JPS59121847A - Device for transferring semiconductor wafer - Google Patents
Device for transferring semiconductor waferInfo
- Publication number
- JPS59121847A JPS59121847A JP23401982A JP23401982A JPS59121847A JP S59121847 A JPS59121847 A JP S59121847A JP 23401982 A JP23401982 A JP 23401982A JP 23401982 A JP23401982 A JP 23401982A JP S59121847 A JPS59121847 A JP S59121847A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- positioning groove
- stage
- receiving element
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は半導体ウェハゾロセスにおいて、カセット及
び熱処理用テートの相互間で複数の半導体ウェハの移し
替えを行う半導体ウェハ移し替え装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor wafer transfer device that transfers a plurality of semiconductor wafers between a cassette and a heat treatment table in a semiconductor wafer processing system.
半導体装置の製造においては、半導体ウェノ・を拡散炉
内で表面全酸化させたシ、表面近傍に不純物を拡散させ
たシする熱処理工程が行われている。このような熱処理
工程を行う場合、半導体ウェハをカセットから熱処理用
の石英デートに移し替える必要がある。In the manufacture of semiconductor devices, a heat treatment process is carried out in which the entire surface of semiconductor wafer is oxidized in a diffusion furnace and impurities are diffused near the surface. When performing such a heat treatment process, it is necessary to transfer the semiconductor wafer from the cassette to a quartz date for heat treatment.
通常、この半導体ウェー・の移し替えは、カセットホル
ダを傾動させ、櫛状のガイド部を通して石英テートの湾
に立てかけることにより行っている。Normally, this transfer of semiconductor wafers is carried out by tilting the cassette holder and leaning it against the bay of the quartz tate through a comb-shaped guide.
ところで、この場合石英テートとカセットホルダのガイ
ド部との間に位置ずれが生じると、半導体ウェハを移し
替える際、石英？−トの溝部と半導体つ１−八との間で
摩擦が発生し、半導体ウェハに傷がつき、製造歩留シが
低下する。By the way, in this case, if a positional shift occurs between the quartz plate and the guide part of the cassette holder, when transferring the semiconductor wafer, the quartz plate or the guide part of the cassette holder may be misaligned. - Friction occurs between the groove portion of the sheet and the semiconductor chip 1-8, causing damage to the semiconductor wafer and reducing manufacturing yield.
この発明は上記実情Ｋｇみてなされたもので、その目的
は、半導体ウェハの移し替え位置を自動的に精度良く検
出し、半導体ウェハ内の傷の発生を防止でき、製造歩留
シを向上させることのできる半導体ウェハ移し替え装置
を提供することにある。This invention was made in consideration of the above-mentioned actual situation, and its purpose is to automatically detect the transfer position of a semiconductor wafer with high precision, prevent the occurrence of scratches in the semiconductor wafer, and improve manufacturing yield. An object of the present invention is to provide a semiconductor wafer transfer device that can perform the following steps.
この発明は、カセット及び熱処理用が一トの相互間で複
数の半導体ウェハの移し替えを行う半導体ウェハ移し替
え装置において、前記熱処理用デートに位置決め用溝を
設け、この位置決め用溝をセンサにより検出することに
より半導体ウェハの移し替えの最適位置を検出するもの
である。This invention provides a semiconductor wafer transfer device for transferring a plurality of semiconductor wafers between a cassette and a heat treatment date, in which a positioning groove is provided in the heat treatment date, and the positioning groove is detected by a sensor. By doing so, the optimum position for transferring the semiconductor wafer is detected.
以下、図面を参照してこの発明の一実施例を説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図において、１ノは固定台であり、この固定台１ノ
上には石英ボート１２が配置されている。この石英ｙｌ
ｒ −） １２には複数の半導体ウェハ１３，１３・・
・を立てかけるウェノ・保持用の溝と共に位置決め用溝
１４が形成されている。石英ｙｔ’−ト１２の下にはモ
ータ（図示せず）によシ石英ｙＮ−ト１２の長手方向に
沿って往復移動の可能なステー・ゾ１５が配置されてい
る。このステージ１５上には櫛状のガイド部を有するカ
セットホルダ（図示せず）が配置されている。半導体ウ
ェハはこのカセットホルダが傾動することにより、面状
のガイド部を通して石英？−ト１２に移し替えられるよ
うになっている。In FIG. 1, reference numeral 1 indicates a fixed base, and a quartz boat 12 is placed on the fixed base 1. This quartz yl
r −) 12 includes a plurality of semiconductor wafers 13, 13...
A positioning groove 14 is formed together with a groove for holding the weno on which the holder is propped up. A stay 15 is disposed below the quartz tray 12 and is movable back and forth along the longitudinal direction of the quartz tray 12 by a motor (not shown). A cassette holder (not shown) having a comb-shaped guide portion is arranged on the stage 15 . By tilting this cassette holder, the semiconductor wafer is passed through the planar guide section. - It can be transferred to port 12.
ステージ１５上には石英？−ト１２における位置決め用
溝１５を検出するためのセンサが配置されている。この
センサは第２図に拡大して示すように位置決め用溝１４
を間にして対向配置された発光素子１６及び受光素子１
７により考成されている。これら発光素子１６及び受光
素子１７は制御装置１８に内蔵されたマイクロコンピー
タにより制御され、発光素子１６から石英ｉｆ−ト１２
の位置決め用溝１４に向けて出力された・９ルス信号を
受光素子１７により受光するようになっている。Is there quartz on stage 15? - A sensor for detecting the positioning groove 15 in the seat 12 is arranged. This sensor has a positioning groove 14 as shown in an enlarged view in FIG.
A light emitting element 16 and a light receiving element 1 are arranged facing each other with
7. These light-emitting element 16 and light-receiving element 17 are controlled by a microcomputer built in a control device 18, and from the light-emitting element 16 to the quartz if-t
The light-receiving element 17 receives the .9 pulse signal output towards the positioning groove 14.
すなわち、この移し替え装置においては、ステージ１５
全モータによシ移動させながら、発光素子１６から・ぐ
ルス信号を送シ、石英ボート１２の位置決め用溝１４の
中央位置を検出し、ステージ１５の最適停止位置全決定
するものである。パルス信号は１回に数・ぐルスづつ送
られ、その送シ回数が制御装置１８内のマイクロコンピ
ュータによりカウントされるようになっている。受光素
子１７は、第３図に示すようにノクルス信号が位１Ｍ°
決め用溝１４内に入シ一端部を検出するとオンとなシ、
また位ｉ１決め用溝１４の外に出て他端部を検出すると
オフになる。オフになると、マイクロコンピュータでは
受光素子１７のオンとオフの間のパルス送り回数ｎ ト
１回の／Ｆルス数すとの積ｎＸｂによシ位置決め用溝１
４の幅ａを算出し、これを２分割して半導体ウェハの移
し替え位置を決定する。受光素子１７がオフになると、
マイクロコンピュータからの制御信号により、ステージ
１５は最初の位置に戻り、再度上記位置決め用溝１４を
分割して決定された移し替え位置まで移動し停止される
。ステージ１５が移し替え位置に停止されると、ステー
ジ１５上のカセットホルダが傾動し、櫛状のガイド部を
通って複数の半導体ウェハが同時に石英Ｍ−トＪ、？に
移し替えられる。That is, in this transfer device, stage 15
While moving the stage 15 using all the motors, a signal is sent from the light emitting element 16, the center position of the positioning groove 14 of the quartz boat 12 is detected, and the optimal stopping position of the stage 15 is determined. The pulse signal is sent several pulses at a time, and the number of times the pulse signal is sent is counted by a microcomputer in the control device 18. As shown in FIG.
When one end of the wire is detected in the determining groove 14, it turns on.
Further, when it goes outside the position i1 determining groove 14 and detects the other end, it is turned off. When the light receiving element 17 is turned off, the microcomputer calculates the positioning groove 1 according to the product nXb of the number of pulses sent between on and off of the light receiving element 17,
The width a of 4 is calculated, and this is divided into two to determine the transfer position of the semiconductor wafer. When the light receiving element 17 is turned off,
In response to a control signal from the microcomputer, the stage 15 returns to its initial position, moves again to the transfer position determined by dividing the positioning groove 14, and then stops. When the stage 15 is stopped at the transfer position, the cassette holder on the stage 15 is tilted, and a plurality of semiconductor wafers are simultaneously transferred through the comb-shaped guide section. be transferred to.
この移し替え装置においては、自動的に半導体ウェハの
移し替え位置を決定できるため位置決め精度が向上する
。すなわち、従来方法では位置決め精度が悪く、移し替
えの際に、半導体ウェハと石英ボートとの間で卓擦が発
生し、１枚の半導体ウェハ内に約４２個の傷が発生して
いたものが、約２個に減少し、第造歩留υが大幅に向上
した。In this transfer device, the transfer position of the semiconductor wafer can be automatically determined, so that the positioning accuracy is improved. In other words, with the conventional method, positioning accuracy was poor, and during transfer, table rubbing occurred between the semiconductor wafer and the quartz boat, resulting in approximately 42 scratches in one semiconductor wafer. , was reduced to approximately 2 pieces, and the manufacturing yield υ was significantly improved.
以上のようにこの発明によれば、半導体ウェハの移し替
え位置全自動的に精度良く検出することができるため、
半導体ウェハ内の傷の発生全防止でき、製造歩留りを大
幅に向上させることができる。As described above, according to the present invention, the transfer position of the semiconductor wafer can be detected fully automatically and with high precision.
It is possible to completely prevent the occurrence of scratches in semiconductor wafers, and to greatly improve manufacturing yields.
第１図はこの発明の一実施例に係る半導体つエバ７移し
替え装置の構成を示す平面図、第２図は上記装置におけ
る位置決め用溝の検出部の構成を示す図、第３図は同じ
く検出方法を示す図である。
ＩＪ・・・固定台、１２・・・石英＋ｔ” ）”、７
Ｊ・・・半導体ウェハ、１４・・・位置決め用溝、１５
・・・ステージ、１６・・・発光素子、１７・・・受光
素子、１８−・・・制御装置。FIG. 1 is a plan view showing the structure of a semiconductor evaporator 7 transfer device according to an embodiment of the present invention, FIG. 2 is a plan view showing the structure of a positioning groove detection section in the above device, and FIG. It is a figure showing a detection method. IJ...Fixed stand, 12...Quartz+t'')'', 7
J... Semiconductor wafer, 14... Positioning groove, 15
... Stage, 16... Light emitting element, 17... Light receiving element, 18-... Control device.
Claims (1)
ェハの移し替えを行う半導体ウェハ移し替え装置におい
て、前記熱処理用ボートを固定する固定台と、前記熱処
理用ボートに形成された位置決め用溝と、前記熱処理用
が一トの長手方向に沿って往復移動するステージと、こ
のステージの移動に伴い前記位置決め用溝を検出し、前
記半導体ウェハの移し替えの最適位置を検出する手段と
、前記ステージを前記移し替えの最適位置に停止させる
制御手段とを具備したことを特徴とする半導体ウェノ・
移し替え装置。In a semiconductor wafer transfer device that transfers a plurality of semiconductor wafers between a cassette and a heat treatment boat, the device includes: a fixing base for fixing the heat treatment boat; a positioning groove formed in the heat treatment boat; a stage for heat treatment that reciprocates along the longitudinal direction; means for detecting the positioning groove as the stage moves and detecting the optimum position for transferring the semiconductor wafer; A semiconductor weno device characterized by comprising a control means for stopping at an optimal position for transfer.
Transfer device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23401982A JPS59121847A (en) | 1982-12-27 | 1982-12-27 | Device for transferring semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23401982A JPS59121847A (en) | 1982-12-27 | 1982-12-27 | Device for transferring semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59121847A true JPS59121847A (en) | 1984-07-14 |
Family
ID=16964280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23401982A Pending JPS59121847A (en) | 1982-12-27 | 1982-12-27 | Device for transferring semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59121847A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230246A (en) * | 1987-11-06 | 1989-09-13 | Tel Sagami Ltd | Method and apparatus for transferring semiconductor wafer and heat treating boat for semiconductor wafer |
| JPH0297036A (en) * | 1988-10-03 | 1990-04-09 | Tel Sagami Ltd | Containing jig |
| JPH02284441A (en) * | 1989-04-26 | 1990-11-21 | Hitachi Ltd | Cassette transfer apparatus |
| KR100423844B1 (en) * | 1996-03-08 | 2004-07-01 | 삼성전자주식회사 | Photo-IC Card and Photo-IC Card Reader and Wafer Transfer System with them |
-
1982
- 1982-12-27 JP JP23401982A patent/JPS59121847A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230246A (en) * | 1987-11-06 | 1989-09-13 | Tel Sagami Ltd | Method and apparatus for transferring semiconductor wafer and heat treating boat for semiconductor wafer |
| JPH0297036A (en) * | 1988-10-03 | 1990-04-09 | Tel Sagami Ltd | Containing jig |
| JPH02284441A (en) * | 1989-04-26 | 1990-11-21 | Hitachi Ltd | Cassette transfer apparatus |
| KR100423844B1 (en) * | 1996-03-08 | 2004-07-01 | 삼성전자주식회사 | Photo-IC Card and Photo-IC Card Reader and Wafer Transfer System with them |
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