JPS59110144A - 電子装置の冷却装置 - Google Patents

電子装置の冷却装置

Info

Publication number
JPS59110144A
JPS59110144A JP21835182A JP21835182A JPS59110144A JP S59110144 A JPS59110144 A JP S59110144A JP 21835182 A JP21835182 A JP 21835182A JP 21835182 A JP21835182 A JP 21835182A JP S59110144 A JPS59110144 A JP S59110144A
Authority
JP
Japan
Prior art keywords
heat transfer
intermediate heat
housing
fluid
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21835182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6260814B2 (enrdf_load_stackoverflow
Inventor
Motohiro Sato
佐藤　元宏
Toshihiro Yamada
山田　俊宏
Asao Nishimura
西村　朝雄
Takahiro Oguro
崇弘 大黒
Noriyuki Ashiwake
芦分　範行
Keizo Kawamura
圭三 川村
Fumiyuki Kobayashi
小林　二三幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP21835182A priority Critical patent/JPS59110144A/ja
Publication of JPS59110144A publication Critical patent/JPS59110144A/ja
Publication of JPS6260814B2 publication Critical patent/JPS6260814B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP21835182A 1982-12-15 1982-12-15 電子装置の冷却装置 Granted JPS59110144A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21835182A JPS59110144A (ja) 1982-12-15 1982-12-15 電子装置の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21835182A JPS59110144A (ja) 1982-12-15 1982-12-15 電子装置の冷却装置

Publications (2)

Publication Number Publication Date
JPS59110144A true JPS59110144A (ja) 1984-06-26
JPS6260814B2 JPS6260814B2 (enrdf_load_stackoverflow) 1987-12-18

Family

ID=16718510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21835182A Granted JPS59110144A (ja) 1982-12-15 1982-12-15 電子装置の冷却装置

Country Status (1)

Country Link
JP (1) JPS59110144A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155226A (ja) * 2010-01-28 2011-08-11 Nec Access Technica Ltd 電気機器のヒートシンク機構
EP4518601A4 (en) * 2022-05-24 2025-08-13 Huawei Tech Co Ltd HEATING MODULE, HEAT DISSIPATION APPARATUS, AND COMMUNICATION DEVICE

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155226A (ja) * 2010-01-28 2011-08-11 Nec Access Technica Ltd 電気機器のヒートシンク機構
EP4518601A4 (en) * 2022-05-24 2025-08-13 Huawei Tech Co Ltd HEATING MODULE, HEAT DISSIPATION APPARATUS, AND COMMUNICATION DEVICE

Also Published As

Publication number Publication date
JPS6260814B2 (enrdf_load_stackoverflow) 1987-12-18

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