JPS5874062A - Manufacture of resin mold type semiconductor device - Google Patents

Abstract

PURPOSE:To greatly shorten the testing time for a molded semiconductor device, by forming simultaneously the reinforcement of the resin material among the resin parts molded via leads. CONSTITUTION:When forming a resin mold type transistor 3 integrated into a frame 2 via leads 1, the reinforcement parts 7 or 8 of the resin material are simultaneously formed on the back surface of the resin materials 4a-4c or the head part in an integral body. In this constitution, even when the lead frame 5 for reinforcement is removed, collector leads 1a and base leads 1c are separated from the frame 2, and individual devices are supported only by emitter leads 1b, the position is stabilized against the external force because of the presence of reinforcement parts 7, 8. Therefore, a test is performed by contacting probes 6 respectively on leads 1a, 1b and the reinforcement part 7 or 8 is removed after the test. In this constitution, a test can be performed more rapid than the case using a parts feeder.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a register/mold type semiconductor device.

Resin-molded semiconductor devices In particular, the manufacturing of resin-molded transistors for small signals begins with leads consisting of multiple sets of three leads (actually about 25 sets) protruding from the frame. A frame is prepared, and five transistor pellets are attached to the tips of the leads in the middle of each set of leads. Then, the two electrodes formed on the transistor pellet are connected to the tips of the leads arranged on both sides via wires (wire bonding). Thereafter, to protect the wire and the transistor pellet from external damage and to provide good moisture resistance.

The transistor pellet and the wire are each molded with a resin material along with the tip of the lead.

Thereafter, the frame is separated from the leads by punching to obtain individual resin-molded transistors.

Now, resin-molded transistors that have been manufactured in this way are always tested for their electrical characteristics before being sold on the market, and conventionally a device called a parts feeder is used to test these electrical characteristics. . In other words, this device includes a housing part that can accommodate a large number of the transistors, a feeding path that is continuous with the housing part and sequentially leads out the transistors housed in the housing part while vibrating, and a feeding path that is attached to the tip of the feeding path and carries the transistors. It consists of an arc-shaped chute for guiding and feeding the equipment to a designated inspection device (for details, see the magazine [Precision Machinery] Technical Committee of the Japan Society of Precision Machinery 197).
See April 3rd issue m) 69-72 χ After separating the individual transistors from the frame, if these transistors are placed in the housing section of the parts feeder, the characteristics will be automatically inspected to identify good and defective products. They can be sorted out.

However, in this characteristic testing method, a device (parts feeder) is required to align the separated transistors in a certain direction, and since each transistor is fed, the chute often gets jammed. It had disadvantages such as poor machine operation rate and long inspection time. In reality, the characteristics of transistors are tested in several different ways, so several parts feeders are arranged in series and the above-mentioned drawbacks occur in combination.

It is therefore an object of the present invention to eliminate these drawbacks and to
The present invention provides a method for manufacturing a resin-molded transistor, which does not require expensive equipment and can shorten the time required for inspection.

This will be explained below using examples.

FIGS. 1A to 1C are explanatory process diagrams showing one embodiment of a method for manufacturing a resin molded transistor to which the present invention is applied. (FIG. 1 1a) A plurality of (actually about 25) resin molded transistors 3 are prepared which are integrated with the frame 2 via leads 1. The molded resin materials 4a, 4b, old...46 have K as mentioned above.
A transistor pellet is soldered to the lead in the middle, two electrodes are formed on the transistor pellet, and wires are connected to the leads placed on both sides. Contained. Here, the middle lead is collector lead 11. The leads on either side of it are emitter lead lb and pace lead 1c. This n is determined in a similar arrangement for other transistors as well. A frame 5, which is formed parallel to the frame 2 and integrally with the lead l, is a frame for reinforcing the lead l.

(Drawing 1b) Thereafter, the frame 5 is removed by punching, and the collector lead la and base lead 1c of each transistor are separated from the frame 2.

Drawing 10) One terminal of the inspection device is connected to the frame 2, and the collector is connected via the probe 6 of the other terminal.
Connect to 8. At this time, the probe 6 is applied to the collector lead 1a and multiple base leads ICE of each resin molded transistor integrally attached to the frame 2, and inspects each transistor. It is memorized and marked in a later process. In this measurement, since the emitter lead lb of each transistor is a common trap, Ic1. Because o cannot be measured, CIO has the same value as Ic + c.
By measuring s, it is changed to n.

In this way, the electrical characteristics of each transistor can be inspected simply by touching it with a probe without having to separate each transistor from the frame. Therefore, since a parts feeder is not used, inspection can be performed at low cost.

In addition, unlike when using a parts feeder, individual transistors are not sent to the inspection equipment due to vibration, but multiple transistors can be sent smoothly in their entire frame, and multiple transistors can be inspected at once. It is possible to shorten the inspection time. However, even in such a method, each individual transistor is only supported by the frame 2 by the emitter lead lb. Therefore, the positional stability cannot be determined by external force, so the method shown in Fig. 2 and As shown in FIG. 3, molded resin material 4a~
A reinforcing part is formed at the 4C part using a resin material. In other words, in FIG. 2, the reinforcing resin film 7 is formed on the back surfaces of the resin materials 4a to 4e at the same time as they are integrally molded, and in FIG. A reinforcing resin rod 8 is formed integrally with these at the same time during molding. After the characteristic test is completed, these may be removed by punching or the like.

In the testing method in this embodiment, the characteristics of transistors formed in one frame are tested at once using a plurality of sets of probes, but the invention is not limited to this, and testing may be performed for each transistor. Needless to say, even in this case, inspection can be performed more quickly than when using a parts feeder.

Further, in this embodiment, only the emitter lead lb of each transistor is tested while being integrated with the frame, but it is not limited to the emitter lead lb, but may be the collector lead la or the pace lead lc.

In this example, only the measurement of 1C1il ('CI.) is given as an example, but 1', l, I and vc! ,.

. ClC0l 1tlO vc,. etc. can be measured in the same way.

As described above, by using the method for manufacturing a resin molded transistor according to the present invention, expensive equipment is not required and inspection time can be significantly shortened.

[Brief explanation of drawings]

Figures 1 (a1 to (C)) are process explanatory diagrams showing a method for manufacturing a resin molded transistor to which the present invention is applied. 1...9-)', 2t5...Frame, 3...Resin mold type transistor, 4a to 4e...Resin material. 6... Probe, 7... Reinforced resin film, 8... Reinforced resin rod, 9.10... Reinforced lead. Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] 1. A plurality of register/mold type semiconductor devices having a semiconductor element molded with resin and a plurality of leads protruding from the resin molding the semiconductor element are connected to one frame by the plurality of leads, and At the time of the molding, the plurality of register/mold type semiconductor devices are formed so as to be integrally connected by resin, and then the plurality of leads are separated from the frame and the plurality of register/mold type semiconductor devices are formed by at least the resin. 1. A method for manufacturing a register/mold type semiconductor device, comprising the step of integrally supporting the type semiconductor device.