JPS59130435A - 超音波ワイヤボンダ用ウエツジ - Google Patents

超音波ワイヤボンダ用ウエツジ

Info

Publication number
JPS59130435A
JPS59130435A JP58172942A JP17294283A JPS59130435A JP S59130435 A JPS59130435 A JP S59130435A JP 58172942 A JP58172942 A JP 58172942A JP 17294283 A JP17294283 A JP 17294283A JP S59130435 A JPS59130435 A JP S59130435A
Authority
JP
Japan
Prior art keywords
wire
wedge
ultrasonic
guide hole
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58172942A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6135698B2 (enrdf_load_stackoverflow
Inventor
Shunichiro Fujioka
俊一郎 藤岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58172942A priority Critical patent/JPS59130435A/ja
Publication of JPS59130435A publication Critical patent/JPS59130435A/ja
Publication of JPS6135698B2 publication Critical patent/JPS6135698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58172942A 1983-09-21 1983-09-21 超音波ワイヤボンダ用ウエツジ Granted JPS59130435A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58172942A JPS59130435A (ja) 1983-09-21 1983-09-21 超音波ワイヤボンダ用ウエツジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58172942A JPS59130435A (ja) 1983-09-21 1983-09-21 超音波ワイヤボンダ用ウエツジ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP51121925A Division JPS6020894B2 (ja) 1976-10-13 1976-10-13 超音波ワイヤボンダ用ウエツジ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP11400185A Division JPS6127647A (ja) 1985-05-29 1985-05-29 超音波ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS59130435A true JPS59130435A (ja) 1984-07-27
JPS6135698B2 JPS6135698B2 (enrdf_load_stackoverflow) 1986-08-14

Family

ID=15951204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58172942A Granted JPS59130435A (ja) 1983-09-21 1983-09-21 超音波ワイヤボンダ用ウエツジ

Country Status (1)

Country Link
JP (1) JPS59130435A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485949A (en) * 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03162899A (ja) * 1989-11-22 1991-07-12 Naomoto Kogyo Kk ラペル成型プレス装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485949A (en) * 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary

Also Published As

Publication number Publication date
JPS6135698B2 (enrdf_load_stackoverflow) 1986-08-14

Similar Documents

Publication Publication Date Title
US3623649A (en) Wedge bonding tool for the attachment of semiconductor leads
KR19980079450A (ko) 와이어 본딩방법
JPS59130435A (ja) 超音波ワイヤボンダ用ウエツジ
US5503321A (en) Bonding tool employed in ultrasonic compression bonding apparatus
JPS6127647A (ja) 超音波ワイヤボンデイング方法
JPS5865525A (ja) ダイ
JPS6020894B2 (ja) 超音波ワイヤボンダ用ウエツジ
JPS58143A (ja) 超音波ワイヤボンデイング方法
JPS6345001Y2 (enrdf_load_stackoverflow)
JPH054814B2 (enrdf_load_stackoverflow)
JP2944592B2 (ja) リードの切断装置
JPS6143857B2 (enrdf_load_stackoverflow)
JPS58148432A (ja) ワイヤボンデイング方法
KR200141172Y1 (ko) 와이어 본딩용 캐필러리의 결합구조
JPH0878590A (ja) リードフレーム
JPH0465537B2 (enrdf_load_stackoverflow)
JPH05860B2 (enrdf_load_stackoverflow)
JPH0322450A (ja) 半導体製造装置
JPS5930536Y2 (ja) 半導体装置製造用ボンディング装置
JPH0333656Y2 (enrdf_load_stackoverflow)
JPH0424930A (ja) ボンディングツール
JPH04249331A (ja) ワイヤ接合方法およびボンディングツール
JPH11135534A (ja) 半導体装置
JPH0582598A (ja) ワイヤボンダ
JPS5995021A (ja) 調理刃の製造法