JPS5898937A - Wire bonding device - Google Patents
Wire bonding deviceInfo
- Publication number
- JPS5898937A JPS5898937A JP56197013A JP19701381A JPS5898937A JP S5898937 A JPS5898937 A JP S5898937A JP 56197013 A JP56197013 A JP 56197013A JP 19701381 A JP19701381 A JP 19701381A JP S5898937 A JPS5898937 A JP S5898937A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- wire
- current
- capillary
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
（１）発明の技術分野
本発明ＦｉＩＯ（集積回路）チップ等のワイヤボンディ
ング時に用いられるワイヤボンディング装置に関し１％
にボンディングワイヤの押圧力。Detailed Description of the Invention (1) Technical Field of the Invention The present invention relates to a wire bonding device used for wire bonding FiIO (integrated circuit) chips, etc. 1%
The pressing force of the bonding wire.
すなわち、ボンディング圧力を調整する装置に関する。That is, it relates to a device for adjusting bonding pressure.
（２）技術の背景
ワイヤボンディングとは、よく知られているように、１
０チツプ等の電極（ボンディング・パッド）と容器（ケ
ース）の外部リード線とを金線（ムｕＭ）、アルミニウ
ム線（ＡＩ線）Ｊｌの細いワイヤ（ボンディングワイヤ
）で接続することである。■０やトランジスタ等の劣化
はこのボンディング部に起因する場合が非常に多い、従
って、ワイヤボンディングＶｉｌＯ郷の製造技術におい
て非常に重要であり、ポンディングワイ゛ヤは適確に接
続される必要がある。このワイヤボンディングには、熱
田着法、起音波法及びその他の方法がある。(2) Technical background Wire bonding is, as is well known, 1.
The electrodes (bonding pads) of the 0-chip etc. and the external lead wires of the container (case) are connected with thin wires (bonding wires) such as gold wires (MUM) and aluminum wires (AI wires) Jl. ■Deterioration of wires, transistors, etc. is very often caused by this bonding part.Therefore, wire bonding is very important in manufacturing technology, and bonding wires must be connected properly. be. This wire bonding method includes a hot soldering method, a sonic method, and other methods.
しかし、現在では、 Ａｕ線又はＡ１線の熱圧着法が最
も実用化されている。この熱圧着法ではワイヤボンディ
ング時に、ＩＱチップ等に対してボンディングワイヤを
押圧する力、すなわちボンディング圧力を所定の最適圧
力に迅速に調整することが必要であり非常に重要である
。このボンディング圧力はワイヤ接続の良否を決定する
もので、大きすぎるとＩＣチップが破損される場合があ
り、ｔた逆に小さすぎるとワイヤの接続が不完全に終り
。However, at present, the thermocompression bonding method of Au wire or A1 wire is most practically used. In this thermocompression bonding method, it is necessary and very important to quickly adjust the force for pressing the bonding wire against the IQ chip, ie, the bonding pressure, to a predetermined optimum pressure during wire bonding. This bonding pressure determines the quality of the wire connection; if it is too high, the IC chip may be damaged, while if it is too low, the wire connection will be incomplete.
いづれの場合も適確なワイヤの接続が達成されない。従
って、常にボンディング圧力を所定の最適圧力に迅速に
調整できるワイヤボンディング装置が要望されている。In both cases, proper wire connections are not achieved. Therefore, there is a need for a wire bonding apparatus that can constantly and quickly adjust the bonding pressure to a predetermined optimum pressure.
（３）従来技術と問題点
第１図は従来のワイヤボンディング装置を説明する友め
の図である。同図において、符号１はボンディングアー
ム、２はキャピラリー、３はボンディングワイヤ、３１
Ｖｉすでに接続されたワイヤ。(3) Prior Art and Problems FIG. 1 is a companion diagram illustrating a conventional wire bonding device. In the figure, 1 is a bonding arm, 2 is a capillary, 3 is a bonding wire, and 31
Vi already connected wires.
４と５は圧力調整用ばね、６Ｖｉ圧力調整用ねじ。4 and 5 are pressure adjustment springs and 6Vi pressure adjustment screws.
７はボンディングヘッド、８Ｖｉ１０チツプ、 ８ｍ
はワイヤボンディング面、９は容器、ＨはＩＣチップの
厚さをそれぞれ示す０図示のように、アーム１ｔ−Ｉば
ね４と５によって上下方向に引張られて水平状に保持さ
れ、かつ基端１ａがヘッド７に支持されて基端１１を支
点として先端１ｂが上下方向（矢印Ａ）Ｋばね４又は５
の張力に抗して旋回できるように取り付けられている。7 is bonding head, 8Vi10 chip, 8m
9 is the wire bonding surface, 9 is the container, and H is the thickness of the IC chip. is supported by the head 7, and the tip 1b is supported in the vertical direction (arrow A) by the K spring 4 or 5 with the base end 11 as the fulcrum.
It is mounted so that it can pivot against the tension of the
ねじ６はばね４と接続されており、このねじ６によって
ばね４と５の張力が調整される。尚、このねじ４と５が
圧縮ばねで構成された装置もある。アーム１の先端Ｋｔ
ｌｉキャピラリー２が設けられている。キャピラリー２
はワイヤ３を上下方向に案内すると共にワイヤ３の先端
１ｋｒフイヤボンディング面８ａに押圧するものである
。この装置は以上のように構成され、ばね４と５の張力
（又は圧縮力）によってワイヤ３の押圧力、すなわちボ
ンディング圧力が調整される。しかしながらこの装置で
は、ワイヤボンディングに際して、ヘッド６が所定の位
置に位置決めされ、キャピラリー２がワイヤ３と共にワ
イヤボンディング面に接触したときパウンドして押圧力
が正しくかかるまでに時間がか＼るという欠点がある。The screw 6 is connected to the spring 4, and by means of this screw 6 the tension of the springs 4 and 5 is adjusted. Note that there is also a device in which the screws 4 and 5 are composed of compression springs. Tip of arm 1 Kt
A li capillary 2 is provided. capillary 2
is for guiding the wire 3 in the vertical direction and pressing the tip of the wire 3 against the 1kr fire bonding surface 8a. This device is constructed as described above, and the pressing force of the wire 3, that is, the bonding pressure, is adjusted by the tension (or compression force) of the springs 4 and 5. However, this device has the disadvantage that during wire bonding, it takes time for the head 6 to be positioned at a predetermined position and for the capillary 2 to pound together with the wire 3 when it comes into contact with the wire bonding surface and for the pressing force to be applied correctly. be.
この場合、ボンディング作業に先だち、ある１つのＩＣ
チップをモデルとしてボンディング面８ａＫ対するキャ
ピラリ２の押圧力が所定値になるような上下位置にボン
ディングヘッド７は予め設定されている。しかし、各Ｉ
Ｃテップの厚さ）１には製造公差内の誤差（ばらつき）
がある、従って、キャピラリ２の抑圧時における上下位
置は各ＩＣチップ毎に異なることになり、このため押圧
力（ボンディング圧力）が各１０チツプ毎に変動すると
いう欠点もある。In this case, prior to the bonding operation, one IC
Using the chip as a model, the bonding head 7 is set in advance at a vertical position such that the pressing force of the capillary 2 against the bonding surface 8aK becomes a predetermined value. However, each I
C-Tep thickness) 1 includes errors (variations) within manufacturing tolerances.
Therefore, the vertical position of the capillary 2 when it is depressed differs for each IC chip, which also has the disadvantage that the pressing force (bonding pressure) varies every 10 chips.
第２図は別の従来のワイヤボンディング装置を説明する
ための図である。同図において、１０はボールねじ軸、
１１はボールナツト部材、１２はボールねじ軸の回転駆
動用モータ（例えば直流モータ）をそれぞれ示し、他の
符号は第１図と同一部分をそれぞれ示す、アームｌはポ
ールナツト部材１１に一体的に衣層されている。ポール
ナツト部材１１ｔ’ｊ、第１図のヘッド７に相当するも
ので。FIG. 2 is a diagram for explaining another conventional wire bonding device. In the same figure, 10 is a ball screw shaft;
Reference numeral 11 indicates a ball nut member, 12 indicates a motor for rotating the ball screw shaft (for example, a DC motor), other symbols indicate the same parts as in FIG. has been done. The pole nut member 11t'j corresponds to the head 7 in FIG.
ボールねじ軸１０と螺合して該ボールねじ軸１０の回転
に応じて上下移動する。この装置の場合Ｆｉ。It is screwed together with the ball screw shaft 10 and moves up and down according to the rotation of the ball screw shaft 10. For this device, Fi.
前出の第１図の従来装置と同様に、ボンディング作業に
先だち、ある１つのｔａチップをモデルとして、キャピ
ラリ２が１０チツプ８のボンディング面８１と接触する
上下位置にポールナツト部材１１が予め位置決めされる
。次いで、この接触位置を別に設けた検知装置（図示な
し）によって検知してから更にポールナツト部材１１が
所定量だけ下降してキャピラリ２に押圧力を与える。す
なわち、この装置の場合も前出の従来装置と同様！ＩＣ
。Similar to the conventional apparatus shown in FIG. 1, prior to the bonding operation, the pole nut member 11 is pre-positioned at the upper and lower positions where the capillary 2 contacts the bonding surface 81 of the 10 chips 8, using a certain TA chip as a model. Ru. Next, after this contact position is detected by a separately provided detection device (not shown), the pole nut member 11 is further lowered by a predetermined amount to apply a pressing force to the capillary 2. In other words, this device is the same as the conventional device mentioned above! IC
.
常に一定位置から所定量だけキャピラリ２が下降してワ
イヤ３をボンディング面８ａ＋に抑圧するように構成さ
れている。従って、この装置の場合も、各ＩＣチップ８
の厚さＨの誤差により、キャピラリ２の押圧力が各ＩＣ
チップ毎に異なるので、すべてのＩＣチップに対して均
一で正確な押圧力を与えるのが困難である。また、キャ
ピラリ２の接触位置を検知する必要があるので作業工程
が煩雑化して好ましくない。The capillary 2 is always lowered by a predetermined amount from a fixed position to suppress the wire 3 to the bonding surface 8a+. Therefore, in the case of this device as well, each IC chip 8
Due to the error in the thickness H of the capillary 2, the pressing force of the capillary 2 is
Since each chip is different, it is difficult to apply a uniform and accurate pressing force to all IC chips. Furthermore, since it is necessary to detect the contact position of the capillary 2, the work process becomes complicated, which is not preferable.
（４）発明の目的
本発明は上記従来の欠点に鑑み、１０チツプの厚さの誤
差に関係なくボンディング圧力を常に所定の最適圧力に
迅速に調整することが可能なワイヤボンディング装置を
提供することを目的とするものである。(4) Purpose of the Invention In view of the above-mentioned conventional drawbacks, the present invention provides a wire bonding device that can always quickly adjust the bonding pressure to a predetermined optimum pressure regardless of the thickness error of 10 chips. The purpose is to
（５）発明の構成 上記目的を達成するために１本発明によれば。(5) Structure of the invention According to one aspect of the present invention, the above objects are achieved.
上下運動可能に設けられたボンディングヘッドと。A bonding head that can move up and down.
該ヘッドに水平方向から基端部が支持されたボンディン
グアームと該アームの先端部に設けられボンディングワ
イヤを案内して押圧するキャピラリとを有するワイヤボ
ンディング装置ｉＶｃおいて、上記アームの基端部をボ
イスコイルモータの可動部に結合して上下運動可能なボ
ンディングヘッドを形成し、上記モータの駆動電流を制
御するととくより上記ワイヤの押圧力を所定値に常に一
定に調整し得るようにしたことを特徴とするワイヤボン
ディング装置が提供される。In a wire bonding apparatus iVc, which has a bonding arm whose base end is supported by the head in a horizontal direction, and a capillary provided at the distal end of the arm to guide and press the bonding wire, the base end of the arm is A bonding head that is coupled to a movable part of a voice coil motor and capable of vertical movement is formed, and in particular, the pressing force of the wire can be constantly adjusted to a predetermined value by controlling the drive current of the motor. A wire bonding apparatus with features is provided.
（６） 発明の実施例
以下１本発明の実施例を図面に基づいて詳細に説明する
。(6) Embodiments of the Invention Below, one embodiment of the present invention will be described in detail based on the drawings.
第３図は本発明に依るワイヤボンディング装置を概略的
に示す側面図である。四回において、１３はボイスコイ
ルモータ、１４．１５．１６ 及び１７けそれぞれボイ
スコイルモータの断鉄、永久石磁石、ヨーク及び可動体
、１７烏は可動体に巻着されたコイル、１７ｂＶｉコイ
ルの給電線、１８はアーム固定部材をそれぞれ示し、他
の符号は前出の＠１図及び第２図と同一部分又ｒｉ部品
をそれぞれ示す、ボイスコイルモータ１３は継鉄１４゜
永久磁石１５．ヨーク１６及び可動体１７から成る。継
鉄１４は一端が開口され他端が閉鎖された円筒状く形成
され、開口を上向きにして配置されている。継鉄１４の
底壁１４畠上に円板状の永久磁石１５が継鉄１４と同軸
で固定され、更に永久磁石１５上に円柱状のヨーク１６
が該磁石１５と同軸で固定されている。可動体１７Ｆｉ
一端が開口され他端が閉鎖された円筒状に形成され継鉄
１４の内周面とヨーク１６の外周面との間に開口を下向
きにして上方より挿着され、上下運動可＃）：に保持さ
れている。この可動体１７は開口側外周にコイル１７ａ
が巻着され一種の電磁石に形成されており、上端面上に
アーム固定部材１８が固着されてい７る。尚、この固定
部材１８Ｆｉ可動体１７と一体で設けてもよい、ボンデ
ィングアーム１はその基端部１ｍが水平方向から固定部
材１８に固定され、骸固定部材１８及び可動体１７と共
に上下運動する。このように、アーム１と可動体１７が
一体的に結合されてボンディングヘッドを形成している
。さて、ボイスコイルモータ１３には、上記構成により
磁気回路が形成され永久磁石１５の磁束Φ１．Φ３が第
３図に示すように流れる。従って。FIG. 3 is a side view schematically showing a wire bonding apparatus according to the present invention. In the fourth session, 13 is the voice coil motor, 14, 15, 16 and 17 are the voice coil motor's iron break, permanent magnet, yoke and movable body, 17th is the coil wound around the movable body, and 17b is the Vi coil. The power supply line 18 indicates the arm fixing member, and the other symbols indicate the same parts or ri parts as in the above @1 and Fig. 2, respectively.The voice coil motor 13 has a yoke 14° and a permanent magnet 15. It consists of a yoke 16 and a movable body 17. The yoke 14 is formed into a cylindrical shape with one end open and the other end closed, and is arranged with the opening facing upward. A disk-shaped permanent magnet 15 is fixed coaxially with the yoke 14 on the bottom wall 14 of the yoke 14, and a cylindrical yoke 16 is further mounted on the permanent magnet 15.
is fixed coaxially with the magnet 15. Movable body 17Fi
It is formed into a cylindrical shape with one end open and the other end closed, and is inserted from above between the inner peripheral surface of the yoke 14 and the outer peripheral surface of the yoke 16 with the opening facing downward, allowing vertical movement. Retained. This movable body 17 has a coil 17a on the outer periphery of the opening side.
is wound around to form a kind of electromagnet, and an arm fixing member 18 is fixed on the upper end surface. The bonding arm 1, which may be provided integrally with the fixed member 18Fi and the movable body 17, has its base end 1m fixed to the fixed member 18 from the horizontal direction, and moves up and down together with the skeleton fixed member 18 and the movable body 17. In this way, the arm 1 and the movable body 17 are integrally coupled to form a bonding head. Now, in the voice coil motor 13, a magnetic circuit is formed with the above configuration, and the magnetic flux Φ1 of the permanent magnet 15. Φ3 flows as shown in FIG. Therefore.
コイル１７ａＫ電流が流れると、フレミング左手の法則
に基づき可動体１７が電流の流れる向ＩＫよってと方又
は下方に運動する。この可動体１７を運動させる力、す
なわちボイスコイルモータ１３が発生する力Ｆｔ１１次
式で示される。When a current flows through the coil 17aK, the movable body 17 moves in the direction IK of current flow, based on Fleming's left-hand rule. The force that moves this movable body 17, that is, the force generated by the voice coil motor 13, Ft, is expressed by a primary equation.
Ｆ＝ＢＩｉ ・・・拳・１・・・・・・・・−（１
）但し、Ｂけコイル１７ｍが発生する磁束密＆。F=BIi...Fist・1・・・・・・・－(1
) However, the magnetic flux density generated by the B coil 17m is...
１はコイル１７ｍの全長。1 is the total length of the coil 17m.
ｌはコイル１７ａＫｆｉれる電流。l is the current flowing through the coil 17aKfi.
（１）弐において、 Ｂｌはボイスコイルモータ１３
の力係数であり、ニュートン／アンペア（Ｎ／Ａ ）の
単位で弐わされるものである。従って、ボイスコイルモ
ータ１３においては、力Ｆの大きさは電流ｉの大きさに
比−１し、電ｆＩｔ＋を一定値に保てば力Ｆも常く一定
である。本発明はボイスコイルモータのこのような性質
を利用してワイヤボンディング時に定押圧力をキャピラ
リ２に与えるようにしたものである０本装置では、ワイ
ヤボンディングに際して、キャピラリ２は、電流ｉを所
定値に一定に制御すれば、キャピラリ２は上下位置に関
係なく常（一定の力（押圧力）が与えられる。従って。(1) In 2, Bl is the voice coil motor 13
It is the force coefficient of , expressed in units of newtons per ampere (N/A). Therefore, in the voice coil motor 13, the magnitude of the force F is proportional to the magnitude of the current i by -1, and if the electric current fIt+ is kept at a constant value, the force F will always be constant. The present invention utilizes such properties of the voice coil motor to apply a constant pressing force to the capillary 2 during wire bonding. If the capillary 2 is controlled to be constant, a constant force (pressing force) will always be applied to the capillary 2 regardless of its vertical position.
ＩＯチップ８の厚さＨの誤差に間係なくきわめて適確で
しかも均一なワイヤボンディングが達成される。Extremely accurate and uniform wire bonding is achieved regardless of the error in the thickness H of the IO chip 8.
第４図は本発明のワイヤボンディング装置によるワイヤ
ボンディング工程を説明するための経時線図である。同
図について説明すると１．縦軸のＸはワイヤボンディン
グ面８ｍ（第３図）からキャピラリ２（第３図）までの
高さ距離、横軸のｔｉｊ径過径間時間す、ｔｅ、点ｐ１
． ｐ、、 ｐｌ・・・・・はボンディング時のキャピ
ラリ２の位置を示す点で。FIG. 4 is a time chart for explaining the wire bonding process using the wire bonding apparatus of the present invention. To explain the figure: 1. X on the vertical axis is the height distance from the wire bonding surface 8m (Fig. 3) to the capillary 2 (Fig. 3), and the horizontal axis is tij, diameter time, te, point p1.
．． p,, pl... are points indicating the position of capillary 2 during bonding.
Ｐいは原点を示し、Ｐ２はポンディング面８１からある
程度離れた距離（例えばｌ ｒｙｕｎ ）にある点で通
常サーチレベルと呼ばれている。ｐ、Ｔｒｉボンデイン
グ面８ ａ Ｋ接触（厳密にはワイヤ３が接触）した点
を示す。ボンディングに際し、ＰｌＦ、間は高速で移動
し＊ Ｐ２２１間は所望の押圧力（ボンディング圧力）
に応じた電流をコイル１７ｍ（第３図）に流して駆動さ
れる。Ｐ、でボンディング面に接するとボンディングア
ーム１は停止するがコイル１７ｍ（＠３図）に流れてい
る電流に応じた所望の押圧力がボンディング面８ｍ（第
３図）に作用するｍ ＰＩ １４間はこの押圧力が連続
して作用している時間であり、この間にワイヤ３（第３
図）のボンディングが行われる。Ｐ４でボンディングが
完了し高速で中間点Ｐｓにもどる。Ｐ、からＰ、までｔ
−ｔ−ｈ記Ｐ、からＰｓまでの動作と同様に動作して次
のボンディングが行われる。従って、第４図における符
号８１とＢ！はそれぞれ第１と第２ボンデイングの経過
時間を示している。このようにして次々にワイヤボンデ
ィングが行われる。P indicates the origin, and P2 is a point located at a certain distance from the pounding surface 81 (for example, l ryun ) and is usually called a search level. p, Tri bonding surface 8 a K contact (strictly speaking, wire 3 contacts) is shown. When bonding, move at high speed between PIF and *P221 is the desired pressing force (bonding pressure)
It is driven by passing a current corresponding to the current through the coil 17m (FIG. 3). When the bonding arm 1 comes into contact with the bonding surface at P, the bonding arm 1 stops, but a desired pressing force according to the current flowing in the coil 17m (@Fig. 3) acts on the bonding surface 8m (Fig. 3) between m PI 14. is the time during which this pressing force is continuously applied, and during this time the wire 3 (third
The bonding shown in Figure) is performed. Bonding is completed at P4 and the process returns to the intermediate point Ps at high speed. P, to P,t
The next bonding is performed in the same manner as the operations from P to Ps in -t-h. Therefore, the symbol 81 in FIG. 4 and B! indicate the elapsed time of the first and second bonding, respectively. In this way, wire bonding is performed one after another.
（７）発明の効果
以上、評細に説明したように１本発明のワイヤボンディ
ング装置は、ボイスコイルモータの駆動電流を制御する
ことにより、ＩＣチップの厚さ誤差に、関係なく常に所
定のボンディング圧力が迅速に得られ、ボンディング時
間の短縮、ボンディング作業の安定性、及び品質の向上
等の効果大なるものがある。(7) Effects of the Invention As described above in detail, the wire bonding device of the present invention always achieves a predetermined bonding temperature by controlling the drive current of the voice coil motor, regardless of the thickness error of the IC chip. Pressure can be obtained quickly, and there are great effects such as shortening bonding time, stability of bonding work, and improvement of quality.
第１図は従来のワイヤボンディング装置の説明図、第２
図は別の従来のワイヤボンディング装置の説明図、第３
図は本発明のワイヤボンデインｙの概略側面図、第４図
は本発明の装置によるワイヤボンディング工程を説明す
る念めの経時線図である。
１・・・ボンディングアーム、２・・・キャピラリ。
３・・・ボンディングワイヤ、１３・・・ボイスコイル
モータ、１４・・・継鉄、１５・・・永久磁石、１６・
・・ヨーク、１７・・・可動部（ボイスコイルモータの
可動部）。
１７ｍ・・・コイル、１８・・・ボンディングアーム固
定部材。
第２図
第３図Figure 1 is an explanatory diagram of a conventional wire bonding device;
Figure 3 is an explanatory diagram of another conventional wire bonding device.
The figure is a schematic side view of the wire bonding device y of the present invention, and FIG. 4 is a time-lapse diagram for explaining the wire bonding process using the apparatus of the present invention. 1...Bonding arm, 2...Capillary. 3... Bonding wire, 13... Voice coil motor, 14... Yoke, 15... Permanent magnet, 16...
... Yoke, 17... Movable part (movable part of voice coil motor). 17m...Coil, 18...Bonding arm fixing member. Figure 2 Figure 3
Claims (1)
該ヘッドに水平方向から基端部が支持されたボンディン
グアームと、＃アームの先端部に設けられボンディング
ワイヤを案内して押圧するキャピラリと管有するワイヤ
ボンディング装置において、上記アームの基端部をボイ
スコイルモータの可動部に結合して上下運動可能なボン
ディングヘッドを形成し、上記モータの駆動電流を制御
することにより上記ワイヤの押圧力を所定値に常に一定
に調整し得るようにしたことを特徴とするワイヤボンデ
ィング装置。l A bonding head that is movable up and down,
In a wire bonding device having a bonding arm whose proximal end is supported horizontally by the head, and a capillary and a tube provided at the distal end of the arm to guide and press the bonding wire, the proximal end of the arm is voiced. A bonding head that is coupled to a movable part of a coil motor and capable of vertical movement is formed, and the pressing force of the wire can be constantly adjusted to a predetermined value by controlling the drive current of the motor. wire bonding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56197013A JPS5898937A (en) | 1981-12-09 | 1981-12-09 | Wire bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56197013A JPS5898937A (en) | 1981-12-09 | 1981-12-09 | Wire bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5898937A true JPS5898937A (en) | 1983-06-13 |
Family
ID=16367327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56197013A Pending JPS5898937A (en) | 1981-12-09 | 1981-12-09 | Wire bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5898937A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT411855B (en) * | 2001-06-26 | 2004-06-25 | Datacon Semiconductor Equip | POSITIONING DEVICE |
-
1981
- 1981-12-09 JP JP56197013A patent/JPS5898937A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT411855B (en) * | 2001-06-26 | 2004-06-25 | Datacon Semiconductor Equip | POSITIONING DEVICE |
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