JPS59105396A - Through hole printed board - Google Patents
Through hole printed boardInfo
- Publication number
- JPS59105396A JPS59105396A JP21615982A JP21615982A JPS59105396A JP S59105396 A JPS59105396 A JP S59105396A JP 21615982 A JP21615982 A JP 21615982A JP 21615982 A JP21615982 A JP 21615982A JP S59105396 A JPS59105396 A JP S59105396A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed circuit
- circuit board
- holes
- auxiliary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、スルホールプリント基板の改良に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in through-hole printed circuit boards.
従来よりテンテング方法により得られるスルホールプリ
ント基板は、品質が良好であることがら高信頼性が要求
されるプリント基板の製造に広く用いられている。BACKGROUND ART Conventionally, through-hole printed circuit boards obtained by the tenting method are of good quality and have been widely used in the production of printed circuit boards that require high reliability.
然し乍ら、テンテング方法により得られる第１図に示す
スルホール基板１のスルホール２の径が大きＪＪ）と第
２図に示す如くテンテングの際に用いる極薄のレジスト
膜３の強さに限度が有る為、そのレジスト膜３がエツチ
ング液程で耐えられな（、破れることがある。その結果
エツチング液がスルホール２内に侵入し、図示の如く内
壁の銅４が侵食或いは溶解されたりしてスルホール２の
上下面が電気的に導通不良を来たすものである。However, the diameter of the through-holes 2 in the through-hole substrate 1 shown in FIG. 1 obtained by the tenteng method is large (JJ) and the strength of the ultra-thin resist film 3 used during tentenging is limited as shown in FIG. However, the resist film 3 cannot withstand the etching solution (and may break).As a result, the etching solution enters the through hole 2, and as shown in the figure, the copper 4 on the inner wall is eroded or dissolved, and the through hole 2 is damaged. This causes poor electrical continuity between the upper and lower surfaces.
本発明は斯かる問題を解消する為になされたものであり
、エツチング時大径のスルホールのレジスト膜が破れて
、エツチング液がスルホール内に侵入し、内壁の銅が浸
されて切れたり、溶解したりしてもスルホールの上下面
が電気的導通不良が生じないようにしたスルホールプリ
ント基板を提供せんとするものである。The present invention was made to solve this problem, and during etching, the resist film of the large diameter through-hole is torn, the etching solution enters the through-hole, and the copper on the inner wall is immersed and may be cut or dissolved. It is an object of the present invention to provide a through-hole printed circuit board in which electrical conductivity failure does not occur on the upper and lower surfaces of the through-holes even if the through-holes are exposed.
本発明のスルホールプリント基板は、第３図に示す如く
スルホールプリント基板５のスルホール２の外周側に、
該スルホール２のパット又はランド部６に接続して少な
くとも１本の微細な補助スルホール７が設けられている
ことを特徴とするものである。The through-hole printed circuit board of the present invention has, as shown in FIG.
It is characterized in that at least one fine auxiliary through hole 7 is provided connected to the pad or land portion 6 of the through hole 2.
このようにスルホール２の外周側に、パット又はランド
部６に接続して微細な補助スルホール７を設けた本発明
のスルホールプリント基板５は、その製作に於いてテン
テング法による回路作成の為の極薄のレジスト膜３が大
径のスルホール２の部分でエツチングにより破れてスル
ホール２の内壁の銅４が侵食或いは溶解されて電気的に
導通不良となっても、微細な補助スルホール７の部分の
極薄のレジスト膜３がエツチングにより破れることがな
いので、補助スルホール７の内壁の銅４が侵食、溶解さ
れることがなく、スルホール２の上下面が補助スルボー
ル７を介して電気的導通がなされるので、プリント基板
１は機能上何ら支障が無いものである。The through-hole printed circuit board 5 of the present invention, in which the fine auxiliary through-holes 7 are provided on the outer periphery of the through-holes 2 and connected to the pads or land portions 6, can be manufactured as a pole for circuit creation by the tenteng method. Even if the thin resist film 3 is torn by etching at the large-diameter through-hole 2 and the copper 4 on the inner wall of the through-hole 2 is eroded or dissolved, resulting in poor electrical conductivity, the electrodes at the fine auxiliary through-hole 7 Since the thin resist film 3 is not torn by etching, the copper 4 on the inner wall of the auxiliary through hole 7 is not eroded or dissolved, and the upper and lower surfaces of the through hole 2 are electrically connected via the auxiliary through ball 7. Therefore, the printed circuit board 1 has no functional problems.
尚、本発明のスルホールプリント基板５に於ける径の大
きなスルホール２は通常直径４鶴以上の大きなものを言
い、微細な補助スルホール７は通當２關以下のものを言
い、２１Ｓを超えると極薄のレジスト膜３がエソチング
工程に於いて破れる危険が生じる。In addition, the large diameter through hole 2 in the through hole printed circuit board 5 of the present invention is usually a large diameter of 4 mm or more, the fine auxiliary through hole 7 is a diameter of 2 mm or less, and if it exceeds 21 mm, it is extremely large. There is a risk that the thin resist film 3 will be torn during the etching process.
次に本発明のスルホールプリント基板５の具体的な実施
例について説明する。Next, a specific example of the through-hole printed circuit board 5 of the present invention will be described.
直径４ｍｉ、 ６＋ｕ＋、 ８ｍｍのスルホール２
が夫々１０個有する３３０Ｘ ２５０ ｘｍのスルホー
ル基板１の前記各スルホール２のバント部６の周囲二方
に直径Ｉｎの補助スルホール７を設けた。このスルホー
ル基板をテンテング法による回路作成の為の極薄く２５
μｍ）のレジスト膜３をエツチング（塩化第二銅溶液に
よる）した処、４ ｍ径のスルホール２に３個、６鶴径
のスルホール２に１０個、８ｆ１１径に１６個のレジス
ト膜３の破損が生じ、１０枚のスルボールプリント基板
に少ないもので１１［１ｉ１の欠陥が生じた。これが従
来のスルホールプリント基板であれば、この１０枚は全
て不良品となって使用できないものであるが、本発明の
スルホールプリント基板５では上述の如く各スルホール
２の周囲にレジスト膜３の破損の無い補助スルホール７
を有するので、いずれも良品として使用できるものであ
る。Diameter 4mi, 6+u+, 8mm through hole 2
Auxiliary through holes 7 having a diameter of In were provided on two sides around the bunt portion 6 of each through hole 2 of the through hole substrate 1 having 10 holes each having dimensions of 330 x 250 x m. This through-hole board is made into an ultra-thin 25mm plate for circuit creation using the tenteng method.
After etching (using a cupric chloride solution) the resist film 3 of 4 m diameter, 3 damage occurred in the 4 m diameter through hole 2, 10 damage occurred in the 6 m diameter through hole 2, and 16 damage occurred in the 8 f11 diameter through hole 2. A small number of defects, 11 [1i1, occurred] among the 10 printed circuit boards. If this were a conventional through-hole printed circuit board, all of these 10 sheets would be defective and unusable, but in the through-hole printed circuit board 5 of the present invention, as described above, there is no damage to the resist film 3 around each through-hole 2. No auxiliary through hole 7
Therefore, all of them can be used as good products.
以上詳記した通り本発明のスルホールプリント基板は、
スルホールのパント部又うンド部に接続して微細な補助
スルホールを設けであるので、その製作に於いてテンテ
ング法による回路作成の為の極薄のレジスト膜がスルホ
ールの部分で破れて内壁の銅が侵食或いは熔解されてス
ルボールの上下面が電気的に導通不良となっても、補助
スルホールの部分のレジスト膜は破れず内壁の銅が侵食
。As detailed above, the through-hole printed circuit board of the present invention has
Since a fine auxiliary through hole is provided to connect to the punt part or the land part of the through hole, the extremely thin resist film used to create the circuit by the tenteng method is torn at the through hole part and the copper on the inner wall is damaged. Even if the upper and lower surfaces of the through-hole become electrically conductive due to erosion or melting, the resist film at the auxiliary through-hole does not break and the copper on the inner wall erodes.
溶解されずスルホールの上下面が電気的に導通すること
となってプリント基板の機能には全く支障が無く、従来
のスルホールプリント基板にとって代わることのできる
画期的なものと云える。Since the upper and lower surfaces of the through holes are electrically conductive without being dissolved, there is no problem with the function of the printed circuit board, and it can be said to be an epoch-making product that can replace conventional through-hole printed circuit boards.
第１図はスルホール基板の正常なスルホールを示す縦断
面斜視図、第２図はスルホールプリント基板の欠陥スル
ホールの発生状況を示す縦断面斜視図、第３図は本発明
のスルホールプリント基板のスルボールと補助スルホー
ルを示す縦断面斜視図である。
１−・−一一一スルホール基板、２−−−−−−スルホ
ール、３−− レジスト膜、４−一一一・−スルホール
内壁の銅、５・−−スルホールプリント基板、６−＝−
−一−パット又はラント部、７−−−〜−一補助スルホ
ール。
出願人 田中貴金属工業株式会社
第１図FIG. 1 is a vertical cross-sectional perspective view showing normal through holes in a through-hole printed circuit board, FIG. 2 is a vertical cross-sectional perspective view showing the occurrence of defective through holes in a through-hole printed circuit board, and FIG. 3 is a vertical cross-sectional perspective view showing the occurrence of defective through holes in a through-hole printed circuit board of the present invention. FIG. 3 is a vertical cross-sectional perspective view showing an auxiliary through hole. 1--111 through-hole board, 2-----through hole, 3-- resist film, 4-111--copper on the inner wall of through-hole, 5-- through-hole printed circuit board, 6-=-
-1-Putt or runt part, 7--1 Auxiliary through hole. Applicant Tanaka Kikinzoku Kogyo Co., Ltd. Figure 1
Claims (1)
にスルホールのパット又はランド部に接続して少なくと
も１本の微細な補助スルホールが設けられていることを
特徴とするスルホールプリント基板。A through-hole printed circuit board, characterized in that at least one fine auxiliary through hole is provided on the outer peripheral side of the through hole and connected to a pad or land of the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21615982A JPS59105396A (en) | 1982-12-08 | 1982-12-08 | Through hole printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21615982A JPS59105396A (en) | 1982-12-08 | 1982-12-08 | Through hole printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59105396A true JPS59105396A (en) | 1984-06-18 |
Family
ID=16684214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21615982A Pending JPS59105396A (en) | 1982-12-08 | 1982-12-08 | Through hole printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59105396A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05191010A (en) * | 1992-01-13 | 1993-07-30 | Furukawa Electric Co Ltd:The | Large current circuit board |
-
1982
- 1982-12-08 JP JP21615982A patent/JPS59105396A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05191010A (en) * | 1992-01-13 | 1993-07-30 | Furukawa Electric Co Ltd:The | Large current circuit board |
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