JPS5867082A - 超伝導素子実装用ボードの製作方法 - Google Patents

超伝導素子実装用ボードの製作方法

Info

Publication number
JPS5867082A
JPS5867082A JP56166686A JP16668681A JPS5867082A JP S5867082 A JPS5867082 A JP S5867082A JP 56166686 A JP56166686 A JP 56166686A JP 16668681 A JP16668681 A JP 16668681A JP S5867082 A JPS5867082 A JP S5867082A
Authority
JP
Japan
Prior art keywords
board
mercury
hole
pipette
board substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56166686A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6257277B2 (https=
Inventor
Fumikazu Ohira
文和 大平
Junpei Suzuki
淳平 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP56166686A priority Critical patent/JPS5867082A/ja
Publication of JPS5867082A publication Critical patent/JPS5867082A/ja
Publication of JPS6257277B2 publication Critical patent/JPS6257277B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R3/00Electrically-conductive connections not otherwise provided for
    • H01R3/08Electrically-conductive connections not otherwise provided for for making connection to a liquid

Landscapes

  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
JP56166686A 1981-10-19 1981-10-19 超伝導素子実装用ボードの製作方法 Granted JPS5867082A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56166686A JPS5867082A (ja) 1981-10-19 1981-10-19 超伝導素子実装用ボードの製作方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56166686A JPS5867082A (ja) 1981-10-19 1981-10-19 超伝導素子実装用ボードの製作方法

Publications (2)

Publication Number Publication Date
JPS5867082A true JPS5867082A (ja) 1983-04-21
JPS6257277B2 JPS6257277B2 (https=) 1987-11-30

Family

ID=15835848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56166686A Granted JPS5867082A (ja) 1981-10-19 1981-10-19 超伝導素子実装用ボードの製作方法

Country Status (1)

Country Link
JP (1) JPS5867082A (https=)

Also Published As

Publication number Publication date
JPS6257277B2 (https=) 1987-11-30

Similar Documents

Publication Publication Date Title
US5789271A (en) Method for fabricating microbump interconnect for bare semiconductor dice
US6105852A (en) Etched glass solder bump transfer for flip chip integrated circuit devices
US7047638B2 (en) Method of making microelectronic spring contact array
US6294745B1 (en) Solder anchor decal
US5578162A (en) Integrated composite semiconductor devices and method for manufacture thereof
US6364196B1 (en) Method and apparatus for aligning and attaching balls to a substrate
US7008817B2 (en) Method for manufacturing micro electro-mechanical systems using solder balls
US6998533B2 (en) Electronic device and method of manufacturing same
US7547850B2 (en) Semiconductor device assemblies with compliant spring contact structures
WO2001067157A3 (en) Silicon on insulator optical membrane structure for fabry-perot moems filter
JPS60159731A (ja) 液晶表示体
WO2007076099A3 (en) Microelectronic elements with compliant terminal mountings and methods for making the same
JPH10335802A (ja) ボール配列治具及びその製造方法
JPS5867082A (ja) 超伝導素子実装用ボードの製作方法
JP2003115658A (ja) 配線基板の製造方法、充填物挿入方法、配線基板、及び素子パッケージ
US6504967B1 (en) Passive alignment method and apparatus for fabricating a MEMS device
JPH1012761A (ja) Icのパッケージ、icのプローバ、コネクタ及びそれらの製造方法
CN109467045A (zh) Mems器件的封装方法及微执行器的制备方法
KR100996613B1 (ko) 프로브 핀의 정렬 추출 방법
US7140101B2 (en) Method for fabricating anisotropic conductive substrate
JPH06273779A (ja) 液晶の注入方法
JPH0476279A (ja) マイクロポンプの製造方法
JPS60253177A (ja) コネクタ装置
SU965317A1 (ru) Способ изготовлени преобразователей изображений
JPS5848947A (ja) 半導体装置の製法