JPS58827B2 - ハンダ付端子 - Google Patents
ハンダ付端子Info
- Publication number
- JPS58827B2 JPS58827B2 JP53111820A JP11182078A JPS58827B2 JP S58827 B2 JPS58827 B2 JP S58827B2 JP 53111820 A JP53111820 A JP 53111820A JP 11182078 A JP11182078 A JP 11182078A JP S58827 B2 JPS58827 B2 JP S58827B2
- Authority
- JP
- Japan
- Prior art keywords
- fingers
- solder
- additional
- finger
- clip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 34
- 239000000463 material Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Resistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/935,151 US4203648A (en) | 1977-08-15 | 1978-08-23 | Solder bearing terminal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5537784A JPS5537784A (en) | 1980-03-15 |
JPS58827B2 true JPS58827B2 (ja) | 1983-01-08 |
Family
ID=25466629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53111820A Expired JPS58827B2 (ja) | 1978-08-23 | 1978-09-13 | ハンダ付端子 |
Country Status (6)
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0244654B2 (US20020095090A1-20020718-M00002.png) * | 1985-07-19 | 1990-10-04 | Tokyo Shibaura Electric Co |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3345993A1 (de) * | 1983-12-20 | 1985-06-27 | Siemens AG, 1000 Berlin und 8000 München | Schichtschaltung mit anschlussklemmen |
JPH0732342B2 (ja) * | 1984-12-21 | 1995-04-10 | ヤマハ株式会社 | アナログ遅延回路 |
FR2625040B1 (fr) * | 1987-12-22 | 1991-01-04 | Cit Alcatel | Plot de report de connexion pour la fixation d'une broche a griffes sur la tranche d'un substrat de circuit hybride |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3351704A (en) * | 1965-03-18 | 1967-11-07 | Berg Electronics Inc | Soldering aid terminal |
US3689684A (en) * | 1971-02-05 | 1972-09-05 | Du Pont | Lead frame connector and electronic packages containing same |
US3750252A (en) * | 1972-05-01 | 1973-08-07 | Du Pont | Solder terminal strip |
US4019803A (en) * | 1975-10-15 | 1977-04-26 | E. I. Du Pont De Nemours And Company | Solder substrate clip |
-
1978
- 1978-09-08 GB GB7836130A patent/GB2029652B/en not_active Expired
- 1978-09-13 JP JP53111820A patent/JPS58827B2/ja not_active Expired
- 1978-09-14 FR FR7826468A patent/FR2433999A1/fr active Granted
- 1978-09-25 DE DE2841665A patent/DE2841665C2/de not_active Expired
- 1978-09-29 IT IT51310/78A patent/IT1192659B/it active
- 1978-12-11 NL NLAANVRAGE7812031,A patent/NL185593C/xx not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0244654B2 (US20020095090A1-20020718-M00002.png) * | 1985-07-19 | 1990-10-04 | Tokyo Shibaura Electric Co |
Also Published As
Publication number | Publication date |
---|---|
NL185593C (nl) | 1990-05-16 |
NL7812031A (nl) | 1980-02-26 |
NL185593B (nl) | 1989-12-18 |
JPS5537784A (en) | 1980-03-15 |
FR2433999A1 (fr) | 1980-03-21 |
FR2433999B1 (US20020095090A1-20020718-M00002.png) | 1983-11-10 |
DE2841665A1 (de) | 1980-03-06 |
IT7851310A0 (it) | 1978-09-29 |
IT1192659B (it) | 1988-05-04 |
DE2841665C2 (de) | 1987-04-23 |
GB2029652B (en) | 1983-01-12 |
GB2029652A (en) | 1980-03-19 |
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