JPS5881998A - 陽極反応処理装置 - Google Patents

陽極反応処理装置

Info

Publication number
JPS5881998A
JPS5881998A JP17971081A JP17971081A JPS5881998A JP S5881998 A JPS5881998 A JP S5881998A JP 17971081 A JP17971081 A JP 17971081A JP 17971081 A JP17971081 A JP 17971081A JP S5881998 A JPS5881998 A JP S5881998A
Authority
JP
Japan
Prior art keywords
electrolyte
substrate
reaction treatment
treatment apparatus
porous silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17971081A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6127475B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Hideyuki Unno
秀之 海野
Kazuo Imai
和雄 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP17971081A priority Critical patent/JPS5881998A/ja
Publication of JPS5881998A publication Critical patent/JPS5881998A/ja
Publication of JPS6127475B2 publication Critical patent/JPS6127475B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electrochemical Coating By Surface Reaction (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP17971081A 1981-11-11 1981-11-11 陽極反応処理装置 Granted JPS5881998A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17971081A JPS5881998A (ja) 1981-11-11 1981-11-11 陽極反応処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17971081A JPS5881998A (ja) 1981-11-11 1981-11-11 陽極反応処理装置

Publications (2)

Publication Number Publication Date
JPS5881998A true JPS5881998A (ja) 1983-05-17
JPS6127475B2 JPS6127475B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-06-25

Family

ID=16070514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17971081A Granted JPS5881998A (ja) 1981-11-11 1981-11-11 陽極反応処理装置

Country Status (1)

Country Link
JP (1) JPS5881998A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPS6127475B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-06-25

Similar Documents

Publication Publication Date Title
US6365017B1 (en) Substrate plating device
JP7161445B2 (ja) 化学および電解の少なくとも一方の表面処理のための分布システム
KR20200059309A (ko) 혼합된 피처 전기도금을 위한 대류 최적화
KR100723845B1 (ko) 전기 절연 포일 재료의 표면상에 상호 절연된 도전성 구조체들을 전해 처리하는 방법 및 장치
JP3568455B2 (ja) 基板メッキ装置
US11566337B2 (en) Substrate locking system, device and procedure for chemical and/or electrolytic surface treatment
US11105014B2 (en) Distribution system for chemical and/or electrolytic surface treatment
JP7551801B2 (ja) 化学および電解の少なくとも一方の表面処理のためのシステム
JPH04186624A (ja) 洗浄装置
US6939455B1 (en) Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
JPH04143299A (ja) 電解メッキ方法
US6793794B2 (en) Substrate plating apparatus and method
JPS5881998A (ja) 陽極反応処理装置
KR100990029B1 (ko) 기판도금장치
GB2570268A (en) System for chemical and/or electrolytic surface treatment
TW200408731A (en) Chemical processor, chemical processing method, and method for manufacturing semiconductor device
WO2022271568A1 (en) Micro inert anode array for die level electrodeposition thickness distribution control
KR100454505B1 (ko) 경사형 전극링을 갖는 전기 도금 장치
JPH09120952A (ja) ウエハの表面処理方法
JP3229259B2 (ja) 小物部品メッキ装置及び方法
EP3754052A1 (en) Roughening of a metallization layer on a semiconductor wafer
KR20070053528A (ko) 반도체 소자 제조용 설비
HK40003716A (en) Distribution system for chemical and/or electrolytic surface treatment
JP2005126754A (ja) 電気メッキ装置
JP2006066728A (ja) 基板処理装置及びその方法