JPS59111841A - Metal-insulating resin group flitch - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a metal-insulating resin plywood used for electronic materials, particularly printed circuit boards, packages for semiconductor devices, and the like.

[Technical background of the invention and its problems]

In recent years, the miniaturization of electronic components has been remarkable, and there is a strong demand for miniaturization even in molded semiconductor devices, so manufacturing methods that do not use molding dies during resin molding have been adopted. There is.

That is, by chemically etching an insulating resin that can be chemically etched, such as a polyimide resin, which has a highly conductive metal layer that serves as an electrode plate, a package for accommodating a large number of semiconductor pellets and an electrode part are manufactured in the shape of a lead frame. A method has been proposed in which a semiconductor pellet is housed inside and connected to an electrode part, then filled with resin and cured, and then cut into individual pieces to obtain extremely small molded semiconductor elements. .

In order to carry out the above method, an insulating resin plate, for example a polyimide resin plate, which can be chemically etched and has a metal layer made of a highly conductive metal is required.

Conventionally, this polyimide resin plate is composed of a metal layer 1 having a thickness a of 50 to 100 μm and a polyimide resin layer 2 having a maximum thickness b of about 150 μm, as shown in FIG. There are n.

When the thickness of this polyimide resin/i12 becomes 150 μm or more, as shown in Fig. 2, the metal layer 1 is pushed outward due to the heat applied during molding (the difference in coefficient of thermal expansion between the two layers). I end up bending it. In such a case, the adhesive strength between the two layers becomes insufficient, and for example, when manufacturing a package for a semiconductor element by chemical etching as described above, the etching solution may enter between the two layers, resulting in a failure in the designed shape. Etching becomes difficult. In addition, the thickness of the polyimide resin layer 2 has been increased compared to the conventional one in order to improve the mechanical strength of the manufactured package, etc., which is not suitable due to the flatness required for the lead frame leaf material. I strongly hope that a thicker version will appear.

[Purpose of the invention]

The present invention was made based on the above circumstances.

To obtain a metal-insulating resin plywood whose polyimide resin layer has a thickness of at least 150 μm! purpose.

[Summary of the invention]

That is, one aspect of the present invention is to have a chemically etched insulating resin layer consisting of two layers arranged facing each other and bonded to each other with an adhesive, and a highly conductive metal layer provided on both sides of this resin layer. This is a metal-insulating resin plywood with the following characteristics.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 3 shows a manufacturing process for obtaining a metal-insulating resin plywood according to the present invention.

That is, first, prepare two highly conductive metal plates, for example, copper plates 11 with a thickness of about 50 μm, and clean their surfaces (~).

Next, add a layer of 150 to 180 μm thick on one side of the copper plate 11.
rn liquid polyimide resin 12 is applied and heated at a predetermined temperature to harden the resin 12 to form a laminated plate 13 (Bl.

Next, the above laminate 13 is coated with its polyimide resin 12.
Arrange the pairs so that they are inside each other and 0. An adhesive material 14 is applied to the opposing surfaces, and the two are pasted together to form the desired metal-insulating resin plywood 15? obtain. This plywood 15 has copper plates 11 on both sides, and has two layers of polyimide resin 12 bonded inside with an adhesive, and its thickness can be 300 μm or more. As another method, a resin layer may be bonded in advance, and then a metal layer may be formed on one surface by vapor deposition or plating. In this method, three or more resin layers are pasted together and then a metal layer is formed, and a material of any thickness can be produced.

Note that in the embodiments of the present invention, a polyimide resin was used as the insulating resin.

Of course, the present invention is not limited to this method, and can be widely applied to insulating resins that can be chemically etched and which have manufacturing limitations.

Further, the metal plate is not limited to a copper plate, and n may be any other highly conductive metal plate.

〔Effect of the invention〕

In the present invention, as described above, the insulating resin layers, especially the polyimide resin, having a highly conductive metal layer are arranged facing each other and are connected to each other with an adhesive, so that the thickness of the insulating resin layer can be reduced. It is possible to obtain one with a diameter of 300 μm or more. Moreover, since the above-mentioned plywood does not exhibit a wide-open state during bonding, it has high adhesive strength and can therefore be widely used as a board material for semiconductor devices that require chemical etching.

[Brief explanation of the drawing]

1 and 2 are cross-sectional views of a conventional metal-insulating resin plywood, and figures showing an example of the manufacturing process of the metal-insulating resin plywood according to the present invention. ]1...Good conductive metal plate, 12...Polyimide resin. 13... Laminate board, 14... Adhesive material, 15... Gold paulownia-insulating resin plywood. Application agent Patent attorney Gobe Kikuchi

Claims (2)

[Claims] (1) A chemically etchable insulating resin layer replacing two layers f' arranged oppositely and bonded to each other with an adhesive. A metal-insulating resin plywood characterized in that the resin layer is provided with a highly conductive metal layer on both sides. (2) A metal-insulating resin plywood, wherein the insulating resin layer is a polyimide resin.