JPS59100594A - ワツクス付け処理装置の溶融ワツクス塗布制御部 - Google Patents
ワツクス付け処理装置の溶融ワツクス塗布制御部Info
- Publication number
- JPS59100594A JPS59100594A JP20929282A JP20929282A JPS59100594A JP S59100594 A JPS59100594 A JP S59100594A JP 20929282 A JP20929282 A JP 20929282A JP 20929282 A JP20929282 A JP 20929282A JP S59100594 A JPS59100594 A JP S59100594A
- Authority
- JP
- Japan
- Prior art keywords
- wax
- printed circuit
- circuit board
- molten wax
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004018 waxing Methods 0.000 title claims description 4
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 230000008018 melting Effects 0.000 title 1
- 238000002844 melting Methods 0.000 title 1
- 238000002347 injection Methods 0.000 claims description 20
- 239000007924 injection Substances 0.000 claims description 20
- 210000000078 claw Anatomy 0.000 claims description 7
- 238000005476 soldering Methods 0.000 description 24
- 238000010586 diagram Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- LOUPRKONTZGTKE-WZBLMQSHSA-N Quinine Chemical compound C([C@H]([C@H](C1)C=C)C2)C[N@@]1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OC)C=C21 LOUPRKONTZGTKE-WZBLMQSHSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- LOUPRKONTZGTKE-UHFFFAOYSA-N cinchonine Natural products C1C(C(C2)C=C)CCN2C1C(O)C1=CC=NC2=CC=C(OC)C=C21 LOUPRKONTZGTKE-UHFFFAOYSA-N 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20929282A JPS59100594A (ja) | 1982-12-01 | 1982-12-01 | ワツクス付け処理装置の溶融ワツクス塗布制御部 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20929282A JPS59100594A (ja) | 1982-12-01 | 1982-12-01 | ワツクス付け処理装置の溶融ワツクス塗布制御部 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59100594A true JPS59100594A (ja) | 1984-06-09 |
| JPH0145754B2 JPH0145754B2 (enrdf_load_stackoverflow) | 1989-10-04 |
Family
ID=16570523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20929282A Granted JPS59100594A (ja) | 1982-12-01 | 1982-12-01 | ワツクス付け処理装置の溶融ワツクス塗布制御部 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59100594A (enrdf_load_stackoverflow) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS523164A (en) * | 1975-06-27 | 1977-01-11 | Aiwa Co | Method of securing electric components printed circuit board |
| JPS55139867A (en) * | 1979-04-16 | 1980-11-01 | Nordson Corp | Method and device for distributing heat sensitive liquid polymer composition |
| JPS5687262U (enrdf_load_stackoverflow) * | 1979-12-06 | 1981-07-13 |
-
1982
- 1982-12-01 JP JP20929282A patent/JPS59100594A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS523164A (en) * | 1975-06-27 | 1977-01-11 | Aiwa Co | Method of securing electric components printed circuit board |
| JPS55139867A (en) * | 1979-04-16 | 1980-11-01 | Nordson Corp | Method and device for distributing heat sensitive liquid polymer composition |
| JPS5687262U (enrdf_load_stackoverflow) * | 1979-12-06 | 1981-07-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0145754B2 (enrdf_load_stackoverflow) | 1989-10-04 |
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