JPH0125225B2 - - Google Patents

Info

Publication number
JPH0125225B2
JPH0125225B2 JP57217956A JP21795682A JPH0125225B2 JP H0125225 B2 JPH0125225 B2 JP H0125225B2 JP 57217956 A JP57217956 A JP 57217956A JP 21795682 A JP21795682 A JP 21795682A JP H0125225 B2 JPH0125225 B2 JP H0125225B2
Authority
JP
Japan
Prior art keywords
circuit
cells
master slice
wiring channel
cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57217956A
Other languages
Japanese (ja)
Other versions
JPS59107537A (en
Inventor
Soichi Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP21795682A priority Critical patent/JPS59107537A/en
Publication of JPS59107537A publication Critical patent/JPS59107537A/en
Publication of JPH0125225B2 publication Critical patent/JPH0125225B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118Masterslice integrated circuits

Description

【発明の詳細な説明】 本発明は、広範な回路規模に対応するための、
ゲートアレイ形マスタ・スライス集積回路の製造
方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention provides:
The present invention relates to a method of manufacturing a gate array type master slice integrated circuit.

所望の回路機能をマスタ・スライス基板上で実
現するいわゆるゲート・アレイでは、特に回路規
模が小さいものから大きいものまで広範に亘る場
合、収容回路規模の異なる複数種のマスタ・スラ
イス基板が用意される。すなわち、回路規模収容
能力の大きいマスタ・スライス基板は、チツプサ
イズが大きくウエハ収率が小さくなつて1チツプ
当りのコストが高くなるので、規模の小さい回路
には、小さなマスタ・スライス基板が対応させら
れる。
In so-called gate arrays that realize desired circuit functions on a master slice board, multiple types of master slice boards with different accommodating circuit sizes are prepared, especially when the circuit scale ranges from small to large. . In other words, a master slice board with a large circuit scale capacity has a large chip size, a low wafer yield, and a high cost per chip, so a small master slice board is used for a small scale circuit. .

しかしながら、このように複数種マスタ・スラ
イス基板を用意することは、マスタ・スライス基
板設計の観点からは、例え単位回路の性能が同一
で単に回路規模収容能力が異なるだけであつて
も、単純に大チツプの部分削除を行うだけで小チ
ツプが実現できる訳でなく、部分削除し、その分
収縮させた結果新らしいパタン組合せが出現し、
その為に2種マスタ・スライス間に共通であるべ
きパタン形状が相互に異なつたものになつてしま
う等の困難を通常伴う。
However, from the perspective of master slice board design, preparing multiple types of master slice boards in this way is simply It is not possible to create a small chip by simply deleting a part of a large chip, but by deleting a part and shrinking it by that amount, a new pattern combination appears.
This usually involves difficulties such as the pattern shapes that should be common between the two types of master slices becoming different from each other.

本発明は上記実情に鑑み、単位回路の性能がほ
ぼ同一で、回路規模収容能力が異なる複数種マス
タ・スライス形チツプ設計の効率化の為のレイア
ウト方法を提供することを目的とし、半導体基板
に複数のセルで形成される回路ブロツクを複数有
し、前記セル間の配線チヤンネルの幅よりも前記
回路ブロツク間の配線チヤンネルの幅を広くした
マスタ・スライス形集積回路の前記セル間の配線
チヤンネルの幅は変えずに、前記回路ブロツク間
の配線チヤンネルの幅を前記半導体基板に搭載す
る前記回路ブロツクの数に応じて変えるようにす
るマスタ・スライス形集積回路の製造方法を得
る。
In view of the above circumstances, it is an object of the present invention to provide a layout method for improving the efficiency of designing multiple types of master slice type chips in which the performance of the unit circuits is almost the same but the circuit scale capacity is different. A master slice type integrated circuit has a plurality of circuit blocks formed by a plurality of cells, and the width of the wiring channel between the circuit blocks is wider than the width of the wiring channel between the cells. A method for manufacturing a master slice type integrated circuit is provided in which the width of the wiring channel between the circuit blocks is changed according to the number of the circuit blocks mounted on the semiconductor substrate without changing the width.

以下本発明を図を参照しながら説明する。 The present invention will be explained below with reference to the drawings.

第1図は回路規模収容能力が相互に異なる2種
マスタ・スライス形チツプの従来のセルレイアウ
ト例を示すもので、第1図aが大規模なものに、
第1図bが小規模なものに対応し、トランジス
タ、抵抗等をその内部に含むセル1、及び、配線
チヤンネル領域2より構成されており、3,4は
夫々セル1上に配置された回路機能ブロツクを示
している。特に配線チヤンネル領域l,mは、大
規模なチツプ(第1図a)、小規模なチツプ(第
1図b)、共に同一の大きさであつた。
Figure 1 shows an example of a conventional cell layout for two types of master slice type chips with different circuit scale capacities; Figure 1a shows a large-scale one;
FIG. 1b corresponds to a small-scale cell, which is composed of a cell 1 containing transistors, resistors, etc., and a wiring channel region 2, and 3 and 4 are circuits placed on the cell 1, respectively. Shows functional blocks. In particular, the wiring channel regions l and m had the same size in both the large-scale chip (FIG. 1a) and the small-scale chip (FIG. 1b).

本発明の特徴の要素の1つには、第1図a,b
に示す2種マスタ・スライス形チツプの夫々に共
通の、回路機能ブロツクを使用する点にあるが、
それを可能にするには、セル1を複数個使用する
回路機能ブロツクを考慮して、従来例の如く第1
図のセル相互間距離l,mの大きさを2種マス
タ・スライス形チツプ間で同一にしておく必要が
ある。しかしながら、通常、回路規模が小さいも
のは、回路機能ブロツク相互を接続する為の配線
チヤンネル領域2の幅は相応に小さくて済むの
で、前記の2種マスタ・スライス形チツプ間で、
セル相互間距離l,mを同じ大きさにすると、小
規模向きのチツプ第1図bは、過剰の配線チヤン
ネル面積を有することになり、チツプの面積効率
が悪くなる。
One of the characteristic elements of the invention includes FIGS.
The main point is that the circuit function blocks common to each of the two types of master slice type chips shown in the figure are used.
To make this possible, considering a circuit function block that uses a plurality of cells 1, it is necessary to
It is necessary to keep the inter-cell distances l and m shown in the figure the same between the two types of master slice type chips. However, in a case where the circuit size is small, the width of the wiring channel area 2 for interconnecting the circuit function blocks can be relatively small, so that between the two types of master/slice chips mentioned above,
If the distances l and m between the cells are set to the same size, the chip shown in FIG. 1b, which is suitable for a small scale, will have an excessive wiring channel area, and the area efficiency of the chip will deteriorate.

これを解決する為に、小規模向きチツプ第1図
bに於てセル相互間距離l,mを、必要量に留め
るベく小さくすると、2種マスタ・スライス形チ
ツプ間で、回路機能ブロツク3,4を共通に使用
することができなくなり、同一回路機能でありな
がら、夫々のマスタ・スライス基板に個別に対応
する2種類の回路機能ブロツクパタンを作成しな
ければならなくなる。通常、回路機能ブロツクは
回路機能で分類して数十種類生じうることを考慮
すると、この方法は、回路機能ブロツクパタン設
計の観点から、全く好ましくない。
In order to solve this problem, the distances l and m between the cells in the small-scale chip shown in FIG. . Considering that normally, circuit function blocks can be classified into several dozen types by circuit function, this method is completely undesirable from the viewpoint of circuit function block pattern design.

この為、本発明では、第1の実施例、第2図
a,bに示す如く、回路機能ブロツク3′,4′の
大きさに制限を設けるべく、1回路機能ブロツク
に含んで良いセル1′のX方向、Y方向の数量に
制限を設け(該セル数制限値をX方向p個、Y方
向q個とする)該制限値以下では、セル相互間距
離l′,m′を2つのマスタ・スライスチツプ間で同
じ大きさにし、該制限値内のセル数で構成される
セル群5を1つの単位として、該セル群相互間距
離h,i,j,kを第2図a,b夫々に示す2種
マスタ・スライス形チツプ夫々に必要な量だけ独
立に設定することとした。これが本発明の特徴の
第2の要素である。こうすることにより過剰の配
線チヤンネルを持たせることなく、複数のマス
タ・スライス形集積回路の間で共通に回路機能ブ
ロツクを使用することが可能になる。
Therefore, in the present invention, as shown in the first embodiment and FIGS. 2a and 2b, in order to limit the size of the circuit function blocks 3' and 4', the number of cells that can be included in one circuit function block is limited. ′ in the X direction and Y direction (the cell number limit is p in the X direction and q in the Y direction). Below the limit, the distances between cells l′ and m′ are The master slice chips are of the same size, and the cell group 5 consisting of the number of cells within the limit value is taken as one unit, and the distances h, i, j, k between the cell groups are shown in FIG. 2a, It was decided to independently set the required amount for each of the two types of master slice chips shown in b. This is the second feature of the present invention. This allows common use of circuit functional blocks among multiple master slice integrated circuits without having excessive wiring channels.

又、第2図に示す、セルレイアウト形態は、セ
ル群5の大きさがマスタ・スライスチツプの夫々
に共通に設定されるので、複数回路機能ブロツク
を集めてセル群5の大きさの範囲で相互に接続し
それをマクロ化した回路機能ブロツクとすること
が可能であるので、階層化自動設計にも適したレ
イアウト構造になつている。
In addition, in the cell layout form shown in FIG. 2, the size of the cell group 5 is set in common to each of the master and slice chips, so multiple circuit function blocks are collected and arranged within the size range of the cell group 5. Since it is possible to interconnect them and create macro circuit function blocks, the layout structure is suitable for hierarchical automatic design.

第3図a,bは、本発明の第2の実施例を示す
もので、回路機能ブロツク3″の大きさは、X方
向は第2図l′,h,jで示す配線チヤンネルがな
いために制限はなく、Y方向は2セル以下とされ
ている。一方、配線チヤンネル領域2″の大きさ
は、セル群5′内部は、m″の大きさで、第3図
a,b夫々のチツプで同一サイズに設定されてい
る一方、セル群5′間は、i′,k′と、相互に異なる
大きさに設定されている。尚、同実施例に於て、
Y方向の配線チヤンネルはセル1″上を自由に通
過できるので、第2図l′,h,jで示す間隔は必
要としない。
Figures 3a and 3b show a second embodiment of the present invention, and the size of the circuit function block 3'' is such that there is no wiring channel in the X direction as shown in Figure 2 l', h, and j. There is no limit to the number of cells, and the number of cells in the Y direction is 2 or less.On the other hand, the size of the wiring channel region 2'' is m'' inside the cell group 5', and While the chips are set to the same size, the cell groups 5' are set to different sizes i' and k'.In addition, in the same embodiment,
Since the wiring channel in the Y direction can freely pass over the cell 1'', the spacings shown in FIG. 2, l', h, and j are not required.

以上に記す如く、本発明は、単位回路の性能が
ほぼ同一で回路規模収容能力が異なる複数種マス
タ・スライス形集積回路のチツプパタン設計の効
率化に寄与し、かつ、夫々のマスタ・スライス形
集積回路に於て、チツプ面積効率を損うことな
く、さらに、階層化設計にも適するレイアウト方
法を提示するものである。
As described above, the present invention contributes to improving the efficiency of chip pattern design for multiple types of master slice type integrated circuits whose unit circuits have substantially the same performance but different circuit scale capacities, and This invention presents a layout method that is suitable for hierarchical design without sacrificing chip area efficiency.

【図面の簡単な説明】[Brief explanation of drawings]

第1図a,bは各々従来のマスタ・スライス形
集積回路のセルレイアウトを示す平面図、第2図
a,bは各々本発明の一実施例のセルレイアウト
を示す平面図、第3図a,bは各々本発明の他の
実施例の平面図、である。 なお図において、1,1′,1″……セル、2,
2′,2″……配線チヤンネル領域、3,3′,
3″,4,4′……回路機能ブロツク、5,5′…
…複数個のセルを含むセル群、l,m……セル間
相対距離、l′,m′,m″……セル群内のセル間相
対距離、h,i,i′,j,k,k′……セル群間相
対距離、p,q……各々セル群内のX方向、Y方
向のセル数、を示す。
1A and 1B are plan views each showing a cell layout of a conventional master slice type integrated circuit, FIGS. 2A and 2B are plan views each showing a cell layout of an embodiment of the present invention, and FIG. 3A , b are plan views of other embodiments of the present invention. In the figure, 1, 1', 1''... cell, 2,
2', 2''...Wiring channel area, 3, 3',
3″, 4, 4′……Circuit function block, 5, 5′…
...Cell group containing multiple cells, l, m...Relative distance between cells, l', m', m''...Relative distance between cells within a cell group, h, i, i', j, k, k'... indicates the relative distance between cell groups, p, q... indicates the number of cells in the X direction and Y direction within the cell group, respectively.

Claims (1)

【特許請求の範囲】[Claims] 1 半導体基板に複数のセルで形成される回路ブ
ロツクを複数有し、前記セル間の配線チヤンネル
の幅よりも前記回路ブロツク間の配線チヤンネル
の幅を広くしたマスタ・スライス形集積回路の製
造方法において、前記セル間の配線チヤンネルの
幅は変えずに、前記回路ブロツク間の配線チヤン
ネルの幅を前記半導体基板に搭載する前記回路ブ
ロツクの数に応じて変えることを特徴とするマス
タ・スライス形集積回路の製造方法。
1. In a method for manufacturing a master slice type integrated circuit having a plurality of circuit blocks formed of a plurality of cells on a semiconductor substrate, the width of the wiring channel between the circuit blocks is wider than the width of the wiring channel between the cells. , a master slice type integrated circuit characterized in that the width of the wiring channel between the circuit blocks is changed according to the number of the circuit blocks mounted on the semiconductor substrate without changing the width of the wiring channel between the cells. manufacturing method.
JP21795682A 1982-12-13 1982-12-13 Master slice type integrated circuit group Granted JPS59107537A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21795682A JPS59107537A (en) 1982-12-13 1982-12-13 Master slice type integrated circuit group

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21795682A JPS59107537A (en) 1982-12-13 1982-12-13 Master slice type integrated circuit group

Publications (2)

Publication Number Publication Date
JPS59107537A JPS59107537A (en) 1984-06-21
JPH0125225B2 true JPH0125225B2 (en) 1989-05-16

Family

ID=16712349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21795682A Granted JPS59107537A (en) 1982-12-13 1982-12-13 Master slice type integrated circuit group

Country Status (1)

Country Link
JP (1) JPS59107537A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192061A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Semiconductor integrated circuit device
JPS5936942A (en) * 1982-08-25 1984-02-29 Toshiba Corp Semiconductor integrated circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192061A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Semiconductor integrated circuit device
JPS5936942A (en) * 1982-08-25 1984-02-29 Toshiba Corp Semiconductor integrated circuit

Also Published As

Publication number Publication date
JPS59107537A (en) 1984-06-21

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