JPH0122692B2 - - Google Patents

Info

Publication number
JPH0122692B2
JPH0122692B2 JP17428580A JP17428580A JPH0122692B2 JP H0122692 B2 JPH0122692 B2 JP H0122692B2 JP 17428580 A JP17428580 A JP 17428580A JP 17428580 A JP17428580 A JP 17428580A JP H0122692 B2 JPH0122692 B2 JP H0122692B2
Authority
JP
Japan
Prior art keywords
contact
gold
tin
fine gold
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17428580A
Other languages
Japanese (ja)
Other versions
JPS5798923A (en
Inventor
Isao Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP17428580A priority Critical patent/JPS5798923A/en
Publication of JPS5798923A publication Critical patent/JPS5798923A/en
Publication of JPH0122692B2 publication Critical patent/JPH0122692B2/ja
Granted legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明はスイツチ等の接点の製造方法に係り、
特にその電気的性能をそこなうことなく、材料の
節減を図ることを目的とする。
[Detailed Description of the Invention] The present invention relates to a method for manufacturing contacts such as switches,
In particular, the purpose is to save materials without sacrificing its electrical performance.

一般にスイツチ等の接点は、環境の変化、経時
変化等により酸化皮膜或いは硫化皮膜などが生
じ、接点不良を引き起し易いので、接点部に金等
の貴金属メツキを施こし、同時に接触抵抗を小さ
くしている。例えば接点部を含む接点端子全面に
金メツキを施こす方法もあるが、金の使用量が多
くなるので、一般に第1図の如き構造のものが使
用されている。即ち、リン青銅の母材11の接点
部に孔12をあけておき、約2mm幅のリン青銅に
1ミクロン乃至数ミクロン程度の厚さの金の冷間
圧延により張り合わせたいわゆる金クラツド材を
プレス加工によつて前記孔12に埋め込む方法
(これをめ接点という)であり、金の使用量が
可成り少くなるが、この方法でも金クラツド材の
プレス加工によつて廃棄される材料が無視できな
い上に、コストも低減できないという欠点があつ
た。
Generally, the contacts of switches, etc., tend to form oxide films or sulfide films due to environmental changes, changes over time, etc., which can easily cause contact failure. are doing. For example, there is a method of gold plating the entire surface of the contact terminal including the contact portion, but since this requires a large amount of gold, a structure as shown in FIG. 1 is generally used. That is, a hole 12 is drilled at the contact point of a phosphor bronze base material 11, and a so-called gold clad material, which is made by laminating gold with a thickness of 1 micron to several microns by cold rolling, is pressed onto the phosphor bronze with a width of about 2 mm. This is a method of filling the hole 12 by processing (this is called a contact point), and the amount of gold used is considerably reduced, but even with this method, the material that is discarded by pressing the gold clad material cannot be ignored. On top of that, there was a drawback that costs could not be reduced.

一般にコスト低減には使用材料を少くする方法
と、低価格の材料を使用する方法とがあるが、電
子部品としてのスイツチはハンダ付の可能な材料
を使用する必要があり、また、接点は耐蝕性、耐
摩耗性等を備えた材料であることが必要で、これ
らを低価格で満足できる材料を見つけることは困
難である。
Generally speaking, there are two ways to reduce costs: using fewer materials and using lower-priced materials, but switches as electronic components must be made of materials that can be soldered, and contacts must be made of corrosion-resistant materials. The material needs to have properties such as durability and abrasion resistance, and it is difficult to find a material that can satisfy these properties at a low price.

本発明は、我々が入手出来るもののうちでは低
価格の材料である鉄又はステンレス又はパーマロ
イ等を使用して接点の表面のみを金で形成したの
で、接点の性能を損わずに低価格の接点を形成し
得るものである。
The present invention uses low-cost materials such as iron, stainless steel, or permalloy that are available to us, and only the surface of the contact is made of gold, so that it can be used as a low-cost contact without impairing the performance of the contact. can be formed.

以下、その実施例を図面について詳細に説明す
ると、第2図aのように、先ず接点端子母材1に
鉄板、或いはステンレス板、又はパーマロイ板等
を使用し、半田付可能にするために下地ニツケル
メツキしてその上、スズ(錫)メツキ2を施した
接点条Lに以下のような加工を行うことによつて
形成される。
Hereinafter, the embodiment will be described in detail with reference to the drawings. As shown in FIG. It is formed by performing the following processing on a contact strip L which is nickel-plated and then tin-plated 2.

第2図aの如く、モリブデン等より成る毛細管
3に線径が20〜50μ程度の金の極細線4を挿入す
る。管3の孔の径は金線4の線径より5μ程度大
なるもので、ピンセツトなどで金線4を引張れば
抜ける状態にある。次に、トーチランプによる水
素炎9をあてることにより金線4を溶かして第2
図bの如く金の微粒5を作る。該微粒5の大きさ
は炎の大きさで調整することができる。次に、毛
細管3を下方に押し下げ、スズメツキ2表面に圧
着させた状態を同図cに示す。毛細管3は200℃
に熱せられており、母材1は約300℃に熱せられ
ている。スズの融点は232℃であるからスズは融
けて金の微粒5と融合して合金となり、その組成
は300℃において金35%、スズ65%の比率になる。
管3を上方に引上げると第2図dの如く金線4は
そのまま残り、管3だけが上方に持ち上げられ
る。
As shown in FIG. 2a, an ultrafine gold wire 4 having a wire diameter of about 20 to 50 μm is inserted into a capillary tube 3 made of molybdenum or the like. The diameter of the hole in the tube 3 is about 5 microns larger than the wire diameter of the gold wire 4, and it can be pulled out by pulling the gold wire 4 with tweezers or the like. Next, the gold wire 4 is melted by applying a hydrogen flame 9 from a torch lamp to the second
Fine gold particles 5 are made as shown in Figure b. The size of the fine particles 5 can be adjusted by adjusting the size of the flame. Next, the state in which the capillary tube 3 is pushed down and pressed onto the surface of the sparrow 2 is shown in FIG. Capillary tube 3 is 200℃
The base material 1 is heated to about 300°C. Since the melting point of tin is 232°C, tin melts and fuses with fine gold particles 5 to form an alloy, whose composition becomes 35% gold and 65% tin at 300°C.
When the tube 3 is pulled upward, the gold wire 4 remains as it is, and only the tube 3 is lifted upward, as shown in FIG. 2d.

なお、この際スズが酸化すると融点が上昇し、
合金化しなくなるので、これを防止するために引
上げ中は窒素ガスを流入させながら行う。また、
管3を引上げる途中で金線4を管3で締め付けて
クランプすると、微粒5の頂部で金線4が切断さ
れて第2図eのようになる。次に、第2図fのよ
うに毛細管3を除去して、代りにプレス6を設定
し、プレス6を例えば200℃位に加熱しておいて、
金微粒5をホツトプレス加工して平坦にし、更に
同図gに示すような形状の両押プレス7,7によ
り上下より挾持してプレスし、母材1のスズメツ
キ面4上に盛上つた金接点部8を形成させる。
At this time, when tin oxidizes, the melting point increases,
In order to prevent this from forming into an alloy, nitrogen gas is introduced during pulling. Also,
When the gold wire 4 is tightened and clamped by the tube 3 while the tube 3 is being pulled up, the gold wire 4 is cut at the top of the fine grains 5, resulting in a shape as shown in FIG. 2e. Next, as shown in FIG. 2 f, remove the capillary tube 3, set a press 6 in its place, and heat the press 6 to about 200°C,
The fine gold particles 5 are hot-pressed to make them flat, and then pressed between the upper and lower sides with double presses 7, 7 shaped as shown in FIG. Part 8 is formed.

本発明は叙上の構成より成るもので、金の材料
の無駄がなく、100%有効に使用され、その使用
量も微量であり、従来のめによる接点と比較し
て接点部のコストは1/4〜1/6で済む。また、接点
端子の母材は特殊な材料を選ぶ必要がなく、鉄な
どの低価格の材料でよい。更に製造工程が簡単
で、前後の工程、即ち、接点端子のプレス加工と
接点部のプレス加工と連続して加工できる等、接
点端子の製造上多大の利点がある。
The present invention has the above-mentioned structure, and there is no waste of gold material, it is used 100% effectively, the amount used is very small, and the cost of the contact part is 10% compared to the conventional eye contact. /4 to 1/6 is enough. Further, there is no need to select a special material for the base material of the contact terminal, and a low-cost material such as iron may be used. Furthermore, the manufacturing process is simple, and there are many advantages in manufacturing contact terminals, such as the fact that the previous and subsequent steps, that is, press working of the contact terminal and press working of the contact part, can be performed continuously.

さらに、鉄等の母材にニツケルメツキ皮膜を形
成させたことにより、金の母材への拡散を防止す
ると共にスズ−金合金との接着強度も大きくする
という効果がある。
Furthermore, by forming a nickel plating film on a base material such as iron, there is an effect of preventing the diffusion of gold into the base material and increasing the adhesive strength with the tin-gold alloy.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の接点端子の平面図、第2図a〜
gは本発明による接点端子の製造工程の説明図で
ある。 1…母材、2…スズメツキ皮膜、4…金の極細
線、5…金微粒、6,7…プレス、8…金接点
部、L…接点条。
Figure 1 is a plan view of a conventional contact terminal, Figure 2 a~
g is an explanatory diagram of the manufacturing process of the contact terminal according to the present invention. DESCRIPTION OF SYMBOLS 1... Base material, 2... Tin plating film, 4... Gold ultrafine wire, 5... Gold fine particles, 6, 7... Press, 8... Gold contact part, L... Contact strip.

Claims (1)

【特許請求の範囲】[Claims] 1 鉄等の金属の母材にニツケルの下地メツキを
介してスズメツキ皮膜を施して接点条を形成した
後この接点条を加熱し、金の極細線を加熱して形
成した金の微粒を接点条の表面に圧着させてスズ
メツキ皮膜と金の微粒とを合金化せしめ、次いで
この合金部をプレス加工により圧延して接点部を
形成することを特徴とする接点の製造方法。
1 After forming a contact strip by applying a tin plating film to a metal base material such as iron through a nickel base plating, this contact strip is heated, and fine gold particles formed by heating an ultra-fine gold wire are formed into a contact strip. A method for manufacturing a contact, comprising: alloying the tin plating film with fine gold particles by pressure bonding to the surface of the metal, and then rolling this alloy part by press working to form a contact part.
JP17428580A 1980-12-10 1980-12-10 Contact and method of producing same Granted JPS5798923A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17428580A JPS5798923A (en) 1980-12-10 1980-12-10 Contact and method of producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17428580A JPS5798923A (en) 1980-12-10 1980-12-10 Contact and method of producing same

Publications (2)

Publication Number Publication Date
JPS5798923A JPS5798923A (en) 1982-06-19
JPH0122692B2 true JPH0122692B2 (en) 1989-04-27

Family

ID=15975991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17428580A Granted JPS5798923A (en) 1980-12-10 1980-12-10 Contact and method of producing same

Country Status (1)

Country Link
JP (1) JPS5798923A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6438936A (en) * 1987-08-05 1989-02-09 Omron Tateisi Electronics Co Contact piece
JP2696443B2 (en) * 1991-08-12 1998-01-14 株式会社高岳製作所 Roller contact

Also Published As

Publication number Publication date
JPS5798923A (en) 1982-06-19

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