JPS59101453U - double mold light emitting diode - Google Patents

double mold light emitting diode

Info

Publication number
JPS59101453U
JPS59101453U JP1982196558U JP19655882U JPS59101453U JP S59101453 U JPS59101453 U JP S59101453U JP 1982196558 U JP1982196558 U JP 1982196558U JP 19655882 U JP19655882 U JP 19655882U JP S59101453 U JPS59101453 U JP S59101453U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
double mold
mold light
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982196558U
Other languages
Japanese (ja)
Inventor
直久 松本
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1982196558U priority Critical patent/JPS59101453U/en
Publication of JPS59101453U publication Critical patent/JPS59101453U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の自立形ＬＥＤの構造断面図。第２図は本
考案による自立形ＬＥＤの構造断面図。 第３図は従来のダブルエンド形ＬＥＤの構造断面図。第
４図は本考案によるダブルエンド形ＬＥＤの構造断面図
。第５図は本考案によるＤＩＰ形ＬＥＤの構造断面図。 １・・・透光性樹脂、２・・・カソード端子、３・・・
アノード端子、４・・・発光素子、５・・・ボンディン
グ線、６・・・軟化温度の高い樹脂。FIG. 1 is a cross-sectional view of the structure of a conventional free-standing LED. FIG. 2 is a structural sectional view of the free-standing LED according to the present invention. FIG. 3 is a structural sectional view of a conventional double-end type LED. FIG. 4 is a structural sectional view of the double-end type LED according to the present invention. FIG. 5 is a structural sectional view of the DIP type LED according to the present invention. 1... Translucent resin, 2... Cathode terminal, 3...
Anode terminal, 4... Light emitting element, 5... Bonding wire, 6... Resin with high softening temperature.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外囲器がプラスチックモールドで形成されている発光ダ
イオードにおいて前記発光ダイオードの発光部が透光性
樹脂で形成されており、また前記発光ダイオードのリニ
トフレーム引き出し部周辺の樹脂が融点の高い、軟化温
度の高い樹脂で形成された事を特徴とする二重モールド
構造を有、した発光ダイオード。In a light emitting diode whose envelope is formed of a plastic mold, the light emitting part of the light emitting diode is formed of a translucent resin, and the resin around the lead-out part of the lint frame of the light emitting diode has a high melting point and a softening temperature. A light-emitting diode with a double mold structure characterized by being made of a resin with a high temperature.
JP1982196558U 1982-12-27 1982-12-27 double mold light emitting diode Pending JPS59101453U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982196558U JPS59101453U (en) 1982-12-27 1982-12-27 double mold light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982196558U JPS59101453U (en) 1982-12-27 1982-12-27 double mold light emitting diode

Publications (1)

Publication Number Publication Date
JPS59101453U true JPS59101453U (en) 1984-07-09

Family

ID=30421629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982196558U Pending JPS59101453U (en) 1982-12-27 1982-12-27 double mold light emitting diode

Country Status (1)

Country Link
JP (1) JPS59101453U (en)

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