JPS5852836A - 複合集積回路 - Google Patents

複合集積回路

Info

Publication number
JPS5852836A
JPS5852836A JP56150942A JP15094281A JPS5852836A JP S5852836 A JPS5852836 A JP S5852836A JP 56150942 A JP56150942 A JP 56150942A JP 15094281 A JP15094281 A JP 15094281A JP S5852836 A JPS5852836 A JP S5852836A
Authority
JP
Japan
Prior art keywords
aluminum
electrodes
chips
semiconductor element
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56150942A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0131689B2 (show.php
Inventor
Kimio Yoshioka
吉岡　公男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Fuji Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd, Fuji Electric Manufacturing Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP56150942A priority Critical patent/JPS5852836A/ja
Publication of JPS5852836A publication Critical patent/JPS5852836A/ja
Publication of JPH0131689B2 publication Critical patent/JPH0131689B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/075—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H10W72/07533—
    • H10W72/381—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5434—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/884—
    • H10W72/923—
    • H10W72/952—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP56150942A 1981-09-24 1981-09-24 複合集積回路 Granted JPS5852836A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56150942A JPS5852836A (ja) 1981-09-24 1981-09-24 複合集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56150942A JPS5852836A (ja) 1981-09-24 1981-09-24 複合集積回路

Publications (2)

Publication Number Publication Date
JPS5852836A true JPS5852836A (ja) 1983-03-29
JPH0131689B2 JPH0131689B2 (show.php) 1989-06-27

Family

ID=15507779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56150942A Granted JPS5852836A (ja) 1981-09-24 1981-09-24 複合集積回路

Country Status (1)

Country Link
JP (1) JPS5852836A (show.php)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58151039A (ja) * 1982-03-04 1983-09-08 Denki Kagaku Kogyo Kk 混成集積回路基板
JPS6045089A (ja) * 1983-08-22 1985-03-11 松下電器産業株式会社 回路配線用基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5317747A (en) * 1976-08-02 1978-02-18 Sasaki Mooru Kk Natural light inlet tube
JPS5396667A (en) * 1977-02-04 1978-08-24 Hitachi Ltd Wire bonding method
JPS5396668A (en) * 1977-02-04 1978-08-24 Hitachi Ltd Wire bonding method and auxiliary plate for the same
JPS55158654A (en) * 1979-05-30 1980-12-10 Aichi Steel Works Ltd Manufacture of heat sink in aluminum
JPS5610941A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Semiconductor device
JPS5623763A (en) * 1979-08-04 1981-03-06 Aichi Steel Works Ltd Aluminum heat sink and manufacture of semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5317747A (en) * 1976-08-02 1978-02-18 Sasaki Mooru Kk Natural light inlet tube
JPS5396667A (en) * 1977-02-04 1978-08-24 Hitachi Ltd Wire bonding method
JPS5396668A (en) * 1977-02-04 1978-08-24 Hitachi Ltd Wire bonding method and auxiliary plate for the same
JPS55158654A (en) * 1979-05-30 1980-12-10 Aichi Steel Works Ltd Manufacture of heat sink in aluminum
JPS5610941A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Semiconductor device
JPS5623763A (en) * 1979-08-04 1981-03-06 Aichi Steel Works Ltd Aluminum heat sink and manufacture of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58151039A (ja) * 1982-03-04 1983-09-08 Denki Kagaku Kogyo Kk 混成集積回路基板
JPS6045089A (ja) * 1983-08-22 1985-03-11 松下電器産業株式会社 回路配線用基板

Also Published As

Publication number Publication date
JPH0131689B2 (show.php) 1989-06-27

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