JPS5866654U - Glass packaging type semiconductor device - Google Patents

Glass packaging type semiconductor device

Info

Publication number
JPS5866654U
JPS5866654U JP16215581U JP16215581U JPS5866654U JP S5866654 U JPS5866654 U JP S5866654U JP 16215581 U JP16215581 U JP 16215581U JP 16215581 U JP16215581 U JP 16215581U JP S5866654 U JPS5866654 U JP S5866654U
Authority
JP
Japan
Prior art keywords
type semiconductor
semiconductor device
packaging type
glass packaging
moat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16215581U
Other languages
Japanese (ja)
Inventor
杉本 保雄
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP16215581U priority Critical patent/JPS5866654U/en
Publication of JPS5866654U publication Critical patent/JPS5866654U/en
Pending legal-status Critical Current

Links

Landscapes

  • Bipolar Transistors (AREA)
  • Thyristors (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のモートグラシベーション型半導体素子の
モート部分の断面図、第2図はジャンクション接合端部
の拡大図。第3図は本考案のモートグラシベーション型
半導体素子の製造工程途中における、モート部分の断面
図、第4図は本考案のモートグラシベーション型半導体
素子のモート部分の断面図、第5図は本考案におけるジ
ャンクション接合端部の拡大図である。 尚、図において、1・・・・・・N型半導体基板、2・
・・・・・P型絶縁拡散層、3・・・・・・Pエミッタ
拡散層、4・・・・・・Pベース拡散層、5・・・・・
・Nエミッタ拡散層、6・・・・・・Pベース接合、7
・・・・・・P千ミッタ接合、8・・・・・・Pベース
接合端、9・・・・・・Pエミッタ接合端、10・・・
・・・メサ溝、11・・・・・・ガラス、12・・・・
・・電極、13・・・・・・空乏層、14.15・・・
・・・空乏層−メサ溝  □接触端、16・・・・・・
酸化膜、17.18・・・・・・本考案における製造工
程途中におけるメサ溝、19・・・・・・メサ突出部、
である。
FIG. 1 is a cross-sectional view of a moat portion of a conventional moat gracivation type semiconductor device, and FIG. 2 is an enlarged view of a junction junction end. FIG. 3 is a cross-sectional view of the moat portion of the moat gradation type semiconductor device of the present invention during the manufacturing process, FIG. 4 is a sectional view of the moat portion of the moat gradation type semiconductor device of the present invention, and FIG. It is an enlarged view of the junction joint end part in the invention. In the figure, 1...N-type semiconductor substrate, 2...
...P type insulating diffusion layer, 3...P emitter diffusion layer, 4...P base diffusion layer, 5...
・N emitter diffusion layer, 6...P base junction, 7
...P thousand-mitter junction, 8...P base junction end, 9...P emitter junction end, 10...
...Mesa groove, 11...Glass, 12...
... Electrode, 13... Depletion layer, 14.15...
...Depletion layer - mesa groove □Contact end, 16...
Oxide film, 17.18... Mesa groove in the middle of the manufacturing process in the present invention, 19... Mesa protrusion,
It is.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] モートグラシベーション型半導体素子において、モート
溝に突起を設けた事を特徴とするガラスパッシベーショ
ン型半導体装置。
A glass passivation type semiconductor device characterized in that a moat groove is provided with a protrusion in a moat gracivation type semiconductor element.
JP16215581U 1981-10-29 1981-10-29 Glass packaging type semiconductor device Pending JPS5866654U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16215581U JPS5866654U (en) 1981-10-29 1981-10-29 Glass packaging type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16215581U JPS5866654U (en) 1981-10-29 1981-10-29 Glass packaging type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5866654U true JPS5866654U (en) 1983-05-06

Family

ID=29954488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16215581U Pending JPS5866654U (en) 1981-10-29 1981-10-29 Glass packaging type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5866654U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327061U (en) * 1986-08-05 1988-02-22

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327061U (en) * 1986-08-05 1988-02-22

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