JPS59121890A - セラミツクスと金属との接合体 - Google Patents

セラミツクスと金属との接合体

Info

Publication number
JPS59121890A
JPS59121890A JP22722182A JP22722182A JPS59121890A JP S59121890 A JPS59121890 A JP S59121890A JP 22722182 A JP22722182 A JP 22722182A JP 22722182 A JP22722182 A JP 22722182A JP S59121890 A JPS59121890 A JP S59121890A
Authority
JP
Japan
Prior art keywords
metal
ceramic
plate
metal plate
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22722182A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0351119B2 (enrdf_load_stackoverflow
Inventor
水野谷　信幸
小浜　一
杉浦　康之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP22722182A priority Critical patent/JPS59121890A/ja
Publication of JPS59121890A publication Critical patent/JPS59121890A/ja
Publication of JPH0351119B2 publication Critical patent/JPH0351119B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Structure Of Printed Boards (AREA)
JP22722182A 1982-12-28 1982-12-28 セラミツクスと金属との接合体 Granted JPS59121890A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22722182A JPS59121890A (ja) 1982-12-28 1982-12-28 セラミツクスと金属との接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22722182A JPS59121890A (ja) 1982-12-28 1982-12-28 セラミツクスと金属との接合体

Publications (2)

Publication Number Publication Date
JPS59121890A true JPS59121890A (ja) 1984-07-14
JPH0351119B2 JPH0351119B2 (enrdf_load_stackoverflow) 1991-08-05

Family

ID=16857389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22722182A Granted JPS59121890A (ja) 1982-12-28 1982-12-28 セラミツクスと金属との接合体

Country Status (1)

Country Link
JP (1) JPS59121890A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6459986A (en) * 1987-08-31 1989-03-07 Toshiba Corp Ceramic circuit board
JPS6461366A (en) * 1987-08-28 1989-03-08 Toshiba Corp Method for joining ceramic and metal together
JPH0268448U (enrdf_load_stackoverflow) * 1988-11-11 1990-05-24
US5100740A (en) * 1989-09-25 1992-03-31 General Electric Company Direct bonded symmetric-metallic-laminate/substrate structures
US5176309A (en) * 1990-05-25 1993-01-05 Kabushiki Kaisha Toshiba Method of manufacturing circuit board
JPH07193358A (ja) * 1992-12-17 1995-07-28 Dowa Mining Co Ltd セラミックス電子回路基板の製造方法
US5965193A (en) * 1994-04-11 1999-10-12 Dowa Mining Co., Ltd. Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material
EP1243569A2 (en) 1994-04-11 2002-09-25 Dowa Mining Co., Ltd. Electrical circuit having a metal-bonded-ceramic material or MBC component as an insulating substrate
JP2007165600A (ja) * 2005-12-14 2007-06-28 Omron Corp パワーモジュール構造及びこれを用いたソリッドステートリレー

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3529055B2 (ja) * 1994-05-18 2004-05-24 電気化学工業株式会社 絶縁放熱板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5443576A (en) * 1977-09-12 1979-04-06 Fujitsu Ltd Method of manufacturing printed board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5443576A (en) * 1977-09-12 1979-04-06 Fujitsu Ltd Method of manufacturing printed board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6461366A (en) * 1987-08-28 1989-03-08 Toshiba Corp Method for joining ceramic and metal together
JPS6459986A (en) * 1987-08-31 1989-03-07 Toshiba Corp Ceramic circuit board
JPH0268448U (enrdf_load_stackoverflow) * 1988-11-11 1990-05-24
US5100740A (en) * 1989-09-25 1992-03-31 General Electric Company Direct bonded symmetric-metallic-laminate/substrate structures
US5176309A (en) * 1990-05-25 1993-01-05 Kabushiki Kaisha Toshiba Method of manufacturing circuit board
US5280850A (en) * 1990-05-25 1994-01-25 Kabushiki Kaisha Toshiba Method of manufacturing circuit board
JPH07193358A (ja) * 1992-12-17 1995-07-28 Dowa Mining Co Ltd セラミックス電子回路基板の製造方法
US5965193A (en) * 1994-04-11 1999-10-12 Dowa Mining Co., Ltd. Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material
US6183875B1 (en) 1994-04-11 2001-02-06 Dowa Mining Co., Ltd. Electronic circuit substrates fabricated from an aluminum ceramic composite material
EP1243569A2 (en) 1994-04-11 2002-09-25 Dowa Mining Co., Ltd. Electrical circuit having a metal-bonded-ceramic material or MBC component as an insulating substrate
JP2007165600A (ja) * 2005-12-14 2007-06-28 Omron Corp パワーモジュール構造及びこれを用いたソリッドステートリレー

Also Published As

Publication number Publication date
JPH0351119B2 (enrdf_load_stackoverflow) 1991-08-05

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