JPS587645Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS587645Y2
JPS587645Y2 JP1976034878U JP3487876U JPS587645Y2 JP S587645 Y2 JPS587645 Y2 JP S587645Y2 JP 1976034878 U JP1976034878 U JP 1976034878U JP 3487876 U JP3487876 U JP 3487876U JP S587645 Y2 JPS587645 Y2 JP S587645Y2
Authority
JP
Japan
Prior art keywords
ceramic plate
semiconductor device
solder
metallized layer
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976034878U
Other languages
English (en)
Japanese (ja)
Other versions
JPS52126758U (enExample
Inventor
省治 熊野
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1976034878U priority Critical patent/JPS587645Y2/ja
Publication of JPS52126758U publication Critical patent/JPS52126758U/ja
Application granted granted Critical
Publication of JPS587645Y2 publication Critical patent/JPS587645Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/5363—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1976034878U 1976-03-23 1976-03-23 半導体装置 Expired JPS587645Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976034878U JPS587645Y2 (ja) 1976-03-23 1976-03-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976034878U JPS587645Y2 (ja) 1976-03-23 1976-03-23 半導体装置

Publications (2)

Publication Number Publication Date
JPS52126758U JPS52126758U (enExample) 1977-09-27
JPS587645Y2 true JPS587645Y2 (ja) 1983-02-10

Family

ID=28494255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976034878U Expired JPS587645Y2 (ja) 1976-03-23 1976-03-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS587645Y2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60109332U (ja) * 1983-12-27 1985-07-25 富士通株式会社 混成集積回路装置
JPH0834274B2 (ja) * 1989-02-10 1996-03-29 三菱電機株式会社 自動車用混成集積回路装置
CA2015336A1 (en) * 1989-05-19 1990-11-19 F. Hoffmann-La Roche Ag Imidazodiazepines for the treatment of neurological symptoms
US8587019B2 (en) * 2011-10-11 2013-11-19 Ledengin, Inc. Grooved plate for improved solder bonding

Also Published As

Publication number Publication date
JPS52126758U (enExample) 1977-09-27

Similar Documents

Publication Publication Date Title
US4868349A (en) Plastic molded pin-grid-array power package
JP2001077232A5 (enExample)
JPS587645Y2 (ja) 半導体装置
JP2936769B2 (ja) 半導体装置用リードフレーム
JPS59208755A (ja) 半導体装置のパツケ−ジ及びその製造方法
JPH04249353A (ja) 樹脂封止型半導体装置
JPS6223097Y2 (enExample)
JPS595982Y2 (ja) 半導体装置
JPS63120431A (ja) 電力用半導体装置
JPS6139554A (ja) 樹脂封止型半導体装置
JPS607750A (ja) 絶縁型半導体装置
JPS607484Y2 (ja) 電子部品の樹脂モ−ルド装置
JPH0543488Y2 (enExample)
JPS5845825B2 (ja) ハンドウタイセイリユウソシ
JPH0120558B2 (enExample)
JPH0720921Y2 (ja) 樹脂密封型半導体装置
JPH0870087A (ja) リードフレーム
JPH0195751U (enExample)
JPS6020946Y2 (ja) 高出力集積回路
JPS6125255Y2 (enExample)
JPS5812455Y2 (ja) 半導体装置用リ−ドフレ−ム
JPS6214705Y2 (enExample)
JPH0351992Y2 (enExample)
JPH0590336A (ja) テープキヤリアパツケージ
JPS6056309B2 (ja) リ−ドフレ−ムおよびその製造方法