JPS5878635U - 半導体ダイボンデイング装置 - Google Patents

半導体ダイボンデイング装置

Info

Publication number
JPS5878635U
JPS5878635U JP17335081U JP17335081U JPS5878635U JP S5878635 U JPS5878635 U JP S5878635U JP 17335081 U JP17335081 U JP 17335081U JP 17335081 U JP17335081 U JP 17335081U JP S5878635 U JPS5878635 U JP S5878635U
Authority
JP
Japan
Prior art keywords
hole
semiconductor die
die bonding
bonding equipment
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17335081U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6344990Y2 (enExample
Inventor
裕 丸山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP17335081U priority Critical patent/JPS5878635U/ja
Publication of JPS5878635U publication Critical patent/JPS5878635U/ja
Application granted granted Critical
Publication of JPS6344990Y2 publication Critical patent/JPS6344990Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP17335081U 1981-11-24 1981-11-24 半導体ダイボンデイング装置 Granted JPS5878635U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17335081U JPS5878635U (ja) 1981-11-24 1981-11-24 半導体ダイボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17335081U JPS5878635U (ja) 1981-11-24 1981-11-24 半導体ダイボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5878635U true JPS5878635U (ja) 1983-05-27
JPS6344990Y2 JPS6344990Y2 (enExample) 1988-11-22

Family

ID=29965214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17335081U Granted JPS5878635U (ja) 1981-11-24 1981-11-24 半導体ダイボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5878635U (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01109729A (ja) * 1987-10-22 1989-04-26 Fujitsu Ltd 全面切断チップ剥離装置
US9439557B2 (en) 2005-08-30 2016-09-13 Boston Scientific Scimed, Inc. Articulation joint

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01109729A (ja) * 1987-10-22 1989-04-26 Fujitsu Ltd 全面切断チップ剥離装置
US9439557B2 (en) 2005-08-30 2016-09-13 Boston Scientific Scimed, Inc. Articulation joint

Also Published As

Publication number Publication date
JPS6344990Y2 (enExample) 1988-11-22

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