JPS5866323A - 金属化組成物 - Google Patents

金属化組成物

Info

Publication number
JPS5866323A
JPS5866323A JP57164164A JP16416482A JPS5866323A JP S5866323 A JPS5866323 A JP S5866323A JP 57164164 A JP57164164 A JP 57164164A JP 16416482 A JP16416482 A JP 16416482A JP S5866323 A JPS5866323 A JP S5866323A
Authority
JP
Japan
Prior art keywords
coating
weight
composition
tin
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57164164A
Other languages
English (en)
Japanese (ja)
Inventor
ウイリアム・ト−マス・ヒツクス
ウイリアム・カ−ル・サイデル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JPS5866323A publication Critical patent/JPS5866323A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/04Electrodes or formation of dielectric layers thereon
    • H01G9/042Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/0425Electrodes or formation of dielectric layers thereon characterised by the material specially adapted for cathode

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP57164164A 1981-09-23 1982-09-22 金属化組成物 Pending JPS5866323A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/304,890 US4434084A (en) 1981-09-23 1981-09-23 Base metal conductor cathode coating for tantalum capacitors
US304890 1981-09-23

Publications (1)

Publication Number Publication Date
JPS5866323A true JPS5866323A (ja) 1983-04-20

Family

ID=23178432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57164164A Pending JPS5866323A (ja) 1981-09-23 1982-09-22 金属化組成物

Country Status (6)

Country Link
US (1) US4434084A (enExample)
EP (1) EP0075324A3 (enExample)
JP (1) JPS5866323A (enExample)
CA (1) CA1192039A (enExample)
DK (1) DK422082A (enExample)
GR (1) GR76728B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63501908A (ja) * 1985-07-01 1988-07-28 ペトロファーム インコーポレーティド プリント回路板および/またはプリント配線板の洗浄方法

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3779870T2 (de) * 1986-11-08 1992-12-24 Showa Denko Kk Festelektrolytkondensator und verfahren zu seiner herstellung.
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5736070A (en) * 1992-10-13 1998-04-07 Tatsuta Electric Wire And Cable Co., Ltd. Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
CN1110833C (zh) * 1995-04-04 2003-06-04 佳能株式会社 形成发射电子器件的含金属组合物及应用
US6291025B1 (en) * 1999-06-04 2001-09-18 Argonide Corporation Electroless coatings formed from organic liquids
US6787068B1 (en) * 1999-10-08 2004-09-07 E. I. Du Pont De Nemours And Company Conductor composition
JP2002134360A (ja) * 2000-10-24 2002-05-10 Matsushita Electric Ind Co Ltd 固体電解コンデンサおよびその製造方法
JP2004119692A (ja) * 2002-09-26 2004-04-15 Koa Corp 抵抗体組成物および抵抗器
JP4535786B2 (ja) * 2004-06-18 2010-09-01 三井金属鉱業株式会社 含銅スズ粉、その含銅スズ粉を含む混合粉体、その含銅スズ粉の製造方法、及び、その含銅スズ粉又は混合粉体を用いた導電ペースト
KR100709724B1 (ko) * 2007-01-30 2007-04-24 (주)이그잭스 도전막 형성을 위한 금속 페이스트
KR100977163B1 (ko) * 2009-03-23 2010-08-20 덕산하이메탈(주) 솔더 접착제와 그 제조 방법 및 이를 포함하는 전자 장치
KR101225497B1 (ko) * 2009-11-05 2013-01-23 (주)덕산테코피아 도전성 접착제와 그 제조 방법 및 이를 포함하는 전자 장치
US9947809B2 (en) 2009-11-11 2018-04-17 Samsung Electronics Co., Ltd. Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste
US9984787B2 (en) * 2009-11-11 2018-05-29 Samsung Electronics Co., Ltd. Conductive paste and solar cell
KR102071006B1 (ko) * 2009-11-11 2020-01-30 삼성전자주식회사 도전성 페이스트 및 태양 전지
US8987586B2 (en) 2010-08-13 2015-03-24 Samsung Electronics Co., Ltd. Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste
US8974703B2 (en) 2010-10-27 2015-03-10 Samsung Electronics Co., Ltd. Conductive paste and electronic device and solar cell including an electrode formed using the same
US9105370B2 (en) 2011-01-12 2015-08-11 Samsung Electronics Co., Ltd. Conductive paste, and electronic device and solar cell including an electrode formed using the same
US8940195B2 (en) 2011-01-13 2015-01-27 Samsung Electronics Co., Ltd. Conductive paste, and electronic device and solar cell including an electrode formed using the same
KR101796658B1 (ko) * 2011-03-28 2017-11-13 삼성전자주식회사 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지
DE112013004358B4 (de) * 2012-09-05 2024-01-04 Kemet Electronics Corporation Verfahren zur Herstellung eines hermetisch versiegelten Polymerkondensators mit hoher Stabilität bei erhöhten Temperaturen
US9914760B2 (en) 2013-06-29 2018-03-13 Firmenich Sa Methods of identifying, isolating and using odorant and aroma receptors

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54114751A (en) * 1978-02-27 1979-09-07 Nippon Electric Co Electrolytic capacitor and method of producing same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB815554A (en) * 1955-12-28 1959-06-24 Amp Inc Improvements in or relating to electrical connections
FR2221533A1 (en) * 1973-03-14 1974-10-11 Du Pont Metallising paste contg. copper and tin dispersion - in a flux contg. a reducing agent
US4054714A (en) 1976-06-07 1977-10-18 E. I. Du Pont De Nemours And Company Electrically conductive adhesive composition
JPS56103260A (en) 1980-01-22 1981-08-18 Asahi Kagaku Kenkyusho:Kk Conductive paint containing copper powder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54114751A (en) * 1978-02-27 1979-09-07 Nippon Electric Co Electrolytic capacitor and method of producing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63501908A (ja) * 1985-07-01 1988-07-28 ペトロファーム インコーポレーティド プリント回路板および/またはプリント配線板の洗浄方法

Also Published As

Publication number Publication date
DK422082A (da) 1983-03-24
US4434084A (en) 1984-02-28
GR76728B (enExample) 1984-08-30
CA1192039A (en) 1985-08-20
EP0075324A2 (en) 1983-03-30
EP0075324A3 (en) 1985-08-21

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