JPS5880897A - 金属芯プリント配線板の製造方法 - Google Patents
金属芯プリント配線板の製造方法Info
- Publication number
- JPS5880897A JPS5880897A JP17992881A JP17992881A JPS5880897A JP S5880897 A JPS5880897 A JP S5880897A JP 17992881 A JP17992881 A JP 17992881A JP 17992881 A JP17992881 A JP 17992881A JP S5880897 A JPS5880897 A JP S5880897A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- metal plate
- metal
- printed wiring
- band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 62
- 239000002184 metal Substances 0.000 title claims description 62
- 238000000034 method Methods 0.000 title claims description 10
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 12
- 238000005553 drilling Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 description 11
- 238000004080 punching Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17992881A JPS5880897A (ja) | 1981-11-09 | 1981-11-09 | 金属芯プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17992881A JPS5880897A (ja) | 1981-11-09 | 1981-11-09 | 金属芯プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5880897A true JPS5880897A (ja) | 1983-05-16 |
| JPH0217955B2 JPH0217955B2 (enExample) | 1990-04-24 |
Family
ID=16074372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17992881A Granted JPS5880897A (ja) | 1981-11-09 | 1981-11-09 | 金属芯プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5880897A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60144991A (ja) * | 1984-01-05 | 1985-07-31 | 松下電工株式会社 | 金属ベ−ス回路板 |
| JPS62102587A (ja) * | 1985-10-30 | 1987-05-13 | 株式会社東芝 | 配線基板 |
| JPS6465895A (en) * | 1987-09-07 | 1989-03-13 | Hitachi Cable | Mesh-shaped metal core substrate |
| JPS6447053U (enExample) * | 1987-09-14 | 1989-03-23 | ||
| JPH01319995A (ja) * | 1988-06-21 | 1989-12-26 | Ibiden Co Ltd | 電子部品搭載用基板及びその製造方法 |
| JPH02310997A (ja) * | 1989-05-25 | 1990-12-26 | Matsushita Electric Works Ltd | 電気積層板とその製造方法 |
| JP2013122961A (ja) * | 2011-12-09 | 2013-06-20 | Ngk Spark Plug Co Ltd | 配線基板、配線基板の製造方法 |
-
1981
- 1981-11-09 JP JP17992881A patent/JPS5880897A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60144991A (ja) * | 1984-01-05 | 1985-07-31 | 松下電工株式会社 | 金属ベ−ス回路板 |
| JPS62102587A (ja) * | 1985-10-30 | 1987-05-13 | 株式会社東芝 | 配線基板 |
| JPS6465895A (en) * | 1987-09-07 | 1989-03-13 | Hitachi Cable | Mesh-shaped metal core substrate |
| JPS6447053U (enExample) * | 1987-09-14 | 1989-03-23 | ||
| JPH01319995A (ja) * | 1988-06-21 | 1989-12-26 | Ibiden Co Ltd | 電子部品搭載用基板及びその製造方法 |
| JPH02310997A (ja) * | 1989-05-25 | 1990-12-26 | Matsushita Electric Works Ltd | 電気積層板とその製造方法 |
| JP2013122961A (ja) * | 2011-12-09 | 2013-06-20 | Ngk Spark Plug Co Ltd | 配線基板、配線基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0217955B2 (enExample) | 1990-04-24 |
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