JPS5871052A - 心なし研削盤 - Google Patents

心なし研削盤

Info

Publication number
JPS5871052A
JPS5871052A JP16577481A JP16577481A JPS5871052A JP S5871052 A JPS5871052 A JP S5871052A JP 16577481 A JP16577481 A JP 16577481A JP 16577481 A JP16577481 A JP 16577481A JP S5871052 A JPS5871052 A JP S5871052A
Authority
JP
Japan
Prior art keywords
workpiece
grindstone
grinding
grinding machine
centerless grinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16577481A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325906B2 (enrdf_load_stackoverflow
Inventor
Shuhei Takasu
高巣　周平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16577481A priority Critical patent/JPS5871052A/ja
Publication of JPS5871052A publication Critical patent/JPS5871052A/ja
Publication of JPS6325906B2 publication Critical patent/JPS6325906B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H49/00—Unwinding or paying-out filamentary material; Supporting, storing or transporting packages from which filamentary material is to be withdrawn or paid-out
    • B65H49/02—Methods or apparatus in which packages do not rotate
    • B65H49/04—Package-supporting devices
    • B65H49/06—Package-supporting devices for a single operative package
    • B65H49/08—Package-supporting devices for a single operative package enclosing the package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/01—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor for combined grinding of surfaces of revolution and of adjacent plane surfaces on work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP16577481A 1981-10-19 1981-10-19 心なし研削盤 Granted JPS5871052A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16577481A JPS5871052A (ja) 1981-10-19 1981-10-19 心なし研削盤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16577481A JPS5871052A (ja) 1981-10-19 1981-10-19 心なし研削盤

Publications (2)

Publication Number Publication Date
JPS5871052A true JPS5871052A (ja) 1983-04-27
JPS6325906B2 JPS6325906B2 (enrdf_load_stackoverflow) 1988-05-27

Family

ID=15818775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16577481A Granted JPS5871052A (ja) 1981-10-19 1981-10-19 心なし研削盤

Country Status (1)

Country Link
JP (1) JPS5871052A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0548957A1 (en) * 1991-12-26 1993-06-30 Micron Machinery Co., Ltd. Method of centerless grinding, and centerless grinding machine for stepped work
JPH06238556A (ja) * 1993-08-02 1994-08-30 Kitagawa Iron Works Co Ltd 工作機用チャックにおける爪の加工方法
JP2007050456A (ja) * 2005-08-16 2007-03-01 Micron Seimitsu Kk センタレス研削機におけるアンギュラ研削方法、および同装置
JP2014069278A (ja) * 2012-09-28 2014-04-21 Nisshin Kikai Seisakusho:Kk センタレス研削盤
CN106493614A (zh) * 2016-11-14 2017-03-15 海瑞恩精密技术（太仓）有限公司 一种磨削机及其使用方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2774760B2 (ja) * 1992-11-26 1998-07-09 ミクロン精密株式会社 段付き加工物のセンターレス研削装置、および同研削方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0548957A1 (en) * 1991-12-26 1993-06-30 Micron Machinery Co., Ltd. Method of centerless grinding, and centerless grinding machine for stepped work
JPH06238556A (ja) * 1993-08-02 1994-08-30 Kitagawa Iron Works Co Ltd 工作機用チャックにおける爪の加工方法
JP2007050456A (ja) * 2005-08-16 2007-03-01 Micron Seimitsu Kk センタレス研削機におけるアンギュラ研削方法、および同装置
JP2014069278A (ja) * 2012-09-28 2014-04-21 Nisshin Kikai Seisakusho:Kk センタレス研削盤
CN106493614A (zh) * 2016-11-14 2017-03-15 海瑞恩精密技术（太仓）有限公司 一种磨削机及其使用方法

Also Published As

Publication number Publication date
JPS6325906B2 (enrdf_load_stackoverflow) 1988-05-27

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