JPS584943A - Low impedance probe card - Google Patents
Low impedance probe cardInfo
- Publication number
- JPS584943A JPS584943A JP10291781A JP10291781A JPS584943A JP S584943 A JPS584943 A JP S584943A JP 10291781 A JP10291781 A JP 10291781A JP 10291781 A JP10291781 A JP 10291781A JP S584943 A JPS584943 A JP S584943A
- Authority
- JP
- Japan
- Prior art keywords
- steel plate
- plate
- thick steel
- low impedance
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
本発−は半導体のｆロービング装置におけるプローブカ
ードに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a probe card in a semiconductor f-roving device.
従来、ＬＳＩのｆａ−ビンダテスト装置にはウェハ上の
端子とテスト装置とを電気的に結ぶために５０〜２００
μｍの銅は〈ｋよりて配線されたシリンド板すなわちグ
ローブカードが用いられて゛いる。Conventionally, LSI fa-binder test equipment uses 50 to 200 wires to electrically connect the terminals on the wafer and the test equipment.
For the μm copper, a cylinder plate or a globe card is used.
第１図は従来のグローブカードを示す、ｆラスニーキシ
板２’０１１ｉ、ＴＭに帯状銅はくＳがＷ＆叶られ、さ
らに前記鋼は（Ｓ４Ｄ一端には、ｆａ−ｆｔｙ４ｍハン
ダ付け６されている。前記プリン）［０銅はく部５には
、７”Ｅｌ−ｆ−ンがハンダ付は等０ＩＩＩ談によって
取）付けられている。前記１９ント板の銅はくＯ厚みは
、ｉｏ−ｇｏｏ−であるので、超高速Ｌ８Ｉ Ｏ場合に
は前記鋼は（ｋよりて配線され先部分のイン♂−〆ンス
４１に１１抗値が一定値に影響してしまい、高速での動
作時に発生するノイズ等の影響で精度の＾い安定した欄
定を行なうヒとが困難であり九。FIG. 1 shows a conventional glove card. A band-shaped copper foil S is attached to the f-lass knee board 2'011i and TM, and the steel (S4D) is soldered 6 to one end of the card. A 7" El-f-on is attached to the copper foil part 5 by soldering. The thickness of the copper foil of the 19-ant board is io-goo. - Therefore, in the case of ultra-high speed L8I O, the above steel is wired from (k), and the 11 resistance value will affect the constant value of the input 41 at the tip, which will occur during high-speed operation. It is difficult to perform accurate and stable field determination due to the influence of noise, etc.
本発明は前記問題点を解決するものであ夛、その目的は
超高速ＬＢＩＣ）ｆローツーテストを高精度によ多安定
に行なうことを可能にしえ低インビーＩンスグローブカ
ードを提供することにある。本発明の特徴とするところ
は、半導体のブロービングテスト装置において厚鋼板な
プリント板面のグローブビン儒に設け、骸厚板よルグロ
ーブ♂ンを溶接し九低インビーメンスｆａ−プカードに
ある。The present invention has been made to solve the above-mentioned problems, and its purpose is to provide a low-impedance glove card that allows ultra-high-speed LBIC low-to-low testing to be performed with high accuracy and stability. be. The feature of the present invention is that in a semiconductor blowing test device, a globe bottle is provided on a printed board surface of a thick steel plate, and a base metal plate is welded to a nine-low in-beam fa-p card.
以下本発明の実施例を用いて詳細な説明を行なう。第２
図は本発明の実施例である。帯状の厚鋼板１をガラスエ
ポキシ板２よシ成る前記厚鋼板ｌと同じ形をした前記プ
リント板面のりすくした部分にうめ込んである。ま九厚
銅板ｌの一端にはグローブビン４がハンメ付け６されて
いる。第２図の本発明の実施例と篇１図の従来のグロー
ブカードを比べると明らかな様ｋ、同じ金属すなわち銅
で形成された導体部の厚さが異なっている。A detailed explanation of the present invention will be given below using examples. Second
The figure shows an embodiment of the invention. A belt-shaped thick steel plate 1 is embedded in a thin part of the surface of the printed board, which is made of glass epoxy plate 2 and has the same shape as the thick steel plate 1. A glove bin 4 is attached with a hammer 6 to one end of the nine-thick copper plate l. When comparing the embodiment of the present invention shown in FIG. 2 with the conventional glove card shown in FIG. 1, it is clear that the thickness of the conductor portions made of the same metal, that is, copper, is different.
すなわち本発明の実施例の導体の単位長あた）Ｏ抵抗値
は従来のグローブカードの導体の単位長あたシの抵抗値
の１／２０ Ｋなりている。たとえば従来のグローブカ
ードＯ導体の単位長あた〕の抵抗値は３．３１ａＱであ
シ、本発明の実施例では０．１７鴫であった。尚、前記
従来例の銅はくの厚みは・・５０μｍ、本発明の厚鋼板
の厚みは０．８■である。That is, the resistance value per unit length of the conductor of the embodiment of the present invention is 1/20 K of the resistance value per unit length of the conductor of the conventional glove card. For example, the resistance value per unit length of the conventional glove card O conductor was 3.31aQ, and in the embodiment of the present invention, it was 0.17aQ. The thickness of the copper foil in the conventional example is 50 μm, and the thickness of the thick steel plate of the present invention is 0.8 μm.
第３図は本発明の他の実施例である。ガラスエポキシ板
２＃の上ＷＪＫ厚銅１［７を設け、ｆａ−デピンに接続
する場合には＠プロッタ８を介して接続する。前記鋼ブ
ロック８は厚鋼板７と一体構造から成る場合もある。FIG. 3 shows another embodiment of the invention. A WJK thick copper 1[7 is provided on the glass epoxy plate 2#, and when connecting to the fa-de pin, it is connected via @plotter 8. The steel block 8 may be integrally constructed with the thick steel plate 7 in some cases.
本発明は、電源線、接地、大電流が流れる端子に用いる
と効果がある。たとえば、第４図は本発明の応用例であ
る。グローブカード９は電源十ＶＫ接続されグローブピ
ン１０はウェハ１ｔｔｃｌ＋１続されている。またグロ
ーブカード１２は、グランドＧＫ接続され、！ローブｆ
ｙ１３は、ウェハ１１に接続されて−る。The present invention is effective when used for power lines, grounding, and terminals through which large currents flow. For example, FIG. 4 is an example of an application of the present invention. The globe card 9 is connected to the power supply VK, and the globe pin 10 is connected to the wafer 1ttcl+1. Also, the glove card 12 is connected to the ground GK! robe f
y13 is connected to the wafer 11.
第４図に示し九本発明の応用例の勢価回路を第５図に示
す、電源＋Ｖとウェハ１１の間には抵抗ｒｖが入シ、グ
ランドＧとウェハ１１の間には抵抗ｖ０が入る。すなわ
ち、ウェハに流れる電流な！とするならば抵抗ｒｅ Ｋ
発生する逆起電圧Ｖはｖ＝ｒ０・ｌ
となシ、たとえばグランドとウェハの他の端子の電圧関
係を求めた場合、前記逆起電圧Ｖがすべて誤差となる。The circuit shown in FIG. 4 is an application example of the present invention, and FIG. 5 shows a resistor rv between the power supply +V and the wafer 11, and a resistor v0 between the ground G and the wafer 11. . In other words, the current flowing through the wafer! If so, the resistance re K
The generated back electromotive voltage V is v=r0·l. For example, when the voltage relationship between the ground and other terminals of the wafer is determined, the back electromotive voltage V is entirely an error.
しかしながら従来のグローブカードの抵抗値と比べた場
合、抵抗値は約ｌ／２０となっている丸め、測定等の誤
差に影譬を与えることははとんどない。また超高速ＬＳ
Ｉの場合には抵抗ｒｖ１ｒａＫ直列にインダクタンスが
等制約に入る。（第５図には図示せず）前記インダクタ
ンスはＬＳＩへＯ応答特性に前記抵抗の場合と同様な影
替を与えるが、本発明のグローブカードでは厚鋼板を導
体として−るから前記インダクタンスの値は従来のグロ
ーブカードのインダクタンスの値と比べ非常に小さく測
定誤差にはあられれない。However, when compared with the resistance value of a conventional glove card, the resistance value is about 1/20, which hardly affects errors such as rounding and measurement. Also super high speed LS
In the case of I, the inductance is constrained to be equal in series with the resistor rv1raK. (Not shown in FIG. 5) The inductance affects the O response characteristics of the LSI in the same way as the resistor, but since the glove card of the present invention uses a thick steel plate as a conductor, the value of the inductance is very small compared to the inductance value of conventional glove cards and is not subject to measurement errors.
本発明の実施例で社すべてプリント板面に設は九厚銅板
によってのみ配線したが、従来のプリント板の配線用銅
はく上に前記銅はくと＃′！ば同じ形をした厚鋼板を設
けても同じ効果が得られる。In the embodiment of the present invention, wiring was only done using a 9-thick copper plate on the surface of the printed board, but the above-mentioned copper foil and #'! For example, the same effect can be obtained by providing a thick steel plate with the same shape.
以上、本発明の実施例を用いて本発明の詳細な説明を行
なった。本発明は従来困難とされた超高速Ｌ８Ｉのブロ
ービングの高精度測定を厚鋼板を設けることＫよって可
能ならしめるものである。The present invention has been described above in detail using examples of the present invention. The present invention makes it possible to perform high-accuracy measurement of ultra-high speed L8I blowing, which has been considered difficult in the past, by providing a thick steel plate.
第１図は従来のプローブカードを示す図、第２゜３図は
本発明の実施例を示す図、第４図は本発明の応用例を示
す図、第５図は等価回路を示す図である。
２・・・プリント板、３・・・厚鋼板、８・・・−ブロ
ック。Figure 1 is a diagram showing a conventional probe card, Figures 2-3 are diagrams showing an embodiment of the present invention, Figure 4 is a diagram showing an application example of the present invention, and Figure 5 is a diagram showing an equivalent circuit. be. 2...Printed board, 3...Thick steel plate, 8...-block.
Claims (3)
鋼板をｌリント板爾のグローブビン儒ＫＢｆｆ、諌厚鋼
板よ〕ｆロープビンを溶接した低インピーダンスグロー
ブカード。(1) A low impedance glove card made by welding a thick steel plate to a thick steel plate rope bottle in a semiconductor probing test device.
おいて、厚鋼板をｌリン１１１１ＭＯｆａ−ツビン側と
反対面に設けさらｆｌｃｆりント板内に銅ブロックを諌
厚銅板と接触するように設妙、前記鋼ｆｃＩツタの厚鋼
板と接触した藺と反対側ｔ）＠ｆｓツクｌｃｆロープ♂
ンをＩＩＩＩＩＮシえ低インピーダンスグローブカード
。(2) In the f low binder test equipment, a thick steel plate was installed on the opposite side to the flcf lint plate, and a copper block was placed inside the flcf print plate so as to be in contact with the thick copper plate. The opposite side of the steel fcI vine that came into contact with the thick steel plate t) @fstsuk lcf rope ♂
Low impedance glove card.
リント板面のりすくした所にうめ込んだ特許請求ｏｍＩ
Ｉ第１項記載の低インピーダンスグローブカード。(3) Patent claim omI in which a strip-shaped O-thick steel plate is embedded in a rough spot on the surface of a printed board having the same shape as the thick steel plate.
I. The low impedance glove card described in item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10291781A JPS584943A (en) | 1981-06-30 | 1981-06-30 | Low impedance probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10291781A JPS584943A (en) | 1981-06-30 | 1981-06-30 | Low impedance probe card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS584943A true JPS584943A (en) | 1983-01-12 |
| JPH0416943B2 JPH0416943B2 (en) | 1992-03-25 |
Family
ID=14340203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10291781A Granted JPS584943A (en) | 1981-06-30 | 1981-06-30 | Low impedance probe card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS584943A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008122403A (en) * | 2000-12-04 | 2008-05-29 | Cascade Microtech Inc | Method for assembly of wafer probe |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5216177A (en) * | 1975-07-30 | 1977-02-07 | Hitachi Ltd | Probe card |
| JPS59762U (en) * | 1982-06-22 | 1984-01-06 | 佐藤製罐株式会社 | airtight container |
-
1981
- 1981-06-30 JP JP10291781A patent/JPS584943A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5216177A (en) * | 1975-07-30 | 1977-02-07 | Hitachi Ltd | Probe card |
| JPS59762U (en) * | 1982-06-22 | 1984-01-06 | 佐藤製罐株式会社 | airtight container |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008122403A (en) * | 2000-12-04 | 2008-05-29 | Cascade Microtech Inc | Method for assembly of wafer probe |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0416943B2 (en) | 1992-03-25 |
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