JPH0522384B2 - - Google Patents

Info

Publication number
JPH0522384B2
JPH0522384B2 JP58111380A JP11138083A JPH0522384B2 JP H0522384 B2 JPH0522384 B2 JP H0522384B2 JP 58111380 A JP58111380 A JP 58111380A JP 11138083 A JP11138083 A JP 11138083A JP H0522384 B2 JPH0522384 B2 JP H0522384B2
Authority
JP
Japan
Prior art keywords
bonding tool
bonding
wire
ball
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58111380A
Other languages
Japanese (ja)
Other versions
JPS603133A (en
Inventor
Koichiro Atsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58111380A priority Critical patent/JPS603133A/en
Publication of JPS603133A publication Critical patent/JPS603133A/en
Publication of JPH0522384B2 publication Critical patent/JPH0522384B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 ［産業上の利用分野］ この発明は半導体装置の組立におけるワイヤボ
ンデイング方法およびその装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire bonding method and apparatus for assembling semiconductor devices.

［従来の技術］ 半導体装置の組立工程において、ペレツトとリ
ードフレームとをワイヤによつて接続する手段と
して第１図に示すようなワイヤボンデイング装置
が用いられている。[Prior Art] In the assembly process of semiconductor devices, a wire bonding apparatus as shown in FIG. 1 is used as a means for connecting pellets and lead frames with wires.

図中１は装置本体で、この本体１の上部にはワ
イヤ操出し装置２が設けられている。このワイヤ
操出し装置２から操出された金属ワイヤ（以下、
ワイヤという）３は本体１に設けられたワイヤガ
イド４を介して上クランプ５、下クランプ６およ
びボンデイングツール７に導入されるようになつ
ている。上記上クランプ５はアーム５ａの先端に
設けられているが、このアーム５ａの本体１に対
する取付構造は本体１に固定され、または破線に
示すように本体１に設けられた回動軸５ｂを中心
として回動し、上クランプ５が上下方向に揺動す
る方式のものとの２種類がある。そして、いずれ
の構造のものもソレノイドまたはリニアモータな
どの駆動源により開閉し、ワイヤ３をクランプし
たり解放したりするようになつている。また、下
クランプ６も図示しない駆動源に駆動されて開閉
し、ワイヤ３をクランプしたり解放するようにな
つている。そして、下クランプ６を支持する揺動
アーム６ａとボンデイングツール７を支持するボ
ンデイングアーム７ａとは基端部において板ばね
８により連結され、本体１に支持された回動軸９
を中心として図示しない駆動源により駆動されて
上下方向（第３図矢印ロ方向）に揺動するように
なつている。すなわち、下クランプ６およびボン
デイングツール７は一体となり上下方向に移動す
るようになつている。また、ボンデイングツール
７の最高位置にはボンデイングツール７の先端に
突出するワイヤ３の先端を加熱しボール１０を形
成するためのボール形成手段たとえばトーチ１１
が本体１に固定され、ボンデイングツール７と一
体的に上下動する構造とはなつていないが、第２
図および第３図に示すようにその放電腕１１ａは
矢印イに示すように回動自在で、ワイヤボンデイ
ングの最終工程においてボンデイングツール７が
最高位置まで上昇したときに上記放電腕１１ａが
ボンデイングツール７の先端部から突出するワイ
ヤ３に接近するようになつている。 In the figure, reference numeral 1 denotes a main body of the apparatus, and a wire feeding device 2 is provided on the upper part of the main body 1. The metal wire (hereinafter referred to as
A wire (referred to as a wire) 3 is introduced into an upper clamp 5, a lower clamp 6, and a bonding tool 7 via a wire guide 4 provided in the main body 1. The upper clamp 5 is provided at the tip of the arm 5a, and the mounting structure of the arm 5a to the main body 1 is fixed to the main body 1, or is centered around a rotation axis 5b provided on the main body 1 as shown by the broken line. There are two types: one in which the upper clamp 5 swings vertically, and the other in which the upper clamp 5 swings vertically. Both structures are opened and closed by a drive source such as a solenoid or a linear motor to clamp or release the wire 3. The lower clamp 6 is also driven by a drive source (not shown) to open and close, thereby clamping and releasing the wire 3. The swinging arm 6a that supports the lower clamp 6 and the bonding arm 7a that supports the bonding tool 7 are connected at their base ends by a leaf spring 8, and a rotating shaft 9 supported by the main body 1
It is driven by a drive source (not shown) to swing vertically (in the direction of the arrow B in FIG. 3) about the center. That is, the lower clamp 6 and the bonding tool 7 are configured to move in the vertical direction as a unit. Further, at the highest position of the bonding tool 7, a ball forming means, for example, a torch 11 is provided for heating the tip of the wire 3 protruding from the tip of the bonding tool 7 to form a ball 10.
is fixed to the main body 1 and does not move up and down integrally with the bonding tool 7, but the second
As shown in FIG. 3 and FIG. 3, the discharge arm 11a is rotatable as shown by arrow A, and when the bonding tool 7 rises to the highest position in the final process of wire bonding, the discharge arm 11a The wire 3 protrudes from the tip of the wire 3.

また、ボンデイングツール７の最低位置にはペ
レツド電極（以下、ペレツトという）１２および
リードフレーム１３が配置され、ボンデイングツ
ール７の上下動によりペレツト１２とリードフレ
ーム１３とをワイヤ３により接続するようになつ
ている。 Further, a pellet electrode (hereinafter referred to as pellet) 12 and a lead frame 13 are arranged at the lowest position of the bonding tool 7, and the pellet 12 and the lead frame 13 are connected by the wire 3 by vertical movement of the bonding tool 7. ing.

つぎに、ボンデイング動作を工程別に説明する
と、第４図ａはボンデイングツール７から突出す
るワイヤ３の先端に初期位置Ａにおいてトーチ１
１よりボール１０が形成された状態を示し、この
状態からボンデイングツール７はその軌跡Ｔに沿
つて下降する。ついでｃに示すようにボンデイン
グツール７の下降に伴いボンデイングツール７の
先端に密着したボール１０はペレツト１２のアル
ミ電極パツド１２ａに圧着されて、第１次ボンデ
イングが完了し、続いて第２次ボンデイングが行
なわれる。このためｄに示すようにボンデイング
ツール７を上昇させたのち、ｅに示すようにボン
デイングツール７をほぼその最高位置までを上昇
させるとともにボンデイングツール７をループＬ
を形成する方向に移動させることにより必要長の
ワイヤ３を操出してループＬの形状をコントロー
ルする。ついで、ｆに示すようにボンデイングツ
ール７はふたたび下降し、ワイヤ３をリードフレ
ーム１３に圧接し第２次ボンデイングも完了し、
ペレツト１２とリードフレーム１３との接続が完
了する。ついでｇに示すようにボンデイングツー
ル７は上昇し、再びボンデイングサイクルの初期
位置Ａに到達するとトーチ１１の放電腕１１ａが
回動してボンデイングツール７の先端部から突出
するワイヤ３の先端に接近する。 Next, to explain the bonding operation step by step, FIG.
1 shows a state in which a ball 10 is formed, and from this state the bonding tool 7 descends along its trajectory T. Next, as shown in c, as the bonding tool 7 descends, the ball 10 that is in close contact with the tip of the bonding tool 7 is pressed against the aluminum electrode pad 12a of the pellet 12, completing the first bonding, and then the second bonding is performed. will be carried out. For this reason, after raising the bonding tool 7 as shown in d, the bonding tool 7 is raised almost to its highest position as shown in e, and the bonding tool 7 is moved into the loop L.
By moving the wire 3 in the direction of forming the loop L, the wire 3 of the required length is steered and the shape of the loop L is controlled. Then, as shown in f, the bonding tool 7 descends again to press the wire 3 onto the lead frame 13, completing the second bonding.
The connection between pellet 12 and lead frame 13 is completed. Then, as shown in g, the bonding tool 7 rises, and when it reaches the initial position A of the bonding cycle again, the discharge arm 11a of the torch 11 rotates and approaches the tip of the wire 3 protruding from the tip of the bonding tool 7. .

［発明が解決しようとする課題］ しかしながら、初期位置Ａにおいてはボンデイ
ングツール７は時間ｔだけ静止し安定したボール
１０を形成し、ボンデイングの１サイクルを完了
し上記ａ〜Ａの工程を反覆することになるが、ボ
ンデイングツール７先端に形成されたボール１０
は上記のように軌跡Ｔに沿つて下降しペレツト１
２に圧着されるまでに冷却し硬化するためボール
１０とペレツト１２との接合性低下の原因とな
る。また、ボンデイングツール７がほぼ最高位置
に到達しないとトーチ１１は放電せず、しかも、
安定したボール１０を形成するためボンデイング
ツール７を静止させるのでボンデイングサイクル
が長くなる。さらに、冷却、硬化したボール１０
がペレツト１２に圧着されるとき衝撃によりペレ
ツト１２が損傷するなど多くの問題点があつた。[Problems to be Solved by the Invention] However, in the initial position A, the bonding tool 7 remains stationary for a time t to form a stable ball 10, complete one cycle of bonding, and repeat the steps a to A above. However, the ball 10 formed at the tip of the bonding tool 7
descends along the trajectory T as described above and pellet 1
The balls 10 and pellets 12 are cooled and hardened before being crimped onto the balls 10 and 12, which causes a decrease in bonding properties between the balls 10 and the pellets 12. Further, the torch 11 does not discharge unless the bonding tool 7 reaches almost the highest position.
Since the bonding tool 7 is kept stationary in order to form a stable ball 10, the bonding cycle becomes longer. Furthermore, the cooled and hardened ball 10
There were many problems such as damage to the pellet 12 due to impact when the pellet was pressed onto the pellet 12.

この発明はボール形成手段をボンデイングツー
ルと同期させて上下動させることにより半導体装
置の信頼性生産性を向上させるワイヤボンデイン
グ方法およびその装置を提供することを目的とす
る。 SUMMARY OF THE INVENTION An object of the present invention is to provide a wire bonding method and apparatus for improving the reliability and productivity of semiconductor devices by moving a ball forming means up and down in synchronization with a bonding tool.

［課題を解決するための手段および作用］ この発明は前記課題を解決するために、第１の
発明は、ペレツト電極とリードフレームとをボン
デイングツールに挿通された金属ワイヤで接続す
るワイヤボンデイング方法において、上記ボンデ
イングツールが上記ペレツト電極に向けて下降を
開始してからペレツト電極に接触するまでの期間
中に上記ボンデイングツールに挿通された上記金
属ワイヤの先端にボールを形成する工程を有する
ことを特徴とする。[Means and effects for solving the problems] In order to solve the above problems, the first invention provides a wire bonding method for connecting a pellet electrode and a lead frame with a metal wire inserted through a bonding tool. , comprising the step of forming a ball at the tip of the metal wire inserted through the bonding tool during a period from when the bonding tool starts descending toward the pellet electrode until it comes into contact with the pellet electrode. shall be.

また、第２の発明は、ペレツト電極とリードフ
レームとをボンデイングツールに挿通された金属
ワイヤで接続するワイヤボンデイング装置におい
て、上記ボンデイングツールが上記ペレツト電極
に向けて下降を開始してからペレツト電極に接触
するまでの期間中に上記ボンデイングツールに挿
通された上記金属ワイヤの先端にボールを形成す
るボール形成手段を有することを特徴とする。 Further, a second invention is a wire bonding apparatus that connects a pellet electrode and a lead frame with a metal wire inserted through a bonding tool, in which the bonding tool starts descending toward the pellet electrode and then connects the pellet electrode with the lead frame. The bonding tool is characterized by comprising a ball forming means for forming a ball at the tip of the metal wire inserted through the bonding tool during a period until contact occurs.

そして、ボールが冷却硬化しないうちにボール
がペレツトに接触するようにしたことにある。 Another advantage is that the balls are brought into contact with the pellets before they are cooled and hardened.

［実施例］ 以下、この発明の一実施例を第１図〜第４図の
同一構成部分に同一符号を付けた第５図および第
６図を参照にして説明する。第５図中１４はボー
ル形成手段としてのトーチ１１がその先端部下方
に固定されたアームでこのアーム１４は板ばね１
５でボンデイングアーム７ａの基端部７ｂに連結
され、回動軸９を中心としてボンデイングアーム
７ａと一体的に上下方向（第５図矢印ハ方向）に
揺動するようになつている。トーチ１１の下向き
の移動は本体１に設けられたストツパ１６に規制
され、トーチ１１の先端部がボンデイング時にペ
レツト１２またはリードフレーム１３と接触い損
傷を与えないようになつている。[Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 5 and 6, in which the same components in FIGS. 1 to 4 are denoted by the same reference numerals. In FIG. 5, reference numeral 14 denotes an arm with a torch 11 as a ball forming means fixed below its tip, and this arm 14 is a plate spring 1.
5 is connected to the base end 7b of the bonding arm 7a, and is configured to swing integrally with the bonding arm 7a in the vertical direction (in the direction of the arrow C in FIG. 5) about the pivot shaft 9. The downward movement of the torch 11 is restricted by a stopper 16 provided on the main body 1 to prevent the tip of the torch 11 from coming into contact with pellets 12 or lead frame 13 during bonding and causing damage.

上記のように構成されたワイヤボンデイング装
置によりワイヤボンデイングを行なう方法を説明
する。第６図ａはボンデイングツール７とトーチ
１１とが最高位置にある状態を示す。ｂに示すよ
うにボンデイングツール７とトーチ１１とが一体
となつて下降し、ボンデイングツール７がペレツ
ト７に接触する直前にｃに示すようにトーチ１１
か作動し、ボール１０が形成される。ついで、ｄ
に示すようにボンデイングツール７の先端に形成
されたボール１０はさらに下降するボンデイング
ツール７によりペレツト１２に圧着される。この
ようにｃとｄとの時間は極めて短いのでボール１
０は冷却することが防止されるので確実にボンデ
イングされ、ペレツト１２に与える衝撃も従来に
比し減少する。また、ストツパ１６によりトーチ
１１はその下向きの移動を規制されるのでペレツ
ト１２の表面に接触しない。 A method of wire bonding using the wire bonding apparatus configured as described above will be described. FIG. 6a shows a state in which the bonding tool 7 and the torch 11 are in the highest position. As shown in b, the bonding tool 7 and the torch 11 are lowered together, and just before the bonding tool 7 contacts the pellet 7, the torch 11 is lowered as shown in c.
The ball 10 is formed. Then, d
As shown in FIG. 2, the ball 10 formed at the tip of the bonding tool 7 is pressed onto the pellet 12 by the bonding tool 7 which is further lowered. In this way, the time between c and d is extremely short, so ball 1
Since the pellets 0 are prevented from being cooled, bonding is ensured, and the impact given to the pellets 12 is also reduced compared to the conventional method. Further, since the torch 11 is prevented from moving downward by the stopper 16, it does not come into contact with the surface of the pellet 12.

上記のように、第１次ボンデイングサイクルが
終了すると、ボンデイングツール７はふたたび上
昇、下降を繰返えしてループＬを形成したのち、
ｅに示すようにリードフレーム１３にワイヤ３を
圧接する。この際もトーチ１１はストツパ１６に
その移動を抑止されるのでリードフレーム１３に
接触することはない。以上でボンデイングは完了
しボンデイングツール７とトーチ１１とは上昇し
１サイクルを完了する。 As mentioned above, when the first bonding cycle ends, the bonding tool 7 repeats rising and falling again to form the loop L, and then
The wire 3 is pressed against the lead frame 13 as shown in e. At this time as well, the torch 11 is prevented from moving by the stopper 16, so it does not come into contact with the lead frame 13. With this, bonding is completed, and the bonding tool 7 and torch 11 are raised to complete one cycle.

なお、一実施例においてはトーチ１１を支持す
るアーム１４板ばね１５によりボンデイングアー
ム７ａに取付け一体的に上下動させたがこれに限
定するものではなく、ボンデイングツール７とト
ーチ１１とを相対的に静止状態に保持して上下動
するものであればよい。また、ボール１０を形成
するボール形成手段はトーチ１１に限定するもの
ではなく、さらに、その形成、ワイヤ３に対して
接近させる方式も限定するものではない。 In one embodiment, the arm 14 that supports the torch 11 is attached to the bonding arm 7a by the leaf spring 15 and moved up and down integrally, but the present invention is not limited to this. Any device that can be held stationary and moved up and down is sufficient. Further, the ball forming means for forming the ball 10 is not limited to the torch 11, and furthermore, the method of forming the ball and bringing it close to the wire 3 is not limited either.

［発明の効果］ 以上、説明したようにこの発明においてはボン
デイングツールの先端部から突出するワイヤの先
端にボールを形成するボール形成手段がボンデイ
ングツールと一体になつて上下動し、ボンデイン
グツールがペレツトに接触するまでの間に上記ボ
ール形成手段によりボールを形成させるので、ボ
ール形成のためボンデイングツールを静止させる
必要がなくボンデイングサイクルを短縮できる。
また従来のようにボール形成用加熱装置をボンデ
イングツールの最高位置に設ける必要もなくペレ
ツトに圧着前に形成され、冷却硬化しないボール
が圧着されるのでペレツトとの接合性が向上する
だけでなく、ペレツトに損傷を与えるという危険
もなく半導体装置の生産性、信頼性を向上すると
いう効果がある。[Effects of the Invention] As explained above, in the present invention, the ball forming means for forming a ball at the tip of the wire protruding from the tip of the bonding tool moves up and down integrally with the bonding tool, and the bonding tool forms a pellet. Since the ball is formed by the ball forming means before it comes into contact with the bonding tool, it is not necessary to keep the bonding tool stationary for forming the ball, and the bonding cycle can be shortened.
In addition, there is no need to install a ball-forming heating device at the highest position of the bonding tool as in the past, and the ball is formed before being crimped onto the pellet, and the ball is not hardened by cooling. This not only improves the bondability with the pellet, but also This has the effect of improving the productivity and reliability of semiconductor devices without the risk of damaging the pellets.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のワイヤボンデイング装置を示す
側面図、第２図は同じくこのボール形成手段とボ
ンデイングツールとの関係位置を示す正面図、第
３図は第２図に対す側面図、第４図は同じくこの
動作説明図、第５図はこの発明の一実施例の要部
のみを示す側面図、第６図は同じくこの動作説明
図である。 ３……ワイヤ、７……ボンデイングツール、１
０……ボール、１１……トーチ（ボール形成手
段）、１２……ペレツト。 Fig. 1 is a side view showing a conventional wire bonding device, Fig. 2 is a front view showing the relative position of the ball forming means and the bonding tool, Fig. 3 is a side view of Fig. 2, and Fig. 4 5 is a side view showing only the essential parts of an embodiment of the present invention, and FIG. 6 is a diagram illustrating this operation. 3... Wire, 7... Bonding tool, 1
0...ball, 11...torch (ball forming means), 12...pellet.

Claims (1)

【特許請求の範囲】 １ ペレツト電極とリードフレームとをボンデイ
ングツールに挿通された金属ワイヤで接続するワ
イヤボンデイング方法において、上記ボンデイン
グツールが上記ペレツト電極に向けて下降を開始
してからペレツト電極に接触するまでの期間中に
上記ボンデイングツールに挿通された上記金属ワ
イヤの先端にボールを形成する工程を有すること
を特徴とするワイヤボンデイング方法。 ２ ペレツト電極とリードフレームとをボンデイ
ングツールに挿通された金属ワイヤで接続するワ
イヤボンデイング方法において、上記ボンデイン
グツールが上記ペレツト電極に向けて下降を開始
してからペレツト電極に接触するまでの期間中に
上記ボンデイングツールに挿通された上記金属ワ
イヤの先端にボールを形成するボール形成手段を
有することを特徴とするワイヤボンデイング装
置。[Claims] 1. In a wire bonding method in which a pellet electrode and a lead frame are connected by a metal wire inserted through a bonding tool, the bonding tool contacts the pellet electrode after it starts descending toward the pellet electrode. A wire bonding method comprising the step of forming a ball at the tip of the metal wire inserted through the bonding tool during the period until the metal wire is inserted into the bonding tool. 2. In a wire bonding method in which a pellet electrode and a lead frame are connected by a metal wire inserted through a bonding tool, during the period from when the bonding tool starts descending toward the pellet electrode until it comes into contact with the pellet electrode. A wire bonding apparatus comprising a ball forming means for forming a ball at the tip of the metal wire inserted through the bonding tool.
JP58111380A 1983-06-21 1983-06-21 Wire bonding method Granted JPS603133A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58111380A JPS603133A (en) 1983-06-21 1983-06-21 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58111380A JPS603133A (en) 1983-06-21 1983-06-21 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS603133A JPS603133A (en) 1985-01-09
JPH0522384B2 true JPH0522384B2 (en) 1993-03-29

Family

ID=14559709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58111380A Granted JPS603133A (en) 1983-06-21 1983-06-21 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS603133A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6255345U (en) * 1985-09-26 1987-04-06
JPS62126643A (en) * 1985-11-28 1987-06-08 Toshiba Corp Wire bonding method
JP4534335B2 (en) * 2000-10-12 2010-09-01 日本電気株式会社 Wire bonder and method of discharging wire bonder
JP4138827B2 (en) * 2006-08-07 2008-08-27 株式会社東芝 Ultrasonic diagnostic equipment

Also Published As

Publication number Publication date
JPS603133A (en) 1985-01-09

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