JPS6116681Y2 - - Google Patents
Info
- Publication number
- JPS6116681Y2 JPS6116681Y2 JP1980120403U JP12040380U JPS6116681Y2 JP S6116681 Y2 JPS6116681 Y2 JP S6116681Y2 JP 1980120403 U JP1980120403 U JP 1980120403U JP 12040380 U JP12040380 U JP 12040380U JP S6116681 Y2 JPS6116681 Y2 JP S6116681Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- cathode lead
- layer
- solid electrolytic
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 24
- 239000003990 capacitor Substances 0.000 claims description 15
- 239000007787 solid Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 239000010407 anodic oxide Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 9
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Non-Insulated Conductors (AREA)
Description
【考案の詳細な説明】
本考案は、固体電解コンデンサに関し、特に、
陰極端子の接続を改良した固体電解コンデンサに
関するものである。[Detailed description of the invention] The present invention relates to a solid electrolytic capacitor, in particular,
This invention relates to a solid electrolytic capacitor with improved cathode terminal connection.
一般に、固体電解コンデンサは、タンタルやア
ルミ、ニオブ等の弁作用金属にあらかじめ陽極リ
ード線を設けておき、この金属に陽極酸化皮膜を
生成し、次に二酸化マンガン層、カーボン層及び
導電層を形成し、金属ケースや樹脂により外装を
施している。そして陰極リード線は導電層に接続
されて引き出されるが、例えば、タンタル固体電
解コンデンサの場合、カーボン層の上に導電性塗
料を塗布して硬化させた後に、陰極リード線を半
田付けしている。 Generally, in solid electrolytic capacitors, an anode lead wire is provided in advance on a valve metal such as tantalum, aluminum, or niobium, an anodized film is formed on this metal, and then a manganese dioxide layer, a carbon layer, and a conductive layer are formed. The exterior is made of a metal case or resin. The cathode lead wire is then connected to the conductive layer and drawn out. For example, in the case of tantalum solid electrolytic capacitors, a conductive paint is applied on the carbon layer and cured, and then the cathode lead wire is soldered. .
ところで、コンデンサを印刷配線板に半田付け
により取り付ける場合、半田の溶融温度よりも30
〜40℃高い熱が陰極リード線に加わる。そのため
に、コンデンサに陰極リード線を接続している半
田が溶融し、半田が外装の外に吹き出したり、あ
るいは陰極リード線が導電層と分離しオープン状
態の不良等を生ずる欠点があつた。 By the way, when attaching a capacitor to a printed wiring board by soldering, the melting temperature of the solder is 30
~40°C higher heat is applied to the cathode lead. As a result, the solder connecting the cathode lead wire to the capacitor may melt, causing the solder to blow out of the casing, or the cathode lead wire may separate from the conductive layer, resulting in defects such as an open state.
従来、これ等の欠点を改良するために、半田の
代りに、合成樹脂に銅や銀等の金属粒子を混在さ
せ半田よりも融点の高い導電性接着剤を用いて陰
極リード線を接続したコンデンサも用いられてい
た。しかしながら、通常、リード線には印刷配線
板等に半田付けが容易なように半田や錫等の金属
メツキが溶けて、陰極リード線を被つている導電
性接着剤との間に空隙が生じ、接続が悪くなり、
等価直列抵抗が増加してtanδが増す欠点があ
る。 Conventionally, in order to improve these drawbacks, capacitors have been developed in which instead of solder, the cathode lead wire is connected using a conductive adhesive that is made by mixing metal particles such as copper or silver with synthetic resin and has a higher melting point than solder. was also used. However, usually, the solder or metal plating such as tin melts on the lead wire so that it can be easily soldered to a printed wiring board, etc., and a gap is created between the lead wire and the conductive adhesive covering the cathode lead wire. The connection is bad,
There is a drawback that the equivalent series resistance increases and tan δ increases.
本考案は、以上の欠点を改良しtanδ特性が向
上し信頼性の高い固体電解コンデンサの提供を目
的とするものである。 The object of the present invention is to provide a solid electrolytic capacitor that improves the above-mentioned drawbacks, has improved tanδ characteristics, and is highly reliable.
本考案は、上記の目的を達成するために、陽極
リード線を設けた弁作用を有する金属の表面に陽
極酸化皮膜を生成し、その上に半導体層、カーボ
ン層及び導電層を形成し、該導電層に陰極リード
線を導電性接着剤により接続した固体電解コンデ
ンサにおいて、陰極リード線の少なくとも導電性
接着剤と接触する部分に半田付け可能で半田より
も融点の高い金属メツキが直接設けられているこ
とを特徴とする固体電解コンデンサを提供するも
のである。 In order to achieve the above object, the present invention generates an anodized film on the surface of a valve metal provided with an anode lead wire, forms a semiconductor layer, a carbon layer and a conductive layer thereon. In a solid electrolytic capacitor in which a cathode lead wire is connected to a conductive layer with a conductive adhesive, a metal plating that can be soldered and has a melting point higher than that of solder is directly provided on at least the part of the cathode lead wire that comes into contact with the conductive adhesive. The present invention provides a solid electrolytic capacitor characterized by:
以下、本考案の実施例を図面に基づいて説明す
る。 Hereinafter, embodiments of the present invention will be described based on the drawings.
１はタンタル粉末の焼結体であり、陽極リード
線２が引き出されている。陽極リード線２には陽
極端子３が溶接等により接続されている。焼結体
１には酸化処理により陽極酸化皮膜４が生成され
ている。陽極酸化皮膜４には半導体層として二酸
化マンガン層５、カーボン層６及び導電層として
銀導電塗料層７が形成されている。この銀導電塗
料層７に陰極リード線８が銀ベースト等の導電性
接着剤９により接続されている。陰極リード線８
には、特に、ニツケルや金等の半田付け可能で半
田よりも融点の高い金属のメツキ１０が設けられ
ている。１１は外装であり、エポキシ樹脂等が用
いられている。 1 is a sintered body of tantalum powder, from which an anode lead wire 2 is drawn out. An anode terminal 3 is connected to the anode lead wire 2 by welding or the like. An anodic oxide film 4 is formed on the sintered body 1 by oxidation treatment. The anodic oxide film 4 is formed with a manganese dioxide layer 5 and a carbon layer 6 as semiconductor layers, and a silver conductive paint layer 7 as a conductive layer. A cathode lead wire 8 is connected to this silver conductive paint layer 7 with a conductive adhesive 9 such as silver base. Cathode lead wire 8
In particular, a plating 10 of a metal such as nickel or gold that can be soldered and has a higher melting point than solder is provided. Reference numeral 11 is an exterior casing made of epoxy resin or the like.
従つて、コンデンサ印刷配線板に半田付けする
場合、陰極リード線８が加熱されても、メツキ１
０は溶けることなく、導電性接着剤９との間に空
隙が生ずることなく接続が確実に保持されtanδ
も改良される。 Therefore, when soldering to a capacitor printed wiring board, even if the cathode lead wire 8 is heated, the plating 1
0 does not melt and the connection with the conductive adhesive 9 is securely maintained without creating a gap, tan δ
will also be improved.
定格16V10μＦのタンタル固体電解コンデンサ
について、陰極リード線にニツケルメツキを設け
た本考案の実施例と、半田メツキを設けた従来例
について、半田付けの時間を１分とし、半田付け
の温度を変えた場合のtanδの変化を調べたとこ
ろ第２図に示す通りの結果が得られた。すなわ
ち、半田付けの温度が高くなるほど、本考案実施
例Ａによる方が従来例Ｂに比べてtanδが改良さ
れており、例えば、290℃においては前者は後者
のほぼ1/2であり、差が顕著である。 Regarding tantalum solid electrolytic capacitors with a rating of 16 V and 10 μF, the example of the present invention in which the cathode lead wire is provided with nickel plating and the conventional example in which solder plating is provided, when the soldering time is 1 minute and the soldering temperature is changed. When the change in tan δ was investigated, the results shown in Figure 2 were obtained. In other words, as the soldering temperature increases, tan δ is improved in Example A of the present invention compared to Conventional Example B. For example, at 290°C, the former is approximately 1/2 of the latter, and the difference is small. Remarkable.
以上の通り、本考案によれば、半田付けの際に
陰極リード線が接続不良となるのを防止できるの
で、tanδが改良される信頼性の高い固体電解コ
ンデンサを得ることが出来る。 As described above, according to the present invention, it is possible to prevent poor connection of the cathode lead wire during soldering, and thus it is possible to obtain a highly reliable solid electrolytic capacitor with improved tan δ.
第１図は本考案の実施例の断面図、第２図は半
田付けの温度に対するtanδのグラフを示す。
１……焼結体、２……陽極リード線、３……陽
極端子、４……陽極酸化皮膜、５……二酸化マン
ガン層、６……カーボン層、７……銀導電性塗料
層、８……陽極リード線、９……導電性接着剤、
１０……メツキ、１１……外装。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a graph of tan δ versus soldering temperature. DESCRIPTION OF SYMBOLS 1... Sintered body, 2... Anode lead wire, 3... Anode terminal, 4... Anodized film, 5... Manganese dioxide layer, 6... Carbon layer, 7... Silver conductive paint layer, 8 ... Anode lead wire, 9 ... Conductive adhesive,
10...Metsuki, 11...Exterior.
Claims (1)
面に陽極酸化皮膜を生成し、その上に半導体層、
カーボン層及び導電層を形成し、該導電層に陰極
リード線を導電性接着剤により接続した固体電解
コンデンサにおいて、陰極リード線の少なくとも
導電性接着剤と接続する部分に半田付け可能で半
田よりも融点の高い金属メツキが直接設けられて
いることを特徴とする固体電解コンデンサ。 An anodic oxide film is formed on the surface of a metal with a valve action provided with an anode lead wire, and a semiconductor layer is formed on the surface of the metal.
In a solid electrolytic capacitor in which a carbon layer and a conductive layer are formed, and a cathode lead wire is connected to the conductive layer with a conductive adhesive, at least the portion of the cathode lead wire that is connected to the conductive adhesive can be soldered, and it is easier than soldering. A solid electrolytic capacitor characterized by having a metal plating with a high melting point directly attached to it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980120403U JPS6116681Y2 (en) | 1980-08-27 | 1980-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980120403U JPS6116681Y2 (en) | 1980-08-27 | 1980-08-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5744538U JPS5744538U (en) | 1982-03-11 |
| JPS6116681Y2 true JPS6116681Y2 (en) | 1986-05-22 |
Family
ID=29481069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980120403U Expired JPS6116681Y2 (en) | 1980-08-27 | 1980-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6116681Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4841968U (en) * | 1971-09-21 | 1973-05-29 |
-
1980
- 1980-08-27 JP JP1980120403U patent/JPS6116681Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4841968U (en) * | 1971-09-21 | 1973-05-29 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5744538U (en) | 1982-03-11 |
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