JPS59107094A - 部分メツキ処理方法及びその装置 - Google Patents
部分メツキ処理方法及びその装置Info
- Publication number
- JPS59107094A JPS59107094A JP21695082A JP21695082A JPS59107094A JP S59107094 A JPS59107094 A JP S59107094A JP 21695082 A JP21695082 A JP 21695082A JP 21695082 A JP21695082 A JP 21695082A JP S59107094 A JPS59107094 A JP S59107094A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- plating
- mask
- area
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 140
- 230000036961 partial effect Effects 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims description 12
- 239000013598 vector Substances 0.000 claims abstract description 11
- 239000000243 solution Substances 0.000 claims description 46
- 239000007788 liquid Substances 0.000 claims description 37
- 238000002347 injection Methods 0.000 claims description 14
- 239000007924 injection Substances 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 8
- 230000004907 flux Effects 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 230000007717 exclusion Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21695082A JPS59107094A (ja) | 1982-12-13 | 1982-12-13 | 部分メツキ処理方法及びその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21695082A JPS59107094A (ja) | 1982-12-13 | 1982-12-13 | 部分メツキ処理方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59107094A true JPS59107094A (ja) | 1984-06-21 |
| JPS628516B2 JPS628516B2 (enrdf_load_stackoverflow) | 1987-02-23 |
Family
ID=16696459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21695082A Granted JPS59107094A (ja) | 1982-12-13 | 1982-12-13 | 部分メツキ処理方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59107094A (enrdf_load_stackoverflow) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5274536A (en) * | 1975-11-17 | 1977-06-22 | Schering Ag | Process and apparatus for selectively plating metals |
-
1982
- 1982-12-13 JP JP21695082A patent/JPS59107094A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5274536A (en) * | 1975-11-17 | 1977-06-22 | Schering Ag | Process and apparatus for selectively plating metals |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS628516B2 (enrdf_load_stackoverflow) | 1987-02-23 |
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