JPS58158466U - Printed circuit board for IC mounting - Google Patents
Printed circuit board for IC mountingInfo
- Publication number
- JPS58158466U JPS58158466U JP5420182U JP5420182U JPS58158466U JP S58158466 U JPS58158466 U JP S58158466U JP 5420182 U JP5420182 U JP 5420182U JP 5420182 U JP5420182 U JP 5420182U JP S58158466 U JPS58158466 U JP S58158466U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hole
- mounting
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はフラットパッケージ型ＩＣの平面図、第２図は
同ＩＣの従来の取付状態を示す断面図、第３図はこの考
案になるプリント基板へのＩＣ取 、行状態を示す平
面図、第４図は第３図をＡ−Ａ′線方向に見た断面図そ
ある。
１ ”−−−−−−フラットパッケージ型ＩＣ１２，２
，〜２゜・・・・・・端子、３．３１〜３ｎ・・・・・
・端子、７・・・・・・プリント基板、８・・・・・・
透孔、９・・・・・・銅箔パターン、１０・・・・・・
半田付。Fig. 1 is a plan view of a flat package type IC, Fig. 2 is a sectional view showing the conventional mounting state of the IC, and Fig. 3 is a plan view showing the mounting state of the IC on a printed circuit board according to this invention. FIG. 4 is a sectional view of FIG. 3 taken along line A-A'. 1 ”------Flat package type IC12,2
,~2゜・・・Terminal, 3.31～3n・・・・・・
・Terminal, 7... Printed circuit board, 8...
Through hole, 9...Copper foil pattern, 10...
With soldering.
Claims (1)
子の垂下部分の間隔よりはやや小さい長辺間の内寸法と
、ＩＣの長さよりはやや大きい短辺間の内寸法とをもつ
矩形の透孔をプリント基板に設け、フラットパッケージ
型ＩＣを上記透孔に挿通した場合に上記それぞれの端子
の弾性作用によってＩｃが透孔内に自己保持されるとと
もに、これら各端子と上記透孔の周辺部に形成された銅
箔パターンとの間に電気的接触が得られるように構成し
たＩＣ取付用のプリント基板。A rectangular through hole with an inner dimension between the long sides that is slightly smaller than the interval between the hanging parts of the multiple terminals protruding on both sides of the flat package IC, and an inner dimension between the short sides that is slightly larger than the length of the IC. is provided on the printed circuit board, and when a flat package type IC is inserted into the through hole, the IC is self-retained in the through hole by the elastic action of each of the above terminals, and the surrounding area of each of these terminals and the through hole is A printed circuit board for mounting an IC configured so that electrical contact can be obtained between the formed copper foil pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5420182U JPS58158466U (en) | 1982-04-14 | 1982-04-14 | Printed circuit board for IC mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5420182U JPS58158466U (en) | 1982-04-14 | 1982-04-14 | Printed circuit board for IC mounting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58158466U true JPS58158466U (en) | 1983-10-22 |
Family
ID=30064831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5420182U Pending JPS58158466U (en) | 1982-04-14 | 1982-04-14 | Printed circuit board for IC mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58158466U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5446373A (en) * | 1977-09-21 | 1979-04-12 | Hitachi Ltd | Mounting board and electronic parts to be attached thereto |
-
1982
- 1982-04-14 JP JP5420182U patent/JPS58158466U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5446373A (en) * | 1977-09-21 | 1979-04-12 | Hitachi Ltd | Mounting board and electronic parts to be attached thereto |
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