JPS59131164U - Flat package IC - Google Patents
Flat package ICInfo
- Publication number
- JPS59131164U JPS59131164U JP2391283U JP2391283U JPS59131164U JP S59131164 U JPS59131164 U JP S59131164U JP 2391283 U JP2391283 U JP 2391283U JP 2391283 U JP2391283 U JP 2391283U JP S59131164 U JPS59131164 U JP S59131164U
- Authority
- JP
- Japan
- Prior art keywords
- flat package
- circuit board
- printed circuit
- electrode terminals
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のフラットパッケージICの平面図、第2
図はそのプリント基板への取付は状態を示す側断面図、
第3図はこの考案になるフラットパッケージICをプリ
ント基板に取付けた状態の実施例を示す平面図、第4図
は第3図のA−A′線における側断面図、第5図は電極
端子および位置決め端子の同時成形手段の一例を示す金
属板の平面図である。
1・・・フラットパッケージIC,2,3・・・電極端
子、4・・・プリント基板、5・・・導電パターン、7
・・・位置決め端子、8・・・位置決め孔。Figure 1 is a plan view of a conventional flat package IC, Figure 2 is a plan view of a conventional flat package IC.
The figure is a side sectional view showing how it is installed on the printed circuit board.
Fig. 3 is a plan view showing an embodiment of the flat package IC of this invention attached to a printed circuit board, Fig. 4 is a side sectional view taken along line A-A' in Fig. 3, and Fig. 5 is an electrode terminal. FIG. 3 is a plan view of a metal plate showing an example of means for simultaneously forming positioning terminals. DESCRIPTION OF SYMBOLS 1... Flat package IC, 2, 3... Electrode terminal, 4... Printed circuit board, 5... Conductive pattern, 7
...Positioning terminal, 8...Positioning hole.
Claims (1)
ージICにおいて、これら複数の電極端子とプリント基
板上の複数の導電パターンとをそれぞれ合致させるため
に、あらかじめプリント基板に設けた位置決め孔に挿入
する位置決め端子を付設させたことを特徴とするフラッ
トパッケージC0In a flat package IC having a plurality of electrode terminals arranged in parallel with each other, a positioning terminal is inserted into a positioning hole previously provided on a printed circuit board in order to match the plurality of electrode terminals with a plurality of conductive patterns on the printed circuit board. A flat package C0 characterized by the addition of
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2391283U JPS59131164U (en) | 1983-02-21 | 1983-02-21 | Flat package IC |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2391283U JPS59131164U (en) | 1983-02-21 | 1983-02-21 | Flat package IC |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59131164U true JPS59131164U (en) | 1984-09-03 |
Family
ID=30154979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2391283U Pending JPS59131164U (en) | 1983-02-21 | 1983-02-21 | Flat package IC |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59131164U (en) |
-
1983
- 1983-02-21 JP JP2391283U patent/JPS59131164U/en active Pending
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