JPS5885555A - セラミツクヒ−トシンク - Google Patents

セラミツクヒ−トシンク

Info

Publication number
JPS5885555A
JPS5885555A JP18416581A JP18416581A JPS5885555A JP S5885555 A JPS5885555 A JP S5885555A JP 18416581 A JP18416581 A JP 18416581A JP 18416581 A JP18416581 A JP 18416581A JP S5885555 A JPS5885555 A JP S5885555A
Authority
JP
Japan
Prior art keywords
wick
case
plate
transistor
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18416581A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6219075B2 (US20050192411A1-20050901-C00001.png
Inventor
Migiwa Ando
安藤　汀
Yukiaki Ito
伊藤　幸昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Tokushu Togyo KK
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Nippon Tokushu Togyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd, Nippon Tokushu Togyo KK filed Critical NGK Spark Plug Co Ltd
Priority to JP18416581A priority Critical patent/JPS5885555A/ja
Publication of JPS5885555A publication Critical patent/JPS5885555A/ja
Publication of JPS6219075B2 publication Critical patent/JPS6219075B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP18416581A 1981-11-17 1981-11-17 セラミツクヒ−トシンク Granted JPS5885555A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18416581A JPS5885555A (ja) 1981-11-17 1981-11-17 セラミツクヒ−トシンク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18416581A JPS5885555A (ja) 1981-11-17 1981-11-17 セラミツクヒ−トシンク

Publications (2)

Publication Number Publication Date
JPS5885555A true JPS5885555A (ja) 1983-05-21
JPS6219075B2 JPS6219075B2 (US20050192411A1-20050901-C00001.png) 1987-04-25

Family

ID=16148495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18416581A Granted JPS5885555A (ja) 1981-11-17 1981-11-17 セラミツクヒ−トシンク

Country Status (1)

Country Link
JP (1) JPS5885555A (US20050192411A1-20050901-C00001.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10182235A (ja) * 1996-12-19 1998-07-07 Tokuyama Corp 窒化アルミニウム部材
WO2022181566A1 (ja) * 2021-02-26 2022-09-01 京セラ株式会社 熱デバイス
WO2023234042A1 (ja) * 2022-05-31 2023-12-07 京セラ株式会社 熱デバイス
WO2024019108A1 (ja) * 2022-07-22 2024-01-25 京セラ株式会社 放熱基板及びベイパーチャンバー

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737284Y2 (ja) * 1989-12-11 1995-08-23 京セラ株式会社 ボビンレスコイル

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5442973U (US20050192411A1-20050901-C00001.png) * 1977-08-26 1979-03-23

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HU167833B (US20050192411A1-20050901-C00001.png) * 1973-07-09 1975-12-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5442973U (US20050192411A1-20050901-C00001.png) * 1977-08-26 1979-03-23

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10182235A (ja) * 1996-12-19 1998-07-07 Tokuyama Corp 窒化アルミニウム部材
WO2022181566A1 (ja) * 2021-02-26 2022-09-01 京セラ株式会社 熱デバイス
WO2023234042A1 (ja) * 2022-05-31 2023-12-07 京セラ株式会社 熱デバイス
WO2024019108A1 (ja) * 2022-07-22 2024-01-25 京セラ株式会社 放熱基板及びベイパーチャンバー

Also Published As

Publication number Publication date
JPS6219075B2 (US20050192411A1-20050901-C00001.png) 1987-04-25

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