JPS5892248A - 大規模実装化半導体装置 - Google Patents

大規模実装化半導体装置

Info

Publication number
JPS5892248A
JPS5892248A JP56193519A JP19351981A JPS5892248A JP S5892248 A JPS5892248 A JP S5892248A JP 56193519 A JP56193519 A JP 56193519A JP 19351981 A JP19351981 A JP 19351981A JP S5892248 A JPS5892248 A JP S5892248A
Authority
JP
Japan
Prior art keywords
substrate
package
pad
semiconductor device
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56193519A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6139740B2 (cg-RX-API-DMAC10.html
Inventor
Takashi Kondo
隆 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56193519A priority Critical patent/JPS5892248A/ja
Publication of JPS5892248A publication Critical patent/JPS5892248A/ja
Publication of JPS6139740B2 publication Critical patent/JPS6139740B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W90/401—
    • H10W72/5453—
    • H10W72/879—
    • H10W90/753—

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP56193519A 1981-11-28 1981-11-28 大規模実装化半導体装置 Granted JPS5892248A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56193519A JPS5892248A (ja) 1981-11-28 1981-11-28 大規模実装化半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56193519A JPS5892248A (ja) 1981-11-28 1981-11-28 大規模実装化半導体装置

Publications (2)

Publication Number Publication Date
JPS5892248A true JPS5892248A (ja) 1983-06-01
JPS6139740B2 JPS6139740B2 (cg-RX-API-DMAC10.html) 1986-09-05

Family

ID=16309412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56193519A Granted JPS5892248A (ja) 1981-11-28 1981-11-28 大規模実装化半導体装置

Country Status (1)

Country Link
JP (1) JPS5892248A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62216250A (ja) * 1985-11-06 1987-09-22 Shinko Electric Ind Co Ltd プリント基板型ｐｇａパツケ−ジの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62216250A (ja) * 1985-11-06 1987-09-22 Shinko Electric Ind Co Ltd プリント基板型ｐｇａパツケ−ジの製造方法

Also Published As

Publication number Publication date
JPS6139740B2 (cg-RX-API-DMAC10.html) 1986-09-05

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