JPS59107537A - Master slice type integrated circuit group - Google Patents

Master slice type integrated circuit group

Info

Publication number
JPS59107537A
JPS59107537A JP21795682A JP21795682A JPS59107537A JP S59107537 A JPS59107537 A JP S59107537A JP 21795682 A JP21795682 A JP 21795682A JP 21795682 A JP21795682 A JP 21795682A JP S59107537 A JPS59107537 A JP S59107537A
Authority
JP
Japan
Prior art keywords
slice type
circuit
master slice
chips
cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21795682A
Other languages
Japanese (ja)
Other versions
JPH0125225B2 (en
Inventor
Soichi Ito
伊藤 荘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP21795682A priority Critical patent/JPS59107537A/en
Publication of JPS59107537A publication Critical patent/JPS59107537A/en
Publication of JPH0125225B2 publication Critical patent/JPH0125225B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118Masterslice integrated circuits

Abstract

PURPOSE:To contrive accomplishment of the layout design of the titled integrated circuit group in a highly efficient manner by a method wherein the channel width of the wiring located between functional blocks of the first kind and second kind master slice type ICs is variedly formed each other. CONSTITUTION:In two kinds of master slice type chips (a) and (b), the quantity of cell 1' in X and Y directions, which can be contained in one circuit functional block, is limited to P-pieces and q-pieces, and the blocks 3' and 4' are limited in size. The intercell distances l' and m' are made equal between the two chips (a) and (b) at the limit value or below, the group 5 consisting of the number of cells within the limit value is considered as 1 unit, and the intergroup distances (h), (i), (j) and (k) are independently established in the amount required for the chips (a) and (b). According to this constitution, circuit functional blocks can be used common between a plurality of master slice type ICs. Also, as cell groups are formed common in size, they can be made into macroscopic form by performing an interconnection, thereby enabling to obtain a layout structure suitable for multilayer automatic design.

Description

【発明の詳細な説明】 本発明は、広範な回路規模に対応するための、ゲートア
レイ形マスク・スライス集積回路群に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a gate array type mask slice integrated circuit group that can accommodate a wide range of circuit scales.

所望の回路機能をマスク・スライス基板上で実現するい
わゆるゲート・アレイでは、特に回路規模が小さいもの
から太きいものまで広範に渡る場合、収容回路規模の異
なる複数種のマスタ・スライス基板が用意される。すな
わち、回路規模収容能力の大きいマスク・スライス基板
は、テップザイズが大きくウェハ収率が小さくなって1
チップ当りのコストが高くなるので、炊模の小きい回1
隋には、小さなマスク・スライス基板かA応させられる
In so-called gate arrays, which realize desired circuit functions on masked and sliced substrates, multiple types of master sliced substrates with different accommodating circuit sizes are prepared, especially when the circuit scale ranges from small to large. Ru. In other words, a mask/slice substrate with a large circuit scale capacity has a large tip size and a low wafer yield.
Since the cost per chip is high, the small number of times of cooking is 1.
Sui can be made to supply small masks and sliced substrates.

しかしながら、このように複数種マスク・スライス基板
を用意することは、マスク・スライス基板設計の観点か
らは、例え単位回路の性能か同一であって、単に回路規
模収容能力かJieなるたけであっても、単純に太チッ
プの部分削除をそjうだけで小チップか実現できる訳で
なく、部分削除し、その分収縮させた結果新らしいバタ
ン組合せか出現し、その為に、2種マスク・スライス間
に共通であるべきバタン形状が相互に異なったものにな
ってしまう等の困難を通常伴う。
However, from the perspective of mask/slice board design, preparing multiple types of masks/slice boards in this way is difficult, even if the performance of the unit circuits is the same and the circuit size capacity is simply low. However, it is not possible to create a small chip by simply deleting a part of a thick chip, but by deleting a part and shrinking it by that amount, a new combination of bangs appears, and for that purpose, two types of masks and slices are needed. Difficulties such as the fact that the shapes of the batons that should be common between them end up being different from each other are usually involved.

本発明は上記実情に鑑み、単位回路の性り院がはほ同一
で、回路規模収容能力が異なる複数種マスク・スライス
形チップ設計の効率化の一為のレイアウト方法を提供す
ることを目的とし、搭載可能な回路f#A模が相互に異
なる第1種及び第2柚マスク・スライス形呆槍回路に於
て、該第1種及び第2棟マスク・スライス形集積回路の
夫々がほぼ同一形状の回路機能ブロックバタンを有し、
かつ、回路機Nヒプロノク間の接続に用いる配線チャン
ネル領域の巾が、上記第1橿、及び第2種マスク・スラ
イス形集槙回路で、相互に異なることを特徴とする。
In view of the above circumstances, it is an object of the present invention to provide a layout method for improving the efficiency of designing multiple types of mask/slice type chips with almost the same layout of unit circuits and different circuit scale capacities. , in the first type and second yuzu mask/slice type integrated circuits in which the mountable circuit f#A models are different from each other, the first type and the second mask/slice type integrated circuits are almost the same. It has a shaped circuit function block button,
Further, the width of the wiring channel region used for connection between the circuit devices N-Hypronoch is different between the first type mask slice type integrated circuit and the second type mask slice type integrated circuit.

以下本発明を図を参照しながら説明する。The present invention will be explained below with reference to the drawings.

第1図は回路規模収容能力が相互に異なる2種マスク・
スライス形チップのセルレイアウトを示すもので、第1
図(a)が大規模なものに、第1図(b)が小規模なも
のに対応し、トランジスタ、抵抗等盆その内部に含む、
セル1及び、配線チャンネル領域2より構成されており
、3,4.は夫々、セル上に配置された回路位置E7″
ロックを示している。
Figure 1 shows two types of masks with different circuit scale capacities.
This shows the cell layout of a sliced chip.
Figure (a) corresponds to a large-scale one, and Figure 1 (b) corresponds to a small-scale one, including transistors, resistors, etc. inside the tray.
It is composed of a cell 1, a wiring channel region 2, and 3, 4. are the circuit positions E7″ placed on the cell, respectively.
Showing lock.

本発明の第1の特徴は、第1図(a)、Φ)に示す2種
マスタ・スライス形チップの夫々に共通の、回路機能ブ
ロックを使用する点にあり、それを可能にするには、セ
ル1を複数個使用する回路機能ブロックを考慮して、第
1図のセル相互間距離l。
The first feature of the present invention lies in the use of circuit functional blocks common to each of the two types of master slice type chips shown in FIG. 1(a) and Φ). , considering a circuit functional block using a plurality of cells 1, the inter-cell distance l in FIG.

mの大きさを2柚マスタ・スライス形チップ間で同一に
しておく必要がある。しかしながら、通常、回路規模が
小さいものは、回路機能ブロック相互を接続する為の配
線チャンネル領域2の巾は相応に小さくて済むので、前
記の28マスク・スライス形チップ間で、セル相互間化
QA、mを同じ大きさにすると、小規模向きのチップ第
1図(b)は、過剰の配線チャンネル面積を有すること
Vこなり、チップの面積効率が悪くなる。
It is necessary to keep the size of m the same between the two yuzu master slice chips. However, in the case of a small circuit, the width of the wiring channel region 2 for connecting circuit functional blocks to each other can be relatively small, so inter-cell interconnection QA is possible between the 28-mask slice type chips. , m are set to the same size, the chip shown in FIG. 1(b) suitable for small scale has an excessive wiring channel area V, which deteriorates the area efficiency of the chip.

これを解決する為に、小規模向きチップ第1 t’<1
(b)に於てセル相互間距離l9mを、必要量に留める
べく小さくすると、2種マスク・スライス形チップ間で
、回路機能ブロック4を共通に使用することができなく
なシ、同−回路機能でありながら、夫々のマスク・スラ
イス基板に個別に対応する2釉類の回路ビモ能プロ、ク
パタンを作成17表ければならなくなる。通常1回路機
能プロ、りは回路機能て分類して数十f!I知生じうる
ことを考慮すると、この方法は、回路機能ブロックバタ
ン設計の観点から、全く好IL(ない、。
In order to solve this problem, the first chip suitable for small scale t'<1
In (b), if the inter-cell distance l9m is reduced to the required amount, the circuit function block 4 cannot be used in common between the two types of mask/slice type chips. Although it is functional, it is necessary to create 17 separate 2-glaze circuit bimo-noh pro and kupatan that correspond to each mask and slice board individually. Normally, one circuit function is professional, and the circuit function is classified into tens of f! Considering the possible problems that may arise, this method is not at all good IL (no) from the point of view of circuit functional block button design.

との九、本)し明では、泥2図(a)、 (b)に示す
如く、回路機能ブロック3′、4′の大きさにflii
J限を設けるべく、1回路銭能ブo、ジに含んで良いセ
ル1′のX方向、Y方向のi□Lfii、:に結成を設
け、(該セル数制限値ケX力1#jj pllR:、Y
方向9個とする)該制限値以下では、セル相互間距離1
’、 rn’を2つのマスク・スライスチップ間で同じ
大きさKし、該制限瀘内のセル支゛(で栴I戊さIしる
セル群5を1つC単位として、謬、セル群相互間距離り
、i、j、kを第HJ(a)、 (b)夫々にボす2槓
マスタスライス形チツプ夫々に必要な菫だけ独立に設定
することとした。
In this paper, as shown in Fig. 2 (a) and (b), the size of the circuit function blocks 3' and 4' is
In order to set the J limit, a formation is established in the pllR:,Y
9 directions) Below the limit value, the distance between cells is 1
', rn' are set to the same size K between the two mask/slice chips, and the cell group 5 in the limit filter is defined as one C unit. It was decided that the mutual distances i, j, and k were set independently for only the necessary violet for each of the two master slice type chips to be set in HJ (a) and (b), respectively.

これが本発明の第2の特徴で、こうすることによシ週剰
の配rfJチャンネルを持たせることなく、複数のマス
ク・スライス形集積回路の間で共通に回路機能ブロック
を使用することが可能になる。
This is the second feature of the present invention. By doing so, it is possible to use circuit function blocks in common among multiple mask slice type integrated circuits without having to provide redundant RFJ channels. become.

又、第2凶に示す、セルレイアウト形態は、セル群5の
大きさがマスク・スライスチップの夫々に共通に設定さ
れるので、複数回路機能ブロックを集めデセル群5の大
きさの範囲で相互に接続しそれをマクロ化した回路機能
プロ、りとすることが可能であるので、階層化自動設計
にも適したレイアウト構造になっている。
In addition, in the cell layout form shown in the second example, the size of the cell group 5 is set in common to each of the mask and slice chip, so multiple circuit functional blocks are collected and mutually arranged within the size of the decell group 5. Since it is possible to connect it to a macro circuit function program, it has a layout structure suitable for hierarchical automatic design.

第3図(a)、 (b)は、本発明の実施例を示すもの
で、回路機能ブロック3“、の大きさは、X方向は、特
に制限なく、Y方向Fi、2セル以下とされている。
FIGS. 3(a) and 3(b) show an embodiment of the present invention, and the size of the circuit functional block 3" is not particularly limited in the X direction, and is 2 cells or less in the Y direction Fi. ing.

一方、配線チャンネル領域2″の大きさは、セル群5′
内部は、m“の大きさで、第3図(a)、 (b)夫々
のチップで同一サイズに設定されている一方、セル群5
“間は、Hr、  krと、相互に異なる大きさに設定
されている。局、同実施例に於て、Y方向の配線チャン
ネルはセル1″上を自白に通過でき、第2図り。
On the other hand, the size of the wiring channel region 2'' is the same as that of the cell group 5'.
The inside has a size of m'' and is set to the same size for each chip as shown in Fig. 3 (a) and (b), while the cell group 5
In the same embodiment, the wiring channel in the Y direction can pass directly over the cell 1, as shown in the second diagram.

jで示す間隔は必要としない。The spacing indicated by j is not required.

以上に記す如く、本発明は、単位回路の性能がほぼ同一
で回路規模収容能力が異なる複数種マスク・スライス形
集積回路のチップバタン設計の効率化に寄与し、かつ、
夫々のマスク・スライス形集積回路に於て、チップ面積
効率を損うことなく、さらに、階層化設計にも適するレ
イアウト方法を提示するものである。
As described above, the present invention contributes to the efficiency of chip baton design of multiple types of mask-sliced integrated circuits whose unit circuits have substantially the same performance but differ in circuit scale capacity, and
The present invention proposes a layout method suitable for hierarchical design without impairing chip area efficiency in each mask-sliced integrated circuit.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)、 (b)は各々従来のマスタスライス形
集積回路のセルレイアウトを示す平面図、第2図(a)
。 (b)は各々本発明の一実施例のセルレイアウトを示す
平面図、第3図(a)、 (b)は各々本発明の他の実
施例の平面図、である。 なお図において、1. 1’、  1“・・・・・・セ
ル、2゜2′、2“・・・・・・配線チャンネル領域、
3.3’、3“、4゜4“・・・・・・回路機能ブロッ
ク、5,5′・・・・・・複数個のセルを含むセル群、
l、m・・・・・・セル間相対距離、1”、l“、 m
’ 、 m″・・・・・・セル群内のセル間相対距離、
J  F  l′s  j+ l(+  ”・・・・・
・セル群間相対距離、p、q・・・・・・各々セル群内
のX方向、Y方向のセル段、を示す。 L−□−□)し−シー−−J ’−)−−−−−−−、−−−−−。 ::−一一一−は一−−−[
FIGS. 1(a) and 1(b) are plan views showing the cell layout of a conventional master slice type integrated circuit, and FIG. 2(a) is a plan view showing the cell layout of a conventional master slice integrated circuit.
. 3(b) is a plan view showing the cell layout of one embodiment of the present invention, and FIGS. 3(a) and 3(b) are plan views of other embodiments of the present invention. In the figure, 1. 1', 1"...cell, 2゜2', 2"...wiring channel area,
3.3', 3", 4゜4"...Circuit functional block, 5,5'...Cell group including a plurality of cells,
l, m... Relative distance between cells, 1'', l'', m
' , m''...Relative distance between cells within a cell group,
J F l's j+ l(+ ”...
- Relative distance between cell groups, p, q... Indicates the cell stage in the X direction and Y direction within the cell group, respectively. L-□-□) Shi-C--J'-)--------, ------. ::-111-is one---[

Claims (1)

【特許請求の範囲】[Claims] 搭転b」能な回路規模が相互に異なる第1禰、及び第2
打マスク・スライス形集積回h1に於て、該第1独及び
第2独マスタ・スライス形巣槓回路の夫々がほぼ同一形
状の回路機能プロ、クバタン會櫓し、かつ、回路機能ブ
ロック間の接続に用いる配線チャンネル領域の中が、上
記第1種及び第2棟マスタスライス形集槓回路で相互に
異なることを特徴とする、マスク・スライス形集槙回路
群。
The first wire and the second wire have different circuit scales that can be used for
In the mask/slice type integrated circuit h1, each of the first and second master/slice type block circuits has a circuit function block having almost the same shape, and a circuit function block between the circuit function blocks. A group of mask slice type integrated circuits, characterized in that the inside of the wiring channel area used for connection is different between the first type and second master slice type integrated circuits.
JP21795682A 1982-12-13 1982-12-13 Master slice type integrated circuit group Granted JPS59107537A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21795682A JPS59107537A (en) 1982-12-13 1982-12-13 Master slice type integrated circuit group

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21795682A JPS59107537A (en) 1982-12-13 1982-12-13 Master slice type integrated circuit group

Publications (2)

Publication Number Publication Date
JPS59107537A true JPS59107537A (en) 1984-06-21
JPH0125225B2 JPH0125225B2 (en) 1989-05-16

Family

ID=16712349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21795682A Granted JPS59107537A (en) 1982-12-13 1982-12-13 Master slice type integrated circuit group

Country Status (1)

Country Link
JP (1) JPS59107537A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192061A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Semiconductor integrated circuit device
JPS5936942A (en) * 1982-08-25 1984-02-29 Toshiba Corp Semiconductor integrated circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192061A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Semiconductor integrated circuit device
JPS5936942A (en) * 1982-08-25 1984-02-29 Toshiba Corp Semiconductor integrated circuit

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Publication number Publication date
JPH0125225B2 (en) 1989-05-16

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