JPS59103350A - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS59103350A
JPS59103350A JP58172943A JP17294383A JPS59103350A JP S59103350 A JPS59103350 A JP S59103350A JP 58172943 A JP58172943 A JP 58172943A JP 17294383 A JP17294383 A JP 17294383A JP S59103350 A JPS59103350 A JP S59103350A
Authority
JP
Japan
Prior art keywords
sample
center
rotation
coordinates
column
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58172943A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6120136B2 (enrdf_load_stackoverflow
Inventor
Shunei Uematsu
俊英 植松
Shunichiro Fujioka
俊一郎 藤岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58172943A priority Critical patent/JPS59103350A/ja
Publication of JPS59103350A publication Critical patent/JPS59103350A/ja
Publication of JPS6120136B2 publication Critical patent/JPS6120136B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58172943A 1983-09-21 1983-09-21 ワイヤボンデイング装置 Granted JPS59103350A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58172943A JPS59103350A (ja) 1983-09-21 1983-09-21 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58172943A JPS59103350A (ja) 1983-09-21 1983-09-21 ワイヤボンデイング装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP14123676A Division JPS5366167A (en) 1976-11-26 1976-11-26 Positioning method

Publications (2)

Publication Number Publication Date
JPS59103350A true JPS59103350A (ja) 1984-06-14
JPS6120136B2 JPS6120136B2 (enrdf_load_stackoverflow) 1986-05-21

Family

ID=15951222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58172943A Granted JPS59103350A (ja) 1983-09-21 1983-09-21 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS59103350A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63229731A (ja) * 1987-03-18 1988-09-26 Nec Kyushu Ltd 超音波ウエツジボンダ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63229731A (ja) * 1987-03-18 1988-09-26 Nec Kyushu Ltd 超音波ウエツジボンダ

Also Published As

Publication number Publication date
JPS6120136B2 (enrdf_load_stackoverflow) 1986-05-21

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