JP3786991B2 - Wire bonding method - Google Patents

Wire bonding method Download PDF

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Publication number
JP3786991B2
JP3786991B2 JP29202495A JP29202495A JP3786991B2 JP 3786991 B2 JP3786991 B2 JP 3786991B2 JP 29202495 A JP29202495 A JP 29202495A JP 29202495 A JP29202495 A JP 29202495A JP 3786991 B2 JP3786991 B2 JP 3786991B2
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Prior art keywords
bonding
wire
point
capillary
bonding point
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JPH09115940A (en
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幸則 大石
淳一 及川
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Kaijo Corp
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Kaijo Corp
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、ワイヤボンディング方法に係り、特に半導体デバイスの組立工程において、第１ボンディング点、例えば半導体チップ上の電極（パッド）と第２ボンディング点、例えばリードフレームに配設された外部リードとの間を金線又は銅，アルミニウムなどのワイヤを用いて接続を行うワイヤボンディングのループ形成方法に関する。
【０００２】
【従来技術】
従来、ワイヤボンディングにおけるループ形成方法は、例えば特開昭６３−４２１３５号公報に開示されているものが知られている。これは第１ボンディング点にワイヤを接続後、キャピラリを少し上昇させ、続いて第２ボンディング点と逆方向に僅かに水平移動させ、その後ループ形成に必要な量だけキャピラリを上昇させてワイヤを繰り出し、次にキャピラリを前記したループ形成に必要な量を半径とした円軌道をもって第２ボンディング点上方に移動させてワイヤを第２ボンディング点に接続する。
【０００３】
この従来のループ形成方法について図７を用いて説明すると、キャピラリ１０２を第２ボンディング点１０４と逆方向に僅かに点１０５まで水平移動させる。これによりワイヤ１０１は、点１０３から点１０５に傾斜した形状となり、キャピラリ１０２の下端に位置するワイヤ１０１の点１０５部分に癖が付く。次に、点１０５でキャピラリ１０２を一旦又は瞬時停止させ、その後キャピラリ１０２をワイヤループ形成にしたがって上昇させる。次に、キャピラリ１０２をｒを半径とする円軌道で第２ボンディング点１０４の上方の点１０６まで移動させ、続いて第２ボンディング点１０４に下降させてボンディングする。ワイヤ１０１の癖、点１０５部分を中心としてワイヤ１０１は曲がり、癖、１０５部分がワイヤループの頂点となるので、ワイヤループ形状が安定し、ループのたれ、曲りが防止される。この癖、１０５部分の設定によりループ高さを制御することができる。
【０００４】
【発明が解決しようとする課題】
しかしながら、従来の方法は、第１ボンディング点１０３にワイヤ１０１を接続後、キャピラリ１０２を少し上昇させ、続いて第２ボンディング点１０４と逆方向に僅かに水平移動させるのであるが、図７に示すように、この時につくワイヤの点１０５（点１０７も含む）の折り曲げ部に着く癖は強固なもので、形成されるループの高さ及び形状を決定する要因となるが、第１ボンディング点１０３にワイヤを接続後、キャピラリ１０２を少し上昇させ、続いて第２ボンディング点１０４と逆方向に僅かに移動させる過程において、第１ボンディング点１０３に接続されたワイヤ１０１の直上に応力が働き、第１ボンディング点１０３に接続されたワイヤ１０１の直上のワイヤ１０１に亀裂若しくは皺が発生し易く、ワイヤボンディングの信頼性を著しく低下させる恐れがある。すなわち、点１０５まで移動すると、第１ボンディング点１０３にいわゆるストレスがかかってしまい、引っ張り強度の低下を招くおそれがある。
【０００５】
そこで、本発明は上記従来技術の欠点に鑑みてなされたものであって、上記第２ボンディング点と逆方向に僅かに移動させる過程における第１ボンディング点に接続されたワイヤの直上の亀裂若しくは皺の発生を軽減し、ワイヤボンディングの信頼性を向上させることができるワイヤボンディング方法を提供することを目的とする。
【０００６】
【課題を解決するための手段】
本発明に係るワイヤボンディング方法は、第１ボンディング点と第２ボンディング点との間をワイヤを用いて接続するワイヤボンディング方法において、第１ボンディング点Ａにワイヤを接続後、キャピラリを該第１ボンディング点Ａの鉛直線上に所定の距離Ｌまで上昇させた後、第２ボンディング点と逆の方向で前記距離Ｌより低くかつ第１ボンディング点Ａを円心とし、距離Ｌを半径とするＥ点より下方であって、前記第１ボンディング点よりも高い所定の位置Ｄまでキャピラリを下降させ、該位置よりキャピラリを上昇させてループ形成に必要な量より少し多い量のワイヤを繰り出しつつキャピラリを所定のループコントロールにしたがって第２ボンディング点上方へ移動させてワイヤを第２ボンディング点に接続するワイヤボンディング方法であって、前記第１ボンディング点から前記位置Ｄまでの距離をＳとすると、該距離Ｓは前記距離Ｌ＞Ｓの関係となるように設定されていることを特徴とする。
【０００７】
【発明の実施の形態】
本発明は、第１ボンディング点Ａにワイヤを接続後、キャピラリ２を少し上昇させ、その後第１ボンディング点Ａと第２ボンディング点を結んで想定される直線上で第２ボンディング点と逆の方向で且つ先に第１ボンディング点の鉛直線上に上昇したところより低く、長さＳが高さＬより短くなるように、即ちＬ＞Ｓとなるようにキャピラリ２を移動制御させることによって接続されたワイヤ１１とキャピラリ２の間にループ形成に必要な量より少し多い量のワイヤを繰り出してたるみ１１ａを発生させ、第１ボンディング点Ａに接続されたワイヤ１１の直上に働く応力を軽減させて、ワイヤボンディングにおける信頼性、特にワイヤボンディング工程における品質検査である引っ張り強度試験での強度確保並びに封入工程における樹脂により働く応力によるワイヤの破断不良を未然に防ぐものである。
【０００８】
【実施例】
次に、本発明に係るワイヤボンディング装置の実施例を説明する。
【０００９】
図１は、本発明に係るワイヤボンディング装置の構成を示す正面図、図２は、図１の一部断面を含む側面図、図３は、図２に示す角度センサーの特性の一例を示す図である。
【００１０】
図１及び図２において、ヘッドベース４上に載置されているボンディングヘッド１は、Ｘ方向及びＹ方向に移動可能なＸＹテーブルに搭載されており、このＸＹテーブルによりボンディングヘッド１を移動させて位置決めしリードフレームのリードと半導体ペレット上のパッド（電極）との間にキャピラリ２を用いてワイヤ１１によるボンディング接続を行う。このボンディングヘッド１のキャピラリ２の下方にはボンディング作業を行うボンディングステージ上に配置された半導体ペレット（図示せず）が載置されている。
【００１１】
ボンディングアーム３は、ヘッドベース４に支持された軸５に揺動可能に取付けられており、このボンディングアーム３には、自由端部に向かって略円錐形状のホーン３ａが取り付けられている。このホーン３ａの先端にはキャピラリ２が取付けられている。このキャピラリ２の中心にはアルミニウム又は金線等で構成されるワイヤ１１が挿通可能な孔が形成されており、該孔を通してホーン３ａ上方の図示せぬクランパー等によりクランプされたワイヤ１１がキャピラリ２の先端より所定長さ送り出されるように構成されている。このワイヤ１１の他方はリール（図示せず）により巻回されており、このワイヤ１１がたるまないように所定のテンションがかけられている。
【００１２】
また、上記ボンディングアーム３の他方の端部にはリニアモータ６のボイスコイル６ａが設けられ、このボイスコイル６ａは永久磁石とヨークで構成される磁気回路６ｂの空隙内に上下に揺動可能に嵌挿されている。この磁気回路６ｂは、ヘッドベース４上に載置されている。このヘッドベース４は、Ｘ方向及びＹ方向に駆動可能なＸＹテーブル（図示せず）に搭載されている。
【００１３】
また、ボンディングアーム３が支持されている軸５の端部には、ボンディングヘッド１のキャピラリ２の先端移動量及びツール位置の検出を行う角度センサー１０が設けられている。
【００１４】
この角度センサー１０は、磁気角度センサー発磁体１０ａと磁気角度センサー検出部１０ｂとで構成されている。この磁気角度センサー発磁体１０ａは、断面略コ字形状の円筒体であって、軸５の先端部分にねじ穴９を用いて螺合結合される。一方、磁気角度センサー検出部１０ｂは、ヘッドベース４の枠体側面に取付け固定されており、該検出部の検出を行うセンサー棒１０ｂ1 が前記磁気角度センサー発磁体１０ａの円筒内に非接触な状態で挿入されている。
【００１５】
磁気角度センサー発磁体１０ａは、ボンディングアーム３が軸５を支点とする揺動運動により回転され、磁気角度センサー検出部１０ｂに対する発磁体１０ｂの角度に比例するアナログ信号が出力されるように構成されている。この角度センサー１０の出力電圧と角度との関係は、図３に示されている。また、本実施例では、この得られたアナログ信号を図示せぬＡ／Ｄ変換器によりデジタル信号に変換して最適な分解能が得られるように適宜設定されている。
【００１６】
以上のような構成よりなる本装置の作用について以下に説明する。
【００１７】
まず、ボンディングアーム３に取り付けられているリニアモータ６のボイスコイル６ａが励磁されると、リニアモータ６の推力によりボンディングアーム３は軸５を支点として図１の反時計方向に揺動して回動する。そして、キャピラリ２の先端が半導体ペレットのパッドの上方所定位置まで高速で降下した後低速移動に移行してキャピラリ２の先端に図示せぬ電気放電手段により形成されたボールを半導体ペレット上のパッド上面に押しつぶして熱圧着ボンディングが行なわれる。このときキャピラリ２の先端に超音波振動を印加してボンディングを行うこともある。
【００１８】
このキャピラリ２の移動量は、角度センサー１０から回転角に応じて出力されるアナログ信号が図示せぬマイクロコンピュータ等よりなる制御手段に入力され、この制御手段によりキャピラリ２の移動量及び位置が演算して求められる。つまり、この角度センサー１０により図３に示すような出力電圧と角度との関係から、例えば、磁気角度センサー検出部１０ｂの出力電圧が１Ｖであれば、キャピラリ２が１０度の位置にあることがわかり、ボンディングアーム３のホーン３ａの軸方向中心を基準位置として０Ｖにオフセットすることによってキャピラリ２の移動量を求めることができると共にボンディングステージからツールまでの絶対的高さを求めることができる。しかも、磁気角度センサー検出部１０ｂの基準位置で＋１Ｖの出力が得られている場合には、−１Ｖに設定することにより容易にオフセット調整が可能であるので、角度センサー１０の取付け具合に影響されない。
【００１９】
逆に、ボンディング接続された後はリニアモータ６のボイスコイル６ａを励磁させて図１の時計方向にボンディングアーム３を予め設定された移動量分だけ軸５を中心に回動させて停止させ、次のボンディング点であるリード側にボンディングヘッド１をＸＹテーブルを移動させて上記と同じ工程によりボンディングする。
【００２０】
以上のような工程を繰返して全ての半導体チップとリードとを接続させてボンディングが完了する。
【００２１】
次に、本発明に係るワイヤボンディング方法は、上記のようなワイヤボンディング装置を用いて行われるボンディング方法の実施例を図４乃至図６を用いて説明する。
【００２２】
図４において、第１ボンディング点Ａにワイヤを接続後、キャピラリ２を少し上昇させ、その後第１ボンディング点Ａと第２ボンディング点を結んで想定される直線上で第２ボンディング点と逆の方向で且つ先に第１ボンディング点の鉛直線上に上昇したところより低く、長さＳが高さＬより短くなるように、即ちＬ＞Ｓとなるようにキャピラリ２を移動制御させることによって接続されたワイヤ１１とキャピラリ２の間にループ形成に必要な量より少し多い量のワイヤを繰り出してたるみ１１ａを発生させ、第１ボンディング点Ａに接続されたワイヤ１１の直上に働く応力を軽減させて、ワイヤボンディングにおける信頼性、特にワイヤボンディング工程における品質検査である引っ張り強度試験での強度確保並びに封入工程における樹脂により働く応力によるワイヤの破断不良を未然に防ぐものである。
【００２３】
図４に示すようなワイヤ接続を行うために、図５を用いて説明する。図５は、本発明に係るキャピラリの移動軌跡を示す説明図である。
【００２４】
そこで、図５に示すキャピラリの移動軌跡を図６に示すフローチャートを用いて説明すると、まず、図５に示す第１ボンディング点Ａからキャピラリ２をプログラム上で指定された位置Ｂ点まで垂直に上昇させる（ステップＳ1 ）。この第１ボンディング点ＡからＢ点までの距離をＬとする。この距離Ｌは、予め図示せぬ制御手段にメモリされている。また、この距離Ｌは任意の値に設定され、図２に示す角度センサー１０によって求められる。
【００２５】
次に、ＸＹテーブルを移動させて第１ボンディング点Ａと第２ボンディング点を結んで想定される直線上で第２ボンディング点と逆の方向に移動させると同時に図１に示すボンディングアーム３を反時計方向に回動させてＺ軸方向に下降させる（ステップＳ2 ）。
【００２６】
キャピラリ２がＢ点からＤ点に行ったかどうかを判定する（ステップＳ3 ）。この時、Ｂ点とＣ点間の距離は予め図示せぬプログラム上にメモリされており、また距離Ｌを半径とするＥ点についてもメモリされている。したがって、Ｄ点がＥ点より上方にならないように予め図示せぬ制御手段内にプログラムされている。
【００２７】
このＤ点まで到達した後、キャピラリ２を上昇させて所定のループコントロールにしたがってワイヤ１１を第２ボンディング点に移動させてボンディングする（ステップＳ4 ）。このＤ点から第２ボンディング点に至るまでのループコントロールについては種々可変可能であるが、最適なものが用いられる。
【００２８】
上記方法によれば、従来のキャピラリの軌跡と本発明によるキャピラリの軌跡でのワイヤの引っ張り強度の比較を実施したところ、従来のキャピラリの軌跡を用いた場合のワイヤ引っ張り強度は、１０．３ｇｆであるのに対して、本発明を用いた場合の引っ張り強度は、１１．７ｇｆであった。したがって、本発明を用いた場合、従来のキャピラリ軌跡を用いた場合より引っ張り強度の平均で約１４％の改善効果が確認できた。
【００２９】
なお、本発明に係るワイヤボンディング方法では、キャピラリ２が図４及び図５に示す高さＬまで上昇した点の位置制御は、ワイヤボンディング装置側で制御されているが、実際にキャピラリ２が高さＬの最上昇点に位置した次の瞬間に下方に下げる。この下方への制御は、図４に示すように任意の角度θをもって制御するようにしてもよい。この角度θの下げ量並びにＳはループ形状やループ高さによって任意に設定される。しかして、本発明では図４に示す角度センサー１０によって制御されるので図３に示すようなデータに基づいてＤ点の位置が求められるので角度θはそれにしたがって求まる。よって角度θによる制御を行う場合には予め角度を算出してメモリを行えばよい。
【００３０】
上記のようなワイヤボンディング方法では、図１乃至図３に示すワイヤボンディング装置を用いているが、他の構成によるワイヤボンディング装置を用いて同様のループ形成を行うようにしてもよい。
【００３１】
【発明の効果】
以上の通り、本発明によれば、第１ボンディング点にワイヤを接続後、キャピラリを少し上昇させ、続いて第２ボンディング点と逆方向に且つ下方に移動させることによって、ワイヤの直上に働く応力によって発生する亀裂及び皺を軽減することができ、ワイヤボンディングにおける信頼性を向上させることができる効果がある。
【図面の簡単な説明】
【図１】図１は、本発明に係るワイヤボンディング装置の構成を示す正面図である。
【図２】図２は、図１の一部断面を含む側面図である。
【図３】図３は、図２に示す角度センサーの特性の一例を示す図である。
【図４】図４は、本発明に係るキャピラリの移動軌跡を示す図である。
【図５】図５は、本発明に係るキャピラリの移動軌跡を示す説明図である。
【図６】図６は、本発明に係るワイヤボンディング方法を説明するフローチャートである。
【図７】図７は、従来のキャピラリの移動軌跡によるワイヤ形状を示す説明図である。
【符号の説明】
１ ボンディングヘッド
２ キャピラリ
３ ボンディングアーム
４ ヘッドベース
５ 軸
６ リニアモータ
１０ 角度センサー
１１ ワイヤ
１１ａ たるみ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wire bonding method, and in particular in a semiconductor device assembly process, a first bonding point, for example, an electrode (pad) on a semiconductor chip and a second bonding point, for example, an external lead disposed on a lead frame. The present invention relates to a wire bonding loop forming method in which a connection is made using a wire such as a gold wire, copper, or aluminum.
[0002]
[Prior art]
Conventionally, a loop forming method in wire bonding is known, for example, as disclosed in JP-A-63-42135. After connecting the wire to the first bonding point, raise the capillary slightly, then move it slightly in the direction opposite to the second bonding point, then raise the capillary by the amount necessary for loop formation and feed the wire Next, the capillary is moved above the second bonding point with a circular orbit having a radius necessary for the loop formation described above, and the wire is connected to the second bonding point.
[0003]
This conventional loop forming method will be described with reference to FIG. 7. The capillary 102 is moved horizontally to the point 105 slightly in the direction opposite to the second bonding point 104. As a result, the wire 101 is inclined from the point 103 to the point 105, and the point 105 portion of the wire 101 located at the lower end of the capillary 102 is wrinkled. Next, the capillary 102 is temporarily or momentarily stopped at the point 105, and then the capillary 102 is raised according to the wire loop formation. Next, the capillary 102 is moved to a point 106 above the second bonding point 104 by a circular orbit having r as a radius, and subsequently lowered to the second bonding point 104 for bonding. The wire 101 bends around the wrinkle and point 105 portion of the wire 101, and the wrinkle and 105 portion becomes the apex of the wire loop, so that the shape of the wire loop is stabilized, and the loop is bent and bent. The loop height can be controlled by setting the 105 portion.
[0004]
[Problems to be solved by the invention]
However, in the conventional method, after the wire 101 is connected to the first bonding point 103, the capillary 102 is slightly raised and then moved slightly horizontally in the direction opposite to the second bonding point 104, as shown in FIG. As described above, the heel that arrives at the bent portion of the wire point 105 (including the point 107) attached at this time is strong and is a factor that determines the height and shape of the formed loop. In the process of slightly raising the capillary 102 after connecting the wire to the second bonding point 104 and then moving it slightly in the direction opposite to the second bonding point 104, stress acts on the wire 101 connected to the first bonding point 103, The wire 101 immediately above the wire 101 connected to one bonding point 103 is likely to be cracked or wrinkled. Which may significantly reduce the resistance. In other words, when moving to the point 105, so-called stress is applied to the first bonding point 103, which may cause a decrease in tensile strength.
[0005]
Therefore, the present invention has been made in view of the drawbacks of the prior art described above, and it is a crack or flaw directly above the wire connected to the first bonding point in the process of slightly moving in the direction opposite to the second bonding point. An object of the present invention is to provide a wire bonding method capable of reducing the occurrence of the above and improving the reliability of wire bonding.
[0006]
[Means for Solving the Problems]
The wire bonding method according to the present invention is a wire bonding method in which a wire is connected between a first bonding point and a second bonding point, and after connecting the wire to the first bonding point A, the capillary is connected to the first bonding point. After raising to a predetermined distance L on the vertical line of the point A, from the point E which is lower than the distance L in the direction opposite to the second bonding point, the first bonding point A is a circle, and the distance L is a radius. The capillary is lowered to a predetermined position D that is lower and higher than the first bonding point, and the capillary is moved up from the position to feed out a slightly larger amount of wire than is necessary for loop formation. A wire bonder that connects the wire to the second bonding point by moving it above the second bonding point according to the loop control. A grayed method, when the distance from the first bonding point to the position D and S, the distance S is characterized in that it is set such that the relationship between the distance L> S.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, after connecting the wire to the first bonding point A, the capillary 2 is raised slightly, and then the direction opposite to the second bonding point on the straight line assumed by connecting the first bonding point A and the second bonding point. And connected by moving the capillary 2 so that the length S is shorter than the height of the first bonding point and the length S is shorter than the height L, that is, L> S. A slack 11a is generated by feeding a wire slightly larger than the amount necessary for loop formation between the wire 11 and the capillary 2, and the stress acting directly on the wire 11 connected to the first bonding point A is reduced. Reliability in wire bonding, especially ensuring strength in the tensile strength test, which is a quality inspection in the wire bonding process, and resin in the encapsulation process. Is intended prevent breakage failure of the wire due to stress acting.
[0008]
【Example】
Next, an embodiment of the wire bonding apparatus according to the present invention will be described.
[0009]
1 is a front view showing a configuration of a wire bonding apparatus according to the present invention, FIG. 2 is a side view including a partial cross section of FIG. 1, and FIG. 3 is a view showing an example of characteristics of an angle sensor shown in FIG. It is.
[0010]
1 and 2, the bonding head 1 mounted on the head base 4 is mounted on an XY table that can move in the X direction and the Y direction. The bonding head 1 is moved by the XY table. Positioning is performed, and a bonding connection using a wire 11 is performed between the lead of the lead frame and the pad (electrode) on the semiconductor pellet using the capillary 2. Below the capillary 2 of the bonding head 1, a semiconductor pellet (not shown) placed on a bonding stage for performing a bonding operation is placed.
[0011]
The bonding arm 3 is swingably attached to a shaft 5 supported by the head base 4, and a substantially conical horn 3a is attached to the bonding arm 3 toward the free end. A capillary 2 is attached to the tip of the horn 3a. A hole through which a wire 11 made of aluminum or gold wire or the like can be inserted is formed at the center of the capillary 2, and the wire 11 clamped by a clamper or the like (not shown) above the horn 3a is passed through the hole. It is configured to be fed out a predetermined length from the tip of the. The other end of the wire 11 is wound by a reel (not shown), and a predetermined tension is applied so that the wire 11 does not sag.
[0012]
The other end of the bonding arm 3 is provided with a voice coil 6a of a linear motor 6. The voice coil 6a can swing up and down in a gap of a magnetic circuit 6b composed of a permanent magnet and a yoke. It is inserted. This magnetic circuit 6 b is placed on the head base 4. The head base 4 is mounted on an XY table (not shown) that can be driven in the X and Y directions.
[0013]
An angle sensor 10 is provided at the end of the shaft 5 on which the bonding arm 3 is supported to detect the amount of movement of the tip of the capillary 2 of the bonding head 1 and the tool position.
[0014]
The angle sensor 10 includes a magnetic angle sensor generator 10a and a magnetic angle sensor detector 10b. The magnetic angle sensor magnet generator 10 a is a cylindrical body having a substantially U-shaped cross section, and is screwed to the tip portion of the shaft 5 using a screw hole 9. On the other hand, the magnetic angle sensor detecting portion 10b is attached and fixed to the frame sides of the head base 4, the sensor rod 10b 1 for detecting a detection portion ne contactless into the cylinder of the magnetic angle sensor onset magnet body 10a Inserted in a state.
[0015]
The magnetic angle sensor generator 10a is configured such that the bonding arm 3 is rotated by a swinging motion about the shaft 5, and an analog signal proportional to the angle of the magnet generator 10b with respect to the magnetic angle sensor detector 10b is output. ing. The relationship between the output voltage and angle of the angle sensor 10 is shown in FIG. Further, in this embodiment, the obtained analog signal is appropriately set so as to obtain an optimum resolution by converting it into a digital signal by an A / D converter (not shown).
[0016]
The operation of this apparatus having the above configuration will be described below.
[0017]
First, when the voice coil 6a of the linear motor 6 attached to the bonding arm 3 is excited, the bonding arm 3 swings counterclockwise in FIG. Move. Then, the tip of the capillary 2 descends at a high speed to a predetermined position above the pad of the semiconductor pellet and then moves to a low-speed movement, and the ball formed by the electric discharge means (not shown) on the tip of the capillary 2 Then, thermocompression bonding is performed. At this time, bonding may be performed by applying ultrasonic vibration to the tip of the capillary 2.
[0018]
As for the movement amount of the capillary 2, an analog signal output according to the rotation angle from the angle sensor 10 is input to a control means such as a microcomputer (not shown), and the movement amount and position of the capillary 2 are calculated by this control means. Is required. That is, from the relationship between the output voltage and the angle as shown in FIG. 3 by the angle sensor 10, for example, if the output voltage of the magnetic angle sensor detection unit 10b is 1V, the capillary 2 may be at a position of 10 degrees. Obviously, the amount of movement of the capillary 2 can be determined by offsetting it to 0 V with the axial center of the horn 3a of the bonding arm 3 as a reference position, and the absolute height from the bonding stage to the tool can be determined. In addition, when an output of + 1V is obtained at the reference position of the magnetic angle sensor detection unit 10b, the offset adjustment can be easily performed by setting to -1V, so that it is not affected by how the angle sensor 10 is attached. .
[0019]
On the contrary, after the bonding connection, the voice coil 6a of the linear motor 6 is excited, and the bonding arm 3 is rotated about the shaft 5 by a predetermined amount of movement in the clockwise direction in FIG. The bonding head 1 is bonded to the lead side which is the next bonding point by moving the XY table by the same process as described above.
[0020]
The above process is repeated to connect all the semiconductor chips and leads to complete the bonding.
[0021]
Next, the wire bonding method according to the present invention will be described with reference to FIGS. 4 to 6 as examples of the bonding method performed using the wire bonding apparatus as described above.
[0022]
In FIG. 4, after connecting the wire to the first bonding point A, the capillary 2 is raised slightly, and then the direction opposite to the second bonding point on the straight line assumed by connecting the first bonding point A and the second bonding point. And connected by moving the capillary 2 so that the length S is shorter than the height of the first bonding point and the length S is shorter than the height L, that is, L> S. A slack 11a is generated by feeding a wire slightly larger than the amount necessary for loop formation between the wire 11 and the capillary 2, and the stress acting directly on the wire 11 connected to the first bonding point A is reduced. Reliability in wire bonding, especially securing of strength in tensile strength test, which is quality inspection in wire bonding process, and resin in encapsulation process Is intended prevent wire breakage failure of by higher working stresses.
[0023]
In order to perform wire connection as shown in FIG. 4, it demonstrates using FIG. FIG. 5 is an explanatory view showing the movement trajectory of the capillary according to the present invention.
[0024]
Therefore, the movement trajectory of the capillary shown in FIG. 5 will be described with reference to the flowchart shown in FIG. 6. First, the capillary 2 is vertically raised from the first bonding point A shown in FIG. 5 to the position B designated in the program. make (step S 1). Let L be the distance from this first bonding point A to point B. This distance L is previously stored in a control means (not shown). Further, the distance L is set to an arbitrary value and is obtained by the angle sensor 10 shown in FIG.
[0025]
Next, the XY table is moved to connect the first bonding point A and the second bonding point to move in the direction opposite to the second bonding point on the assumed straight line, and at the same time, the bonding arm 3 shown in FIG. It is rotated clockwise and lowered in the Z-axis direction (step S 2 ).
[0026]
It is determined whether the capillary 2 has gone from point B to point D (step S 3 ). At this time, the distance between the point B and the point C is stored in advance in a program (not shown), and the point E having the radius of the distance L is also stored. Therefore, it is programmed in advance in control means (not shown) so that the point D does not become higher than the point E.
[0027]
After reaching the point D, the capillary 2 is raised and the wire 11 is moved to the second bonding point according to a predetermined loop control for bonding (step S 4 ). The loop control from the point D to the second bonding point can be variously changed, but the optimum one is used.
[0028]
According to the above method, when the wire pulling strength was compared between the locus of the conventional capillary and the locus of the capillary according to the present invention, the wire pulling strength when using the locus of the conventional capillary was 10.3 gf. On the other hand, the tensile strength when using the present invention was 11.7 gf. Therefore, when the present invention was used, an improvement effect of about 14% on the average in tensile strength was confirmed compared with the case where the conventional capillary trajectory was used.
[0029]
In the wire bonding method according to the present invention, the position control of the point where the capillary 2 is raised to the height L shown in FIGS. 4 and 5 is controlled on the wire bonding apparatus side. It is lowered downward at the next moment when it is located at the highest point of the height L. This downward control may be performed with an arbitrary angle θ as shown in FIG. The amount of decrease of the angle θ and S are arbitrarily set according to the loop shape and the loop height. Therefore, in the present invention, since the position is controlled by the angle sensor 10 shown in FIG. 4 and the position of the point D is obtained based on the data shown in FIG. 3, the angle θ is obtained accordingly. Therefore, in the case of performing control based on the angle θ, it is sufficient to calculate the angle in advance and perform memory.
[0030]
In the wire bonding method as described above, the wire bonding apparatus shown in FIGS. 1 to 3 is used, but a similar loop formation may be performed using a wire bonding apparatus having another configuration.
[0031]
【The invention's effect】
As described above, according to the present invention, after the wire is connected to the first bonding point, the capillary is lifted slightly, and then moved in the opposite direction and downward to the second bonding point, thereby acting on the wire. It is possible to reduce cracks and wrinkles generated by the above, and to improve the reliability in wire bonding.
[Brief description of the drawings]
FIG. 1 is a front view showing a configuration of a wire bonding apparatus according to the present invention.
FIG. 2 is a side view including a partial cross-section of FIG. 1;
FIG. 3 is a diagram illustrating an example of the characteristics of the angle sensor illustrated in FIG. 2;
FIG. 4 is a diagram showing a movement trajectory of a capillary according to the present invention.
FIG. 5 is an explanatory diagram showing a movement locus of a capillary according to the present invention.
FIG. 6 is a flowchart illustrating a wire bonding method according to the present invention.
FIG. 7 is an explanatory diagram showing a wire shape according to a movement trajectory of a conventional capillary.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Bonding head 2 Capillary 3 Bonding arm 4 Head base 5 Axis 6 Linear motor 10 Angle sensor 11 Wire 11a Slack

Claims (1)

第１ボンディング点と第２ボンディング点との間をワイヤを用いて接続するワイヤボンディング方法において、第１ボンディング点Ａにワイヤを接続後、キャピラリを該第１ボンディング点Ａの鉛直線上に所定の距離Ｌまで上昇させた後、第２ボンディング点と逆の方向で前記距離Ｌより低くかつ第１ボンディング点Ａを円心とし、距離Ｌを半径とするＥ点より下方であって、前記第１ボンディング点よりも高い所定の位置Ｄまでキャピラリを下降させ、該位置よりキャピラリを上昇させてループ形成に必要な量より少し多い量のワイヤを繰り出しつつキャピラリを所定のループコントロールにしたがって第２ボンディング点上方へ移動させてワイヤを第２ボンディング点に接続するワイヤボンディング方法であって、
前記第１ボンディング点から前記位置Ｄまでの距離をＳとすると、該距離Ｓは前記距離Ｌ＞Ｓの関係となるように設定されていることを特徴とするワイヤボンディング方法。In a wire bonding method in which a wire is connected between a first bonding point and a second bonding point, after connecting the wire to the first bonding point A, the capillary is placed on a vertical line of the first bonding point A by a predetermined distance. After being raised to L, the first bonding point is lower than the distance L in a direction opposite to the second bonding point, below the E point having the first bonding point A as a center and the distance L as a radius. The capillary is lowered to a predetermined position D higher than the point, and the capillary is lifted from the position to feed out a slightly larger amount of wire than necessary for loop formation, and the capillary is moved above the second bonding point according to a predetermined loop control. A wire bonding method for connecting the wire to the second bonding point by moving to
A wire bonding method, wherein a distance from the first bonding point to the position D is S, and the distance S is set to satisfy the relationship of the distance L> S.
JP29202495A 1995-10-13 1995-10-13 Wire bonding method Expired - Lifetime JP3786991B2 (en)

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Application Number Priority Date Filing Date Title
JP29202495A JP3786991B2 (en) 1995-10-13 1995-10-13 Wire bonding method

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JPH09115940A JPH09115940A (en) 1997-05-02
JP3786991B2 true JP3786991B2 (en) 2006-06-21

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