JPS5858721A - Chip solid electrolytic condenser and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Kien is a chip-type solid turtle condensate! and its l1l
This relates to the LFI method, in particular, by knowing the length of the lead wire from the capacitor element, it is possible to reduce the size, and also to weld and cut lead 1 etc. using a laser beam to reduce leakage current, etc. Kurauchi has improved the characteristics and yield. As shown in Fig. 1, molding of tantalum powder together with tantalum lead wire ω - Application of manganese solution - Glare After passing through one stopper, the tantalum reed was produced by repeating the process of oxidation and formation to produce manganese dioxide, and then applied carbon dalafite and silver paste on the manganese dioxide to form a 1111 layer. - A content element (2) which looks at (1) was obtained. Then, punch out or bend the consonant element (2) and combine it with the other terminal (3) to form the welded part η). *&L, and after soldering the 驎澤 terminal (5) to the Yin 4 II KI fi I I & i Iryuan layer, #7! However, in this structure, spot welding is used, so the spot welder's electricity is applied to the element (2) direction and the one-pole terminal (3).
Since it will be located between the welding part (4) and the welding part (4), I will have to bend the terminal (3) and make it into the welding part (4).
There was a drawback that the gap with il became large. Also, if you try to know as much as possible the distance between this content element (2) 5ImrkJ and the bath contact part (4), it will melt! 1es (a)]
is the lead! i (1) Due to the pressure of # on the tip of the cispot, the lead wire (1) of the welding alarm slipped from the tip, and the lead of the condente rod (2) - (1) m was attached to the crotch of the machine. Therefore, in the case of the configuration shown in Figure 1, the length from the capacitor element (2) to the bath contact part (4) may exceed a certain value or increase the leakage current. This is one of the reasons for the downsizing.Furthermore, when spot bath welding is used, the lead wire (1) and v
The consonde element (
2J is not a fool] but a resin (
Inconveniences tend to occur when molding 4), and ii!
F has a relatively high electrical resistance as a material for the electrode terminal (3).
There was also the problem that materials such as e#N1 or alloys thereof were limited. In addition to the structure shown in Figure 1g1, for example, a consonde element (1
Cross the positive terminal or the positive lead wire (13) to the lead wire (11) of 2) and use a spot welder to connect [1].
Those forming es(14) are also known.

However, in the case of this configuration, there is an 8m point that is exactly the same as the content of the configuration shown in FIG. 1 described in 1-U. And in the past, it was as content as spot bathing! The lead wire and the plate-shaped S-terminal are also Iribm! IMti while applying pressure by sandwiching these with a pair of upper and lower welding voltages.
It was permeated by the technical philosophy of doing things.

Ki-ni was made with the above points in mind, and it's a tip!
Miniaturization by using laser light for 9J cutting of fI plates and lead wires between lead wires implanted in content elements and single-pole terminals in integrated electrolytic capacitors,
This is intended to reduce cost while improving leakage current characteristics and improving yield.This will be explained below using examples. As shown in Figure 3, attach the tantalum lead wire (21) to the tantalum powder.
Looking at the consonde element (22) molded with a t-crotch, -
Weld the lead wire (21) to the belt-shaped pot Ji4i (23). In this state, the consonde element (22) is immersed in a chemical solution, 4 times heated to form it, then pulled up, and a nitric acid solution is applied 11 to form manganese dioxide. Then, a repaired anode shell and manganese dioxide are formed on the capacitor element (22), and then carbon graphite, silver paste, etc. are applied to form a negative layer on the surface. As shown in the front view in Fig. 4 and the spinal blood diagram in Fig. 5, the electronic array A (24) is installed in the circle of the content element (22) installed in relation to the terminal 7 frame (24) at position W1@. Solder the Yintoku frame (25) and continue with 1#: with the Fi Lu electric photosensitive agent.Meanwhile, the condensed element (22) is 11!
1) Place it in contact with the tip of the 111411+7 wire (26) drawn at right angles from the Fi-law wiring terminal frame (24). Then, as shown in Figure 6, the Aki Tsude Line (
21) and the anode frame (26) at the welding part (21) and the anode frame (26).
)) from the laser emitter & device (28) to the condensing lens (29
) and irradiate the 1st welding WJ (27) with a laser beam to weld. Note that the lead wire (21) can also be cut at the same time during this welding, which has the effect of shortening the process.

In this way, the lead wire (21) and the capacitor? The device (22) with the cathode layer connected to the ttm-frame (26) and the cathode frame (25) is set in a molded type (without 1), and is attached to the i-way when installing it (1130) (
Terminal 7 is formed after Wk (31) is molded with Wk (32).
Tie bar (33) clearly shown in Figure 4 of frame (24)
Cut the #Ik woodcutter frame (26) and 隘-7 ray ^(
After cutting off the conduction with the terminal frame (241), screening is performed by applying a voltage to the terminal frame (241), and the terminal frame (26) and 11m4 are connected as shown in Fig. 7.
17 leh! (25) and uJ&L chip type solid Kamishi condensate V is obtained. Regarding the inventor's experimental results, Eberu and Kinoe have a capacitor rating of 35 V-DC-0,
1〆 (Dimensions sail 8 x 0.8 x thickness 0.5 I11 square height).

Tantalum lead wire 0625 - x length 0.6mm, frame material #I & thickness 0.21all@t, lIr contact conditions between lead layer and mesh frame YAG heat, voltage 6
50v pulse - 7 meals 1. Irradiation speed: 1 time/liao, exterior epoxy resin, finished product dimensions: height 1.2 x length 3.2 x
-1.61, the conventional example uses the same rating as the exterior resin, and the lead wire #i0.25mm -X length 1.
8■, Terminal 7 frame material is 42 nickel m thickness 0.2
5 t1 The lead and frame are melted)
Bathtub, finished product dimensions Height 1.7cm x Length 4.6cm x
111i@2.5+111. Note that the lead wire length is 1
．． 8cm is a size that does not pose any problem for spot bathing, and making it shorter than this would be an extremely short size. Condensed under these conditions! The results of leakage current and reliability per 100-min are shown in the table below.

The reliability is the 60% reliability level value when the rated voltage (35V) is applied at 85°C and left at 1000C.

As described above, according to the present invention, the capacitor f element (22
)Noriichido@(21) and positive-7 reme(26))
By using a laser beam to cut the j contact and the lead wire [(21), the conventional lead wire U) and ill! Since there is no need to worry about bent welded parts (k) such as the terminal terminal (3), the length of the first mold (21) can be shortened, making it easier to downsize. Since no mechanical stress is applied to the chip, it is possible to obtain a chip fat-disintegrating electrolytic capacitor with excellent leakage plate characteristics and good properties.Furthermore, when spot bath welding is used as in the conventional example, the #i terminal 1I47, which has low electrical resistance, cannot be used as a 7-frame material, and materials with high comparative resistance values such as F and Ni must be used, but these materials can be used when incorporating condensate! into one path. The surface treatment must be carried out assuming that the soldering is in a rough state, but it is easy to solder with the low electric resistance koji such as #1li11 in this case. It has the advantage of being able to use materials that allow for surface treatment of the terminal frame.

[Brief explanation of the drawing]

Figure 2 is a plan view showing another example of the conventional chip leakage solid electrolytic condenser, and Figures 3 to 7 are the plane views of the conventional chip leakage solid electrolytic condenser. The ls3 diagram shows the condensation element and the hook j4IIi.
The front view shows the welded state, the fourth figure shows the foreshadowing that connects the condensing element to the terminal 7 frame, and the fifth figure shows the foreshadowing.
The figure is also Ikko-zu, Figure 6 Hayendensa 1m4
7 frames and yin-frames! Fig. 7 is a normal view of the chip JJM integrated electrolytic capacitor. (211-----Lead @ (22+--------Condenser element (233------Zeng drawing board (243--
-One terminal 7 frames (25)---Ikinshin frame (2
6) ---Jim 41k y seam +2 f3. −
-1-Bath contact (281-1--Laser oscillator +2
91---One converging lens (30)(31)---One part (32>------1f fat (33)------
One tie bar patent applicant! Lecon Electronics Co., Ltd.

Claims (1)

[Claims] (1) Conden! The element is connected to the 4-frame frame which extends downwardly at the tip of the element at approximately right angles to the lead wire, and the shade l1IL which follows #II of the condenser element.
frame, and the frame and tt* reef 7
A chip IjII monolithic electrolytic capacitor that has been tested except for the frame's handle part. (2JI# 7 and 111417 frames are made of copper - a chip leakage electrolytic capacitor as described in Patent No. 1). After welding the dowel to the ordinary II4 board, a process of forming a chemical conversion film, a manganese dioxide layer, a semiconductor layer, and a bottom layer on the condenser wire, and after this step, a terminal 7 is attached to the bottom layer of the condenser wire. Discussion of the 7 rams and the process of handling the 7 rams respectively on the terminal frame which is raised approximately perpendicular to the lead wire, and after this process, the arrangement - further Il.
The process of attaching the 1m frame to the lead wire and cutting the bath I & lI and the lead wire using a laser light beam, and after this process, molding these with 11 resin and cutting the tie bar of the terminal frame to make a chip type. Integrated electrolytic condenser! l1If [Method (4) Method for manufacturing an electrolytic capacitor with chip removal according to product No. (3) of the patent claim, characterized in that the terminal frame consists of - (S lead supply and #I- A chip-type prison electrolytic capacitor according to paragraph (4), characterized in that the laser light is used to simultaneously connect the frame and cut the lead wires. l1ilfi method.