JPS59126399A - Manufacture of electrode of ceramic electric component - Google Patents
Manufacture of electrode of ceramic electric componentInfo
- Publication number
- JPS59126399A JPS59126399A JP58000527A JP52783A JPS59126399A JP S59126399 A JPS59126399 A JP S59126399A JP 58000527 A JP58000527 A JP 58000527A JP 52783 A JP52783 A JP 52783A JP S59126399 A JPS59126399 A JP S59126399A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- metal
- connecting conductor
- external connecting
- zinc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 238000005476 soldering Methods 0.000 claims abstract description 11
- 239000004020 conductor Substances 0.000 claims abstract description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052725 zinc Inorganic materials 0.000 abstract description 6
- 239000011701 zinc Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 239000003638 chemical reducing agent Substances 0.000 abstract description 2
- 239000008139 complexing agent Substances 0.000 abstract description 2
- 229910000365 copper sulfate Inorganic materials 0.000 abstract description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract 2
- 238000001035 drying Methods 0.000 abstract 1
- 229910052573 porcelain Inorganic materials 0.000 abstract 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- -1 dried Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は１例えば小型電子機器に用いられるセラミック
電子部品の電極製造法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing electrodes of ceramic electronic components used, for example, in small electronic devices.
近年、セラミック電気部品の電極材料として、亜鉛、銅
、ニッケル、アルミニウム等の卑金属材料が使用される
ようになったが、これ等の材料は大気中で焼付けた時、
導電性を有するもののけんだ濡れ性が非常に悪いため、
該電極に外部接続リードをはんだ付けする場合には、該
１Ａ゛１極表面をはんだ濡れ性を良くするために該材料
を還元雰囲気で焼付けたり、大気中で焼付けた稜メッキ
処理等を行なっていた。これ岬の方法によれば、電極全
面に亘ってはんだ瀝れ性が良好になるが、肢電極上の所
定位置のと（狭小の部分に外部接続リードをはんだ付け
することが要求される場合、すなわち例えば１０Ｈφの
工うに小型セラミック電気部品において電極上のはんだ
付は位置及びその大きさく例えば２ Ｊ）Ｉφ以下）全
厳格に規定される場合には、電極のはんだ付けしない個
所にレジストを塗布していたため工程が煩雑である不都
合が存し九本発明はかかる不都合を無くすことをその目
的としたもので、セラミック体の所定位置にはんだ濡れ
性の悪い金属電極が被着されたセラミック電気部品にお
いて、該金属電極上の所定の局部にはんだ濡れ性の良好
な金属を含むメッキ液を滴下し、該局部に外部接続導体
はんだ付は部を形成したことを特徴とする。In recent years, base metal materials such as zinc, copper, nickel, and aluminum have come to be used as electrode materials for ceramic electrical components, but when baked in the atmosphere, these materials
Although it has conductivity, its wettability is very poor.
When soldering an external connection lead to the electrode, the material should be baked in a reducing atmosphere or edge plating treated in the air to improve solder wettability on the surface of the 1A single electrode. Ta. According to Misaki's method, the solderability is good over the entire surface of the electrode. In other words, if the position and size of soldering on an electrode in a small ceramic electrical component of, for example, 10Hφ is strictly regulated, a resist should be applied to the non-soldered parts of the electrode. Therefore, the present invention aims to eliminate such disadvantages, and it is an object of the present invention to provide a ceramic electrical component in which a metal electrode with poor solderability is adhered to a predetermined position of a ceramic body. , a plating solution containing a metal with good solder wettability is dropped onto a predetermined local part of the metal electrode, and an external connection conductor soldering part is formed in the local part.
以下本発明の実施例を図面につき説明する。Embodiments of the present invention will be described below with reference to the drawings.
図面は５本発明の製造法によって作られた例えば圧電ブ
ザに用いられる圧電磁器板を示す。The drawings show a piezoelectric ceramic plate used, for example, in a piezoelectric buzzer, manufactured by the manufacturing method of the present invention.
同図において、セラミック体（１）はｐｂ （ＺｒＴｉ
）０３を主成分とする高い圧電性を示す磁器で、形状
は工〇−φ、０．２ａｔｉの厚さを有する。該セラミッ
ク体（１）の１面にスクリーン印刷法にエフ亜鉛（Ｚｎ
）ヘーストを塗布して乾燥後、６００℃の大気中にて焼
付け、はんだ濡れ性の非常に悪い亜鉛電極（２）を形成
させ、これを洗浄して７０℃にη口熱し、該電極（２）
の所定の局所に、硫酸銅を主成分とし％還元剤、錯化剤
を添加したメッキ液を例えばスポイトを用いて滴下し、
約１分後反応が終ったら純水で洗浄して乾燥し、はんだ
濡れ性の良い金Ｎ （３）を被着させ、外部接続導体は
んだ付は都を形成した。反対間についても同様の処理ｔ
ａして亜鉛電極（２）及びはんだ瀝れ性の良い外部接続
導体はんだ付は用金属（３）でおる銅を被着させた。In the figure, the ceramic body (1) is made of pb (ZrTi
)03 as a main component and exhibits high piezoelectricity, and has a shape of 〇-φ and a thickness of 0.2ati. F-zinc (Zn) was applied on one side of the ceramic body (1) by screen printing.
) Haste was applied and dried, and then baked in the atmosphere at 600°C to form a zinc electrode (2) with very poor solder wettability, which was washed and heated to 70°C to form a zinc electrode (2). )
Using a dropper, for example, drop a plating solution containing copper sulfate as the main component and a reducing agent and a complexing agent onto a predetermined location.
When the reaction was completed after about 1 minute, it was washed with pure water, dried, and gold N (3) with good solder wettability was applied, and the external connection conductor was soldered. The same process is done for the opposite space.
Then, a zinc electrode (2) and a metal (3) for soldering an external connection conductor with good solderability were deposited.
下表は前記セラミック体に前記メッキ液を０．５ｔｍ”
、 ９ ｍ”と針を変えて滴下し、銅メツキ面積を変
えた２種の圧電磁器板Ａ、Ｂと、前記メッキ液を２００
關８ を滴下して電極全面に銅メッキし、スクリーン印
刷にエフ外部接続導体はんだ付は部の２Ｒφを残してレ
ジストを塗布して乾燥した圧電磁器板０（各１刺１０個
）とについて、その比誘電率ε、電気機械結合係数に、
を測定した結果を示す。The table below shows 0.5tm of the plating solution applied to the ceramic body.
, 9 m'' with different needles, and the plating solution was applied to two types of piezoelectric ceramic plates A and B with different copper plating areas and 200 m of the above plating solution.
Regarding the piezoelectric ceramic plate 0 (10 pieces each), which was dripped with copper to plate the entire surface of the electrode, screen printed, and applied resist leaving 2Rφ for external connection conductor soldering, and dried. Its relative dielectric constant ε, electromechanical coupling coefficient,
The results are shown below.
尚、前記圧電磁器板についての分極処理１７ｊ、外部接
続導体はんだ付は前に１２０℃、２ＫＶ／１１１１ で
２時間行なった。Incidentally, the polarization treatment 17j and the soldering of external connection conductors on the piezoelectric ceramic plate were previously carried out at 120° C. and 2 KV/1111 for 2 hours.
以上のように、本発明による圧電磁器板（Ａ、Ｂ）の電
極のはんだ付は面積はレジスト塗布にＪ：りはんだ付は
面積を規制した場合とほぼ同等にでき、また、その特性
もはソ同吟にすることができた。As described above, the soldering area of the electrodes of the piezoelectric ceramic plates (A, B) according to the present invention can be almost the same as when the area is restricted by resist coating, and the characteristics are also the same. I was able to make it a so-dougin.
このように本発明によるときは、セラミック璽気部品に
おけるセラミック体に被着されたはんだ濡れ性の悪い金
属電極上の所定の局部に、はんだ濡れ性の良好な金属を
含むメッキ液を滴下し、該局部に外部接続導体はんだ付
は部を形成したので、従来の方法に比べて製造工程が簡
単になると共にはんだ濡れ性の良好な金属が節減でき、
また、製造時間を短縮できる等の効果を有する。As described above, according to the present invention, a plating solution containing a metal with good solder wettability is dropped onto a predetermined local area on a metal electrode with poor solder wettability attached to a ceramic body of a ceramic plating component, Since the external connection conductor soldering part is formed in the local part, the manufacturing process is simplified compared to the conventional method, and the metal with good solder wettability can be saved.
It also has the effect of shortening manufacturing time.
第１図及び笛２図は本発明の製造法により電極が作成さ
れた圧電磁器板の側面図及び平面図を示す。
（１）・・・セラミック体
（２）・・・はんだ濡れ性の悪い金属電極（３）・・・
はんだ濡れ性の良い金属
特許出願人 太陽誘電株式会社FIG. 1 and FIG. 2 show a side view and a plan view of a piezoelectric ceramic plate on which electrodes are made by the manufacturing method of the present invention. (1)...Ceramic body (2)...Metal electrode with poor solder wettability (3)...
Patent applicant for metal with good solder wettability Taiyo Yuden Co., Ltd.
Claims (1)
極が被着されたセラミック電気部品において、該金属電
極上の所定の局部にはんだ漁れ性の良好な金属を含むメ
ッキ液を滴下し、該局部に外部接続導体はんだ付は部を
形成したことを特徴とするセラミック電気部品の電極製
造法。The solder wettability of the metal is placed in a predetermined position on the ceramic body.
In a ceramic electrical component to which an electrode is attached, a plating solution containing a metal with good solder repellency is dropped onto a predetermined local area on the metal electrode, and an external connection conductor soldering area is formed in the local area. Features: Electrode manufacturing method for ceramic electrical components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58000527A JPS59126399A (en) | 1983-01-07 | 1983-01-07 | Manufacture of electrode of ceramic electric component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58000527A JPS59126399A (en) | 1983-01-07 | 1983-01-07 | Manufacture of electrode of ceramic electric component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59126399A true JPS59126399A (en) | 1984-07-20 |
Family
ID=11476238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58000527A Pending JPS59126399A (en) | 1983-01-07 | 1983-01-07 | Manufacture of electrode of ceramic electric component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59126399A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0466899U (en) * | 1990-10-19 | 1992-06-12 | ||
| CN106402620A (en) * | 2016-11-25 | 2017-02-15 | 哈尔滨工业大学 | Patting-type piezoelectric driving micro-jet lubrication device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5421296A (en) * | 1977-07-19 | 1979-02-17 | Citizen Watch Co Ltd | Piezoelectric sound body |
| JPS5754393U (en) * | 1980-09-11 | 1982-03-30 |
-
1983
- 1983-01-07 JP JP58000527A patent/JPS59126399A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5421296A (en) * | 1977-07-19 | 1979-02-17 | Citizen Watch Co Ltd | Piezoelectric sound body |
| JPS5754393U (en) * | 1980-09-11 | 1982-03-30 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0466899U (en) * | 1990-10-19 | 1992-06-12 | ||
| CN106402620A (en) * | 2016-11-25 | 2017-02-15 | 哈尔滨工业大学 | Patting-type piezoelectric driving micro-jet lubrication device |
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