JPS5881979U

JPS5881979U - Electronic component mounting equipment

Info

Publication number: JPS5881979U
Application number: JP17743681U
Authority: JP
Inventors: 久田　昭
Original assignee: 日本電気ホームエレクトロニクス株式会社
Priority date: 1981-11-28
Filing date: 1981-11-28
Publication date: 1983-06-03

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図はこの考案に係る放熱板本体の一部を切欠いて示
す要部正面図、第２図は同放熱板本体のプリンタ基板へ
の取付状態を示す正面断面図、第３図は同半田デイツプ
処理を施した状態を示す側断面図、第４図は同斜視図、
第５図ａは、この考案の他の実施例を示す正面断面図、
第５図すはこの考案の不適例を示す正面図である。５・・・プリント基板、２．１０・・・リード端子、１
・＝・放熱板本体（電子部品）、４・・・円孔（透孔）
、１１・・・凹部（切欠き）、６・・・半田層、６ａ・
・・架橋部。Figure 1 is a front view of the main parts of the heat sink body according to this invention with a part cut away, Figure 2 is a front sectional view showing how the heat sink body is attached to the printer board, and Figure 3 is the same solder. A side sectional view showing the state after the dip treatment, FIG. 4 is a perspective view of the same,
FIG. 5a is a front sectional view showing another embodiment of this invention;
FIG. 5 is a front view showing an unsuitable example of this invention. 5... Printed circuit board, 2.10... Lead terminal, 1
・=・Heat sink body (electronic parts), 4...Circular hole (through hole)
, 11... recess (notch), 6... solder layer, 6a.
...Bridge portion.

Claims

[Scope of utility model registration request]

In an electronic component that is mounted on a printed circuit board by fitting a lead terminal onto the printed circuit board and soldering the protruding end of the back surface of the lead terminal, a through hole or notch is created at the position where the lead terminal protrudes from the back surface. μ. An electronic component mounting device characterized in that during solder dipping, the solder layer is welded through the through hole or notch to form a bridge.