JPS6260814B2 - - Google Patents
Info
- Publication number
- JPS6260814B2 JPS6260814B2 JP21835182A JP21835182A JPS6260814B2 JP S6260814 B2 JPS6260814 B2 JP S6260814B2 JP 21835182 A JP21835182 A JP 21835182A JP 21835182 A JP21835182 A JP 21835182A JP S6260814 B2 JPS6260814 B2 JP S6260814B2
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- intermediate heat
- electronic device
- fluid
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 33
- 239000012530 fluid Substances 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000498 cooling water Substances 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21835182A JPS59110144A (ja) | 1982-12-15 | 1982-12-15 | 電子装置の冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21835182A JPS59110144A (ja) | 1982-12-15 | 1982-12-15 | 電子装置の冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59110144A JPS59110144A (ja) | 1984-06-26 |
| JPS6260814B2 true JPS6260814B2 (enrdf_load_stackoverflow) | 1987-12-18 |
Family
ID=16718510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21835182A Granted JPS59110144A (ja) | 1982-12-15 | 1982-12-15 | 電子装置の冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59110144A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5177906B2 (ja) * | 2010-01-28 | 2013-04-10 | Ｎｅｃアクセステクニカ株式会社 | 電気機器のヒートシンク機構 |
| CN117156790A (zh) * | 2022-05-24 | 2023-12-01 | 华为技术有限公司 | 一种发热模块、散热装置和通信设备 |
-
1982
- 1982-12-15 JP JP21835182A patent/JPS59110144A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59110144A (ja) | 1984-06-26 |
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