JPS5897851A - 金属部品の製造方法 - Google Patents
金属部品の製造方法Info
- Publication number
- JPS5897851A JPS5897851A JP19653381A JP19653381A JPS5897851A JP S5897851 A JPS5897851 A JP S5897851A JP 19653381 A JP19653381 A JP 19653381A JP 19653381 A JP19653381 A JP 19653381A JP S5897851 A JPS5897851 A JP S5897851A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- heat sink
- plating
- stem
- copper member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052802 copper Inorganic materials 0.000 claims abstract description 33
- 239000010949 copper Substances 0.000 claims abstract description 33
- 238000007747 plating Methods 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000000758 substrate Substances 0.000 abstract description 11
- 238000004080 punching Methods 0.000 abstract description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 230000007935 neutral effect Effects 0.000 abstract description 6
- 238000005498 polishing Methods 0.000 abstract description 2
- 239000011521 glass Substances 0.000 description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 238000007789 sealing Methods 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19653381A JPS5897851A (ja) | 1981-12-07 | 1981-12-07 | 金属部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19653381A JPS5897851A (ja) | 1981-12-07 | 1981-12-07 | 金属部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5897851A true JPS5897851A (ja) | 1983-06-10 |
| JPS634711B2 JPS634711B2 (enrdf_load_stackoverflow) | 1988-01-30 |
Family
ID=16359316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19653381A Granted JPS5897851A (ja) | 1981-12-07 | 1981-12-07 | 金属部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5897851A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS623939A (ja) * | 1985-06-28 | 1987-01-09 | 三菱電線工業株式会社 | 複合金属板 |
-
1981
- 1981-12-07 JP JP19653381A patent/JPS5897851A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS623939A (ja) * | 1985-06-28 | 1987-01-09 | 三菱電線工業株式会社 | 複合金属板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS634711B2 (enrdf_load_stackoverflow) | 1988-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2418265A (en) | Process for providing aluminum and aluminum alloys with metal coatings | |
| US3386906A (en) | Transistor base and method of making the same | |
| JPH06187866A (ja) | 電気接点構造 | |
| JPS5897851A (ja) | 金属部品の製造方法 | |
| JPS58100967A (ja) | 金属部品の製造方法 | |
| US4695818A (en) | Electrical resistor with a negative temperature coefficient for incremental resistance values and method for manufacturing same | |
| JPS59217655A (ja) | 時計ケ−ス | |
| JPS6041865B2 (ja) | 銀ロウ付け構体の製造方法 | |
| GB1471438A (en) | Metal-ceramic solder joints | |
| JPS63240051A (ja) | セラミツクキヤツプ | |
| JPS6010674A (ja) | 半導体素子の製造方法 | |
| JPS60124382A (ja) | スパ−クプラグ | |
| JPS6410912B2 (enrdf_load_stackoverflow) | ||
| JPS6041860B2 (ja) | 気密端子の製造方法 | |
| JPS6011645Y2 (ja) | 冷間圧接用気密封入容器 | |
| KR830000962B1 (ko) | 기밀단자(氣密端子) | |
| JPS5810827B2 (ja) | 気密端子の製造方法 | |
| JPS5842764A (ja) | メツキ方法 | |
| US7732300B2 (en) | Method of bonding aluminum electrodes of two semiconductor substrates | |
| JPS60236251A (ja) | 半導体装置用パツケ−ジ | |
| JPS6140045A (ja) | 冷間圧接型ステムの製造方法 | |
| JPH0373084B2 (enrdf_load_stackoverflow) | ||
| JPS5856428A (ja) | 半導体装置 | |
| JPS6134959A (ja) | 半導体装置用ステムの製造方法 | |
| JPS5945225B2 (ja) | 素子取付体の製造方法 |