JPS5866396A - Method of producing printed board with terminal - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a printed circuit board having plug-type terminals.

An electronic circuit is constructed by mounting electronic components on a printed circuit board. In order to improve the connectivity of the package within the device and to simplify inspection and maintenance, a printed jack is provided in the device in which the package is installed, and a plug-shaped terminal formed on the package is inserted into the printed jack. Connect.

Conventionally, the plug-type terminal portion of such a printed circuit board was designed to make good contact with the printed jack.

Replace it with highly corrosion-resistant metals such as gold or rhodium.

The coating thickness of this metal is relatively thin, about 2 (Pm) for gold and about 1d 0.5 CPrrLl for rhodium, so the coating was formed exclusively by electrolytic plating.

FIG. 1 shows a plug-shaped terminal portion of such a printed circuit board and a portion of its surroundings.

The surface steel layer 12 of the printed circuit board 110 is subjected to a photo-etching process in order to obtain a desired conductor pattern.

The terminal portion 13, which is usually in the form of a plug, protrudes convexly from the printed circuit board 11.

In order to electrolytically plate the conductor pattern 14 of the terminal portion 13 with gold or rhodium, the surface of the conductor pattern 14 is cleaned using acid and pure water to remove oxides and the like, and then the copper surface is immersed. After thorough pre-treatment to obtain the desired results, an adhesive synthetic resin film 16 is pasted on the boundary portion 15 between the conductor pattern 140 and the circuit pattern of the terminal to be plated to form a metal-resist, and a predetermined plating device (not shown) is applied. ) in the electrolyte of the printed circuit board 11.). The terminal portion 13 is immersed vertically into the electrolytic solution so that the surface of the electrolytic solution is located at a position slightly above the lower end of the mating resist (1g).

Electrolytic plating is applied to the terminals 13 of the printed circuit board 11 in this state. However, in such electrolytic plating treatment, the synthetic resin film 1 as a metal resist
If the adhesion between the printed circuit board 11 and the printed circuit board 11 is not sufficient, the electrolytic solution may seep between the two and lead to corrosion of the conductors (turns) in the parts to be protected. It will happen.

In addition, the electrolyte is agitated due to the operation of the filtration device to remove impurities in the electrolyte and the stirring to homogenize the electrolyte, and the electrolyte becomes droplets from the surface of the electrolyte, causing the printed circuit board 11
It adheres to the conductor pattern located higher than the part covered with the synthetic resin film 16 as a mesh resist, and corrodes the paddle turn of the conductor.

The present invention aims to provide a manufacturing method that can solve and eliminate the problems that occur during terminal plating processing on printed circuit boards equipped with such plug-type terminals.

Therefore, according to 1 the present invention, there is a step of inserting a U-shaped conductor piece having a noble metal layer on its surface onto a conductor pattern constituting an external connection terminal portion, and fixing the conductor piece to the conductor pattern. A method of manufacturing a printed circuit board with a terminal is provided.

The present invention will be explained in detail below with reference to examples.

FIG. 2 shows a plug terminal portion of a printed circuit board according to the present invention.

In the same figure (a), 21 is a printed circuit board, 22 is a conductor pattern for wiring, and 23 is a conductor pattern for Fi terminal.

The terminal conductor pattern 23IIi is also arranged corresponding to the back surface of the printed circuit board 21. The conductive patterns 22 and 23 are made of copper foil.

According to the present invention, after solder plating is applied to each of the terminal conductor patterns 23 of the printed circuit board to a thickness of about 30 CPmJ, the U-shaped conductor pieces 24 shown in FIG. The conductor piece 24 is inserted and fitted, and the conductor piece 24 is soldered to the terminal conductor pattern 23.

This conductor piece 24 is intended to provide a metallized layer corresponding to the gold or rhodium plating layer in the prior art to the surface of the terminal conductor pattern 23.

Therefore, such a conductor piece z4Fie, for example 5 (pm
) Thickness 1.5mm on the surface of the rhino copper foil base. o (p-nickel 0N
i) Plating and gold (Au) plating with a thickness of 2 (Pm).

As shown in Figure 9, the conductor piece 24 consists of wide parts 24a and 24b fixed to the terminal conductor pattern 23 and a narrow part 24c continuous between the wide parts 24a and 24b.

These wide parts 24a and 24b are the terminal conductor turns 2.
3, and the length of the narrow portion 24c is the thickness of the printed circuit board 21. By arranging the narrow portion 24c.

The terminal conductor pattern 23 and the corresponding terminal conductor pattern (turn) provided on the back side of the printed circuit board 21 are electrically connected, and it is not necessary to connect both terminal conductor patterns by, for example, through-hole plating. do not have.

3rd r! ! J shows a state in which a conductor piece according to the present invention is inserted into a plug-shaped terminal portion of a printed circuit board and soldered.

The conductor piece 24 according to the present invention is formed, for example, by the following method.

Nickel (Ni) plating is applied to the thickness of . Next, a plating mask made of photoresist is formed in a predetermined pattern on the front two-layer nickel layer, and then gold (Au) is applied to the top 11 of the nickel layer to a thickness of about 2 (Pm). The photoresist layer is then removed and the nickel and steel layers are selectively etched using the metal as a mask. After that.

The aluminum plate carrier is dissolved and removed to obtain the conductor piece.

According to the present invention, the formation of the terminal portion of a metal such as gold or rhodium, which covers the conductive pattern of the terminal portion of the printed circuit board to be connected to the printed jack, is performed in advance in another process. After that, it is placed on the conductor pattern of the terminal section of the printed circuit board and connected by soldering, etc., so the printed circuit board can be coated with metal such as gold or rhodium without applying any electrolytic plating to the terminal section. Therefore, there are no problems associated with electrolytic plating.

Note that the method for coating a metal film according to the present invention includes the coating of a terminal portion as described above! In addition, partial coating of a corrosion-resistant metal film to be applied on a printed circuit board can be done simply, reliably, and safely without damaging the conductor pattern on the printed circuit board by the electrolyte using exactly the same process. It is something that can be cast.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a printed circuit board having plug-type terminals, FIG. 2 is an external perspective view showing a conductor pattern of the terminal portion of the printed circuit board according to the present invention and a conductor piece inserted into the pattern, and FIG. FIG. 3 is an external perspective view showing how the conductor piece is fixed to the terminal portion of the printed circuit board. In the figure, 11.21......Printed circuit board 14.23......Terminal conductor pattern 24...・・・・・・・・・
Conductor piece%/Figure/4 2nd area 2 Brush 3 figure 2

Claims (1)

[Claims] A terminal comprising the step of inserting a substantially U-shaped conductor piece having noble metal layers on two surfaces onto a conductor pattern constituting an external connection terminal portion, and fixing the conductor piece to the conductor pattern. A method for manufacturing a printed circuit board.