JPS5858720A - Method of producing small electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Hajime Kinei relates to small electronic components, particularly electronic components having lead wire terminals, and to manufacturing of small electronic components that do not apply mechanical and thermal stress during the process of welding a lead terminal to the lead wire. The present invention provides a method.

Conventionally, when connecting a parallel frame or a lead terminal to an electronic component element having a lead wire, such as a fiber electrolytic capacitor, # contact is generally used, but the length of the lead of the element U * the length of the contact chip. Since it is determined by the size f (thickness), it is necessary to exceed a certain value.If the lead wire is short at the time of was inhibiting. In addition, the welding tip FA naturally wears out, resulting in poor welding conditions and poor Jimability.Furthermore, even if materials with good weldability (Fe, Ni, etc.) have poor solderability as they are, there is the inconvenience of having to undergo treatments such as plating. Ta.

Kinei Co., Ltd. is a company that has failed in the above points, and is characterized by welding using a laser beam as a means of welding the edge of the electronic component element and the lead-out terminal, and therefore the length of the lead wire from the element. This is an attempt to improve the characteristics by studying the following and reducing the size to the same capacity as M1, and by removing the mechanical (Ir) gas during welding.Examples will be described below. As shown in Figure 1, for example, a condenser V element 0) formed by molding and bonding t& powder has 4* lead edges made of valve metal m1iIi installed inside it.

After welding the lead wire (2) to the borrowed *all 4k (3), a loosened film is generated by chemical reaction and the wire is oxidized.
Impregnated with a hot moat - Wei Yifeng chemical engineering is repeated and made into a peel - m bales and two made into two! 1i by 0, which causes carbon cancer to be generated, and carbonaceous fight, silver base
After forming the jlIi41Ik layer, cut the quaternary su-do Q) to the required length and cut it out from the genus IE (3). This disconnected capacitor sweets (LJ lead & (smell second)
Contact the positive lead-out terminal (4) as shown in the example above to emit laser beam oscillation (from 5J through a condensing lens (6) to the Ftr (7)). Welding.Separate note-
Output terminal (4) Fi lid ^ Lead wire also gold Jlil17
Either frame terminal is fine.

The present invention is as described above. Since the content is read from element (1) all
The maximum of (2) is 1iIf〈as well as the lead wire @)
The mechanical stress is not life-threatening for the implantation Wkm, and the irradiation time of the laser beam is short.
), the leakage current characteristics are superior to conventional examples. And /h-output terminal (4
) Since materials with good soldering properties can be used as materials, surface treatments such as plating are not required. These factors not only improve the characteristics of the content, but also facilitate miniaturization by shortening the length of the lead wire, and do not require surface treatment such as plating without changing the lead terminal material. In addition to the advantages of reducing welding, unlike conventional methods, there is no wear of the welding tip, so it is possible to maintain bath welding strength and continuous work. Can lie down. Next is the invention! ! ! The following is about marriage. In the rated 35WV-0.22 metal solid electrolytic capacitor with the configuration shown in Figure 2 of the Soki, 0.3-tantalum wire is used for the lead wire, and 0.15 cod tN1 plate is used for the S&output terminal.
The content is welded from the direction of the element (1). Note that the conditions for laser *m used in the present invention are as follows.

Melt 1! IIIAY MuG laser voltage 650v pulse -7wall irradiation speed 11/- From this result, it is clear that in the conventional example, l11
iI! If the welding point length exceeds 1.6mm, the leakage current will rise rapidly, but in the case of the present invention, the welding point length should be approximately 41/2, which is possible in the bath at 0.811m't. I can do it. This is because in the case of the conventional subpot 11, the upper and lower welding tips pinch the lead wire (2) and the -Anohikiyama thread (4).
Do-matte (2) Shadow on the plant 1i 2nd part - and i1! This is thought to be due to resistance heat generated during wrinkles. Also, if the #l contact is studied further than 1.51, the welding point will be at the tip of the lead wire (2)] 1IIi11 where the pressure force during welding is applied to this.
#! Ill & tip slippage because the point is the tip,
This is caused by the way pressure is applied, such as with a lever. Naturally, during mass production, work efficiency and yield may also be reduced. On the other hand, Kinei's welding does not require any pressure at all, and only involves heating without shearing, so it is possible to determine the length of the welding point very well.In addition, during mass production, only the characteristics It is also clear that the crop I11 rate and yield increase. In addition, in the actual example, solid electrolytic content is used as an electronic component! Although the above case has been described, other electronic parts such as a chip noodle resistor etc. may be used, and the welding is not limited to only the lead set and the lead wire.

[Brief explanation of drawings]

Figure i41 is Shoichi's diagram showing the koji making process for electronic parts according to the present invention, and Figure 2 is Kiyoi's i1jll&:. ! 3-z welding process. 3 is a diagram showing the relationship between the welding point length and leakage current according to the present invention and the conventional example. (1)----1. Condenser sweets. Cutting) 1111 lead line. (3)---4□. (811f$li+ on 1-4
, '(5)---Raise oscillator.
(6)------ Condensing lens. (7) ------ I J1 location. Patent applicant: Marukon Kameko Co., Ltd.

Claims (1)

[Claims] a) A lead wire implanted in an electronic component element and a 1KI14 lead wire or a 7-frame terminal connected to the lead wire are fitted together using a laser beam. Manufacturing method and body of small electronic components] Electronic components are solid electrolytic capacitors in the tank and lead! ! i! Electric light Jg claimed in the patent, characterized in that has a tantalum edge
Method.