mounted in this space and a plurality of the same A photocoupler characterized in that each of one electrode of the light emitting element is commonly connected to the mounting lead within the container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58176339A JPS6068678A (en) | 1983-09-26 | 1983-09-26 | Photocoupling semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58176339A JPS6068678A (en) | 1983-09-26 | 1983-09-26 | Photocoupling semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6068678A true JPS6068678A (en) | 1985-04-19 |
Family
ID=16011850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58176339A Pending JPS6068678A (en) | 1983-09-26 | 1983-09-26 | Photocoupling semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6068678A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0463656U (en) * | 1990-10-12 | 1992-05-29 | ||
| US5629534A (en) * | 1994-03-23 | 1997-05-13 | Nippondenso Co., Ltd. | Semiconductor device |
| WO2011060747A1 (en) * | 2009-11-23 | 2011-05-26 | 亿广科技(上海)有限公司 | Photo-coupler |
| US20130175679A1 (en) * | 2007-12-13 | 2013-07-11 | Cheng-Hong Su | Optoisolator leadframe assembly |
-
1983
- 1983-09-26 JP JP58176339A patent/JPS6068678A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0463656U (en) * | 1990-10-12 | 1992-05-29 | ||
| US5629534A (en) * | 1994-03-23 | 1997-05-13 | Nippondenso Co., Ltd. | Semiconductor device |
| US20130175679A1 (en) * | 2007-12-13 | 2013-07-11 | Cheng-Hong Su | Optoisolator leadframe assembly |
| US8853837B2 (en) * | 2007-12-13 | 2014-10-07 | Lite-On Electronics (Guangzhou) Limited | Optoisolator leadframe assembly |
| WO2011060747A1 (en) * | 2009-11-23 | 2011-05-26 | 亿广科技(上海)有限公司 | Photo-coupler |
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