JPS59124564A - ウェーハ固定用ワックス張り具およびこれを用いたウェーハのワックス付け方法 - Google Patents

ウェーハ固定用ワックス張り具およびこれを用いたウェーハのワックス付け方法

Info

Publication number
JPS59124564A
JPS59124564A JP57228591A JP22859182A JPS59124564A JP S59124564 A JPS59124564 A JP S59124564A JP 57228591 A JP57228591 A JP 57228591A JP 22859182 A JP22859182 A JP 22859182A JP S59124564 A JPS59124564 A JP S59124564A
Authority
JP
Japan
Prior art keywords
wax
wafer
waxing
tool
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57228591A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0424188B2 (enrdf_load_stackoverflow
Inventor
Kiyoshige Miyawaki
清茂 宮脇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP57228591A priority Critical patent/JPS59124564A/ja
Publication of JPS59124564A publication Critical patent/JPS59124564A/ja
Publication of JPH0424188B2 publication Critical patent/JPH0424188B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP57228591A 1982-12-28 1982-12-28 ウェーハ固定用ワックス張り具およびこれを用いたウェーハのワックス付け方法 Granted JPS59124564A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57228591A JPS59124564A (ja) 1982-12-28 1982-12-28 ウェーハ固定用ワックス張り具およびこれを用いたウェーハのワックス付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57228591A JPS59124564A (ja) 1982-12-28 1982-12-28 ウェーハ固定用ワックス張り具およびこれを用いたウェーハのワックス付け方法

Publications (2)

Publication Number Publication Date
JPS59124564A true JPS59124564A (ja) 1984-07-18
JPH0424188B2 JPH0424188B2 (enrdf_load_stackoverflow) 1992-04-24

Family

ID=16878756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57228591A Granted JPS59124564A (ja) 1982-12-28 1982-12-28 ウェーハ固定用ワックス張り具およびこれを用いたウェーハのワックス付け方法

Country Status (1)

Country Link
JP (1) JPS59124564A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002004171A1 (en) * 2000-07-06 2002-01-17 Memc Electronic Materials, Inc. Method and apparatus for heating a polishing block
CN106625205A (zh) * 2015-10-30 2017-05-10 北京实验工厂 伺服机构滚轴传动活塞杆方孔的研磨工装和研磨方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111993A (en) * 1975-03-27 1976-10-02 Supiide Fuamu Kk Apparatus for fabricating thin work as semiconductor or the like
JPS5311432A (en) * 1976-07-19 1978-02-01 Hitachi Ltd Automotive fuel consumption rate indicator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111993A (en) * 1975-03-27 1976-10-02 Supiide Fuamu Kk Apparatus for fabricating thin work as semiconductor or the like
JPS5311432A (en) * 1976-07-19 1978-02-01 Hitachi Ltd Automotive fuel consumption rate indicator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002004171A1 (en) * 2000-07-06 2002-01-17 Memc Electronic Materials, Inc. Method and apparatus for heating a polishing block
CN106625205A (zh) * 2015-10-30 2017-05-10 北京实验工厂 伺服机构滚轴传动活塞杆方孔的研磨工装和研磨方法

Also Published As

Publication number Publication date
JPH0424188B2 (enrdf_load_stackoverflow) 1992-04-24

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